EN 61191-2:1998

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).

Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Oberflächenmontage

Ensembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface

Etablit des exigences relatives aux connexions brasées pour montage en surface. Les exigences se rapportent aux ensembles intégrant uniquement le montage en surface ou aux portions d'ensembles pour montage en surface incluant d'autres technologies associées (par exemple montage par trous traversants, montage à puce, à borne, etc.).

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

General Information

• Status: Withdrawn
• Publication Date: 27-Oct-1998
• Withdrawal Date: 30-Jun-2001
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 10-Jul-2016
• Completion Date: 10-Jul-2016
• Ref Project: SIST EN 61191-2:2001 - Printed board assemblies -- Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Relations

• Replaced By: EN 61191-2:2013 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
• Effective Date: 29-Jan-2023

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assembliesElektronikaufbauten auf Leiterplatten -- Teil 2: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in OberflächenmontageEnsembles de cartes imprimées -- Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surfacePrinted board assemblies -- Part 2: Sectional specification - Requirements for surface mount soldered assemblies31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:EN 61191-2:1998SIST EN 61191-2:2001en01-marec-2001SIST EN 6119
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