EN 61189-5-4:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-4: Allgemeine Prüfverfahren für Materialien und Baugruppen - Lotlegierungen und Lotdraht mit und ohne Flussmittel für bestückte Leiterplatten

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-4: Méthodes d'essai générales pour les matériaux et les assemblages - Alliages à braser et brasages solides fluxés et non fluxés pour les assemblages de cartes imprimées

L'IEC 61189-5-4:2015 est un catalogue de méthodes d'essai représentant les méthodologies et modes opératoires pouvant être appliqués aux assemblages de cartes imprimées. La présente partie de l'IEC 61189 traite des méthodes d'essai pour les alliages à braser et les brasages solides fluxés et non fluxés sur la base des IEC 61189-5 et IEC 61189-6 existantes. De plus, elle inclut les méthodes d'essai pour les alliages à braser et les brasages solides fluxés et non fluxés pour le brasage sans plomb.

Preskusne metode za električne materiale, povezovalne strukture in sestave - 5-4. del: Preskusne metode za sestave plošč tiskanih vezij: spajkalne zlitine in stržensko polnjene ali nepolnjene žice

Ta del standarda IEC 61189 je katalog preskusnih metod, ki predstavljajo metodologije in postopke, ki jih je mogoče uporabiti za preskušanje sestavov plošč tiskanih vezij. Ta del standarda IEC 61189 je posvečen preskusnim metodam za spajkalne zlitine in stržensko polnjene ali nepolnjene žice, ki temeljijo na standardih IEC 61189-5 in IEC 61189-6. Zajema tudi preskusne metode za spajkalne zlitine in stržensko polnjene ali nepolnjene žice ter spajkanje brez svinca.

General Information

• Status: Published
• Publication Date: 12-Mar-2015
• Withdrawal Date: 11-Feb-2018
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 13-Mar-2015
• Completion Date: 13-Mar-2015
• Ref Project: SIST EN 61189-5-4:2015 - Test methods for electrical materials, interconnection structures and assemblies -- Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2015
3UHVNXVQHPHWRGH]DHOHNWULþQHPDWHULDOHSRYH]RYDOQHVWUXNWXUHLQVHVWDYH
GHO3UHVNXVQHPHWRGH]DVHVWDYHSORãþWLVNDQLKYH]LMVSDMNDOQH]OLWLQHLQ
VWUåHQVNRSROQMHQHDOLQHSROQMHQHåLFH
Test methods for electrical materials, interconnection structures and assemblies -- Part 5
-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed
solid wire
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen - Teil 5-4: Allgemeine Prüfverfahren für Materialien und Baugruppen -
Lotlegierungen und Lotdraht mit und ohne Flussmittel für bestückte Leiterplatten
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 5-4: Méthodes d'essai générales pour
les matériaux et les assemblages - Alliages à braser et brasages solides fluxés et non
fluxés pour les assemblages de cartes imprimées
Ta slovenski standard je istoveten z: EN 61189-5-4:2015
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 61189-5-4

NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2015
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 5-4: General
test methods for materials and assemblies - Solder alloys and
fluxed and non-fluxed solid wire for printed board assemblies
(IEC 61189-5-4:2015)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen -
ensembles - Partie 5-4: Méthodes d'essai générales pour Teil 5-4: Allgemeine Prüfverfahren für Materialien und
les matériaux et les assemblages - Alliages à braser et Baugruppen - Lotlegierungen und Lotdraht mit und ohne
brasages solides fluxés et non fluxés pour les assemblages Flussmittel für bestückte Leiterplatten
de cartes imprimées (IEC 61189-5-4:2015)
(IEC 61189-5-4:2015)
This European Standard was approved by CENELEC on 2015-02-12. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61189-5-4:2015 E
Foreword
The text of document 91/1212/FDIS, future edition 1 of IEC 61189-5-4, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61189-5-4:2015.

The following dates are fixed:
(dop) 2015-11-12
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2018-02-12
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 61189-5-4:2015 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20.
IEC 61189-1 NOTE Harmonized as EN 61189-1.
IEC 61189-2:2006 NOTE Harmonized as EN 61189-2:2006 (not modified).
IEC 61189-3:2007 NOTE Harmonized as EN 61189-3:2008 (not modified).
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1.
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2.
IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7.
IEC 62137:2004 NOTE Harmonized as EN 62137:2004 (not modified).
ISO 9001 NOTE Harmonized as EN ISO 9001.
ISO 9455-2 NOTE Harmonized as EN ISO 9455-2.

- 3 - EN 61189-5-4:2015
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu
Publication Year Title EN/HD Year
IEC 61189-5 -  Test methods for electrical materials, EN 61189-5 -
interconnection structures
and assemblies -
Part 5: Test methods for printed board
assemblies
IEC 61189-6 -  Test methods for electrical materials, EN 61189-6 -
interconnection structures
and assemblies -
Part 6: Test methods for materials used in
manufacturing electronic assemblies
IEC 61190-1-3 -  Attachment materials for electronic EN 61190-1-3 -
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed
solid solders for electronic soldering
applications
IEC 61189-5-4 ®
Edition 1.0 2015-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 5-4: General test methods for materials and assemblies – Solder alloys and

fluxed and non-fluxed solid wire for printed board assemblies

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 5-4: Méthodes d'essai générales pour les matériaux et les assemblages –

Alliages à braser et brasages solides fluxés et non fluxés pour les assemblages

de cartes imprimées
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-1999-7

– 2 – IEC 61189-5-4:2015 © IEC 2015
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Accuracy, precision and resolution . 7
3.1 General . 7
3.2 Accuracy . 8
3.3 Precision . 8
3.4 Resolution . 9
3.5 Report. 9
3.6 Student’s t distribution . 9
3.7 Suggested uncertainty limits . 10
4 C: Chemical test methods . 11
4.1 Test 5-4C01: Determination of the percentage of flux on/in flux-coated
and/or flux-cored solder . 11
4.1.1 Object . 11
4.1.2 Test specimen . 11
4.1.3 Apparatus . 11
4.1.4 Test procedure . 11
4.2 Test 5-4CXX . 12
5 X: Miscellaneous test methods . 12
5.1 Test 5-4X01: Spread test, extracted cored wires or preforms . 12
5.1.1 Object . 12
5.1.2 Method A . 12
5.1.3 Method B . 13
5.1.4 Additional information . 15
5.2 Test 5-4X02: Spitting test of flux-cored wire solder . 15
5.2.1 Object . 15
5.2.2 Method A . 15
5.2.3 Method B . 16
5.2.4 Additional information . 19
5.3 Test 5-4X03: Solder pool test . 20
5.3.1 Object . 20
5.3.2 Test specimen . 20
5.3.3 Apparatus and reagents . 20
5.3.4 Test procedure . 20
5.3.5 Evaluation . 21
5.3.6 Additional information . 21
Bibliography . 22

Figure 1 – Test apparatus for spitting test . 16
Figure 2 – Test apparatus for spitting test, method B . 18
Figure 3 – Collecting paper with printed concentric circles with 1 cm pitch . 19

IEC 61189-5-4:2015 © IEC 2015 – 3 –
Table 1 – Student’s t distribution . 10
Table 2 – Typical spread areas defined in mm . 13
Table 3 – Example of a test report – Spitting of flux-cored wire . 19

– 4 – IEC 61189-5-4:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS,
PRINTED BOARDS AND OTHER INTERCONNECTION
STRUCTURES AND ASSEMBLIES –
Part 5-4: General test methods for materials and assemblies –
Solder alloys and fluxed and non-fluxed solid wire for
printed board assemblies
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of I
...