EN IEC 61189-2-720:2024
(Main)Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
Prüfverfahren für elektrische Materialien, Leiterplatten und andere Verbindungsstrukturen und -Baugruppen - Teil 2-720: Erkennung von Fehlern in Verbindungsstrukturen durch Messung der Kapazität
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-720 : Détection de défauts présents dans les structures d'interconnexion par mesurage de la capacité
L’IEC 61189-2-720:2024 fournit une méthode pour évaluer les caractéristiques spécifiques des circuits imprimés en mesurant la capacité entre les traces conductrices et un plan de masse. Elle peut être utilisée pour établir une comparaison qualitative d'un spécimen d'essai par rapport à un circuit de référence. Cette méthode n'est pas destinée aux mesures quantitatives ni à l'évaluation de la conformité à une spécification.
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-720. del: Odkrivanje napak v povezovalnih strukturah z merjenjem kapacitivnosti
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
oSIST prEN IEC 61189-2-720:2023
01-april-2023
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-720. del: Odkrivanje napak v povezovalnih strukturah z
merjenjem kapacitivnosti
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-720: Detection of defects in interconnection structures by
measurement of capacitance
Ta slovenski standard je istoveten z: prEN IEC 61189-2-720:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
oSIST prEN IEC 61189-2-720:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
oSIST prEN IEC 61189-2-720:2023
---------------------- Page: 2 ----------------------
oSIST prEN IEC 61189-2-720:2023
91/1832/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61189-2-720 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2023-02-10 2023-05-05
SUPERSEDES DOCUMENTS:
91/1786/CD, 91/1829/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Masahide Okamoto
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if
any, in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft
for Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of
• any relevant patent rights of which they are aware and to provide supporting documentation,
• any relevant “in some countries” clauses to be included should this proposal proceed. Recipients are
reminded that the enquiry stage is the final stage for submitting "in some countries" clauses. See
AC/22/2007.
TITLE:
Test methods for electrical materials, printed board and other interconnection structures and
assemblies – Part 2-720: Detection of defects in interconnection structures by measurement of
capacitance
PROPOSED STABILITY DATE: 2028
NOTE FROM TC/SC OFFICERS:
Copyright © 2022 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to
download this electronic file, to make a copy and to print out the content for the sole purpose of preparing National
Committee positions. You may not copy or "mirror" the file or printed version of the document, or any part of it,
for any other purpose without permission in writing from IEC.
---------------------- Page: 3 ----------------------
oSIST prEN IEC 61189-2-720:2023
IEC CDV 61189-2-720 IEC 2022 -2- 91/1832/CDV
1 CONTENTS
2
3 FOREWORD . 3
4 1 Scope . 5
5 2 Normative references . 5
6 3 Terms and Definitions . 5
7 4 Objective . 5
8 5 Test specimen . 6
9 6 Test method . 6
10 7. Test procedures . 7
11 8. Report . 7
12 Annex A . 9
13 A.1 Test schematic . 9
14 A.2 Test result . 9
15
16 Figure 1 – The capacitance difference depending on the defect of mouse bite . 5
17 Figure 2– Test specimen .
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.