EN 61191-2:2013

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: - IPC-A-610 on workmanship has been included as a normative reference; - some of the terminology used in the document has been updated; - references to IEC standards have been corrected; - the use of lead-free solder paste and plating are addressed.

Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Oberflächenmontage

Ensembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface

La CEI 61191-2:2013 donne les exigences relatives aux connexions brasées pour montage en surface. Les exigences se rapportent aux ensembles intégrant uniquement le montage en surface ou aux portions d'ensembles pour montage en surface incluant d'autres technologies associées (par exemple montage par trous traversants, montage à puce, à borne, etc.). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - inclusion du document IPC-A-610 sur la qualité d'exécution en tant que référence normative; - mise à jour d'une partie de la terminologie utilisée dans le présent document; - correction des références aux normes CEI; - prise en compte de l'utilisation de crème de brasage et de métallisation sans plomb.

Sestavi plošč tiskanih vezij - 2. del: Področna specifikacija - Zahteve za površinsko nameščene spajkane sestave

Ta del standarda IEC 61191 določa zahteve za površinsko nameščene spajkane sestave. Zahteve se nanašajo na sestave, ki so v celoti nameščeni na površino, ali na dele sestavov, nameščene na površino, ki vključujejo druge povezane tehnologije (npr. nameščanje skozi luknjice, nameščanje čipov, nameščanje priključkov itd.).

General Information

• Status: Withdrawn
• Publication Date: 03-Oct-2013
• Withdrawal Date: 09-Jul-2016
• ICS: 31.190 - Electronic component assemblies
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 13-Oct-2020
• Completion Date: 13-Oct-2020
• Ref Project: SIST EN 61191-2:2014 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Relations

• Replaces: EN 61191-2:1998 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
• Effective Date: 29-Jan-2023
• Replaced By: EN 61191-2:2017 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
• Effective Date: 07-Jun-2022

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61191-2:2014
01-januar-2014
1DGRPHãþD
SIST EN 61191-2:2001
6HVWDYLSORãþWLVNDQLKYH]LMGHO3RGURþQDVSHFLILNDFLMD=DKWHYH]DSRYUãLQVNR
QDPHãþHQHVSDMNDQHVHVWDYH
Printed board assemblies - Part 2: Sectional specification - Requirements for surface
mount soldered assemblies
Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an
gelötete Baugruppen in Oberflächenmontage
Ensembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences
relatives à l'assemblage par brasage pour montage en surface
Ta slovenski standard je istoveten z: EN 61191-2:2013
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 61191-2:2014 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61191-2:2014

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SIST EN 61191-2:2014

EUROPEAN STANDARD
EN 61191-2

NORME EUROPÉENNE
October 2013
EUROPÄISCHE NORM

ICS 31.190; 31.240 Supersedes EN 61191-2:1998


English version


Printed board assemblies -
Part 2: Sectional specification -
Requirements for surface mount soldered assemblies
(IEC 61191-2:2013)


Ensembles de cartes imprimées -  Elektronikaufbauten auf Leiterplatten -
Partie 2: Spécification intermédiaire - Teil 2: Rahmenspezifikation -
Exigences relatives à l'assemblage par Anforderungen an gelötete Baugruppen in
brasage pour montage en surface Oberflächenmontage
(CEI 61191-2:2013) (IEC 61191-2:2013)





This European Standard was approved by CENELEC on 2013-07-10. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61191-2:2013 E

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SIST EN 61191-2:2014
EN 61191-2:2013 - 2 -

Foreword
The text of document 91/1091/FDIS, future edition 2 of IEC 61191-2, prepared by IEC/TC 91
"Electronics assembly technology " was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61191-2:2013.

The following dates are fixed:
(dop) 2014-04-10
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement

(dow) 2016-07-10
• latest date by which the national
standards conflicting with the
document have to be withdrawn

This document supersedes EN 61191-2:1998.

EN 61191-2:2013 includes the following significant technical changes with respect to
EN 61191-2:1998:
– IPC-A-610 on workmanship has been included as a normative reference;
– some of the terminology used in the document has been updated;
– references to EN standards have been corrected;
– the use of lead-free solder paste and plating are addressed.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 61191-2:2013 was approved by CENELEC as a European
Standard without any modification.

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SIST EN 61191-2:2014
- 3 - EN 61191-2:2013
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for it
...