EN IEC 63251:2023
(Main)Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
Prüfverfahren für mechanische Eigenschaften von elektrisch-optischen Leiterplatten unter Wärmebeanspruchung
Méthode d’essai des propriétés mécaniques des circuits optoélectriques souples sous contrainte thermique
L'IEC 63251:2023 définit les méthodes d’essai d’endurance thermique relatives à l’évaluation de la fiabilité des circuits optoélectriques souples. Le présent document a pour objet de tenir compte des caractéristiques thermiques uniformes exigées par le circuit optoélectrique souple dans les environnements à haute température comme les automobiles. Le présent document spécifie notamment une méthode d’essai pour déceler l’apparition d’un changement de couleur, d’une déformation et d’une déstratification des circuits optoélectriques souples sous contrainte thermique.
Metoda preskušanja mehanskih lastnosti toplotno obremenjenih zvijavih optoelektričnih tiskanih vezij
Ta mednarodni standard določa metode preskušanja toplotne vzdržljivosti za oceno zanesljivosti zvijavih optoelektričnih tiskanih vezij. Cilj tega standarda je določiti enotne toplotne značilnosti, ki jih zahteva zvijavo optoelektrično tiskano vezje v okoljih z visoko temperaturo, npr. v avtomobilih. Predvsem ta standard določa preskusno metodo za preučevanje pojava barvne menjave, deformacije in delaminacije zvijavih optoelektričnih tiskanih vezij pod toplotno obremenitvijo.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-februar-2024
Metoda preskušanja mehanskih lastnosti toplotno obremenjenih zvijavih
optoelektričnih tiskanih vezij
Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under
Thermal Stress
Prüfverfahren für mechanische Eigenschaften von elektrisch-optischen Leiterplatten
unter Wärmebeanspruchung
Méthode d’essai des propriétés mécaniques des circuits opto-électriques souples sous
contrainte thermique
Ta slovenski standard je istoveten z: EN IEC 63251:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 63251
NORME EUROPÉENNE
EUROPÄISCHE NORM December 2023
ICS 31.180
English Version
Test method for mechanical properties of flexible opto-electric
circuit boards under thermal stress
(IEC 63251:2023)
Méthode d'essai des propriétés mécaniques des circuits Prüfverfahren für mechanische Eigenschaften von
optoélectriques souples sous contrainte thermique elektrisch-optischen Leiterplatten unter
(IEC 63251:2023) Wärmebeanspruchung
(IEC 63251:2023)
This European Standard was approved by CENELEC on 2023-12-06. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 63251:2023 E
European foreword
The text of document 91/1898/FDIS, future edition 1 of IEC 63251, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 63251:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-09-06
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-12-06
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 63251:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 60793-2 (series) NOTE Approved as EN 60793-2 (series)
IEC 62496-3-1 NOTE Approved as EN 62496-3-1
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-2 - Environmental testing - Part 2-2: Tests - EN 60068-2-2 -
Test B: Dry heat
IEC 60068-2-14 - Environmental testing - Part 2-14: Tests - EN IEC 60068-2-14 -
Test N: Change of temperature
IEC 60068-2-78 - Environmental testing - Part 2-78: Tests - EN 60068-2-78 -
Test Cab: Damp heat, steady state
IEC 63251 ®
Edition 1.0 2023-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test method for mechanical properties of flexible opto-electric circuit boards
under thermal stress
Méthode d’essai des propriétés mécaniques des circuits optoélectriques
souples sous contrainte thermique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-7750-8
– 2 – IEC 63251:2023 © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test method . 7
4.1 General . 7
4.2 Test sample . 7
4.3 Test process . 8
4.3.1 General description of the test . 8
4.3.2 Preconditioning . 9
4.3.3 Test . 9
4.3.4 Recovery . 9
4.3.5 Final measurements . 10
5 Report . 10
Annex A (informative) Example of optical bending loss test results with general glass
optic fibres . 11
Annex B (informative) Example of preparation method of O-E circuit test samples
(optic fibre type) . 12
B.1 General . 12
B.2 Manufacturing processes of the FOECBs with optic fibres (POF, GOF) . 12
B.3 Manufacturing processes of the FOECBs with optical polymer waveguides . 13
B.4 Characteristics of the optic fibres . 14
Annex C (informative) Example of reflow assembly simulation test results . 15
C.1 General . 15
C.2 Results of reflow assembly simulation test for a LED chip mounted FOECB
with GOF . 15
C.3 Results of reflow assembly simulation test for a transparent FOECB with
GOF for display applications . 16
C.4 Results of reflow assembly simulation test for a polyimide (PI) based FOECB
with GOF . 16
C.5 Results of reflow assembly simulation test for a polymer-based FOECB . 17
Annex D (informative) Example of thermal shock endurance test results . 18
D.1 General . 18
D.2 Results of thermal shock endurance test for an FOECB with GOF . 18
Annex E (informative) Example of humidity storage test results . 19
E.1 General . 19
E.2 Results of humidity storage test for an FOECB with GOF . 19
E.3 Results of humidity storage test for an FOECB with POF . 19
Bibliography . 21
Figure 1 – Schematic diagram of FOECB (top view) . 7
Figure 2 – Schematic diagrams of the FOECB test samples of fibre type . 8
Figure 3 – Schematic diagram of the FOECB test samples of fibre type . 8
Figure A.1 – Bending loss test setup . 11
Figure A.2 – Optical loss versus bending diameter . 11
Figure B.1 – Arrayed structure of the FOECB test samples formed on one sheet . 12
IEC 63251:2023 © IEC 2023 – 3 –
Figure B.2 – Fabrication of the optic circuits with optic fibres . 13
Figure B.3 – Fabrication of the optic circuits with optic polymer waveguide via the
photo-etching method . 13
Figure C.1 – LED chip mounted FOECB. 15
Figure C.2 – Appearance of a LED chip mounted FOECB after the reflow assembly
simulation test . 15
Figure C.3 – Appearance of a transparent FOECB with GOFs after the reflow assembly
simulation test . 16
Figure C.4 – Appearance of a PI based FOECB with GOF after the reflow assembly
simulation test . 16
Figure C.5 – Appearance of a polymer-based FOECB after the reflow assembly
simulation test . 17
Figure D.1 – Appearance of an FOECB with GOF after the thermal shock test . 18
Figure E.1 – Appearance of an FOECB with GOF after the humidity storage test . 19
Figure E.2 – Appearance of an FOECB with POF after the humidity storage test . 20
Table 1 – Thermal endurance test class for FOECB . 9
– 4 – IEC 63251:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHOD FOR MECHANICAL PROPERTIES OF FLEXIBLE
OPTO-ELECTRIC CIRCUIT BOARDS UNDER THERMAL STRESS
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardiz
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