IEC 60068-2-54:2006
(Main)Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: - the addition of lead free solder alloy (see Clause 7, Materials); - reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); - modification to the test requirement for progress of wetting (see Clause 9).
Essais d'environnement - Partie 2-54: Essais - Essai Ta: Essais de la soudabilité des composants électroniques à l'aide de la méthode de la balance de mouillage
La CEI 60068-2-54:2006 décrit l'essai Ta qui consiste en la méthode de la balance de mouillage de bain de soudure applicable qui permet de déterminer la soudabilité des terminaisons de composants de toute forme. Elle est particulièrement adaptée aux essais de référence et aux composants qui ne peuvent pas être soumis à essai quantitativement par d'autres méthodes. Pour des dispositifs de montage en surface (SMD), il convient d'appliquer la CEI 60068-2-69 si cela est approprié. La présente norme fournit les procédures normalisées pour les alliages à braser contenant du plomb (Pb) et pour les alliages à braser sans plomb. Cette seconde édition annule et remplace la première édition publiée en 1985 et constitue une révision technique. Les principales modifications techniques apportées par rapport à l'édition précédente concernent:
- l'addition de l'alliage à braser sans plomb (voir l'Article 7, Matériaux);
- l'inversion des courbes force-temps pour se conformer à la CEI 60068-2-69 (voir la Figure 2 et la Figure B.1);
- la modification de l'exigence d'essai pour la progression du mouillage (voir l'Article 9).
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INTERNATIONAL IEC
STANDARD 60068-2-54
Second edition
2006-04
Environmental testing –
Part 2-54:
Tests – Test Ta: Solderability testing of
electronic components by the wetting
balance method
Reference number
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INTERNATIONAL IEC
STANDARD 60068-2-54
Second edition
2006-04
Environmental testing –
Part 2-54:
Tests – Test Ta: Solderability testing of
electronic components by the wetting
balance method
IEC 2006 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale R
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
– 2 – 60068-2-54 IEC:2006(E)
CONTENTS
FOREWORD.3
Scope.5
2 Normative references.5
3 Terms and definitions .5
4 General description of the test .5
5 Description of the test apparatus.6
5.1 Test system.6
5.2 Solder bath.6
6 Preconditioning.6
6.1 Preparation of specimens .6
6.2 Ageing.6
7 Materials .7
7.1 Solder .7
7.2 Flux.7
8 Procedure.7
8.1 Test temperature .7
8.2 Fluxing .7
8.3 Flux drying.8
8.4 Test.8
9 Presentation of results .8
9.1 Form of chart-recorder trace .8
9.2 Points of significance.9
9.3 Reference wetting force .9
9.4 Test requirements.10
10 Information to be given in the relevant specification.10
Annex A (normative) Equipment specification .11
Annex B (informative) Guide to the use of the wetting balance for solderability testing .12
Bibliography .18
Figure 1 – Test arrangement .6
Figure 2 – Wetting conditions .9
Figure B.1 – Representative force-time curves .15
Table 1 – Time sequence of the test.8
60068-2-54 IEC:2006(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
ENVIRONMENTAL TESTING –
Part 2-54: Tests – Test Ta: Solderability testing
of electronic components by the wetting balance method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60068-2-54 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition, published in 1985 and constitutes a
technical revision.
The major technical changes with regard to the previous edition concern:
– the addition of lead free solder alloy (see Clause 7, Materials);
– reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1);
– modification to the test requirement for progress of wetting (see Clause 9).
– 4 – 60068-2-54 IEC:2006(E)
The text of this standard is based on the following documents:
FDIS Report on voting
91/576/FDIS 91/587/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 60068 consists of the following parts, under the general title Environmental testing:
Part 1: General and guidance
Part 2: Tests
Part 3: Supporting documentation and guidance
Part 4: Information for specification writers - Test summaries
Part 5: Guide to drafting of test methods
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
60068-2-54 IEC:2006(E) – 5 –
ENVIRONMENTAL TESTING –
Part 2-54: Tests – Test Ta: Solderability testing
of electronic components by the wetting balance method
1 Scope
This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any
shape of component terminations to determine the solderability. It is especially suitable for
reference testing and for components that cannot be quantitatively tested by other methods.
For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable.
This standard provides the standard procedures for solder alloys containing lead (Pb) and for
lead-free solder alloys.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-20:1979, Environmental testing – Part 2: Tests – Test T: Soldering
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
3 Terms and definitions
For the purposes of this document, the terms and definitions, as defined in IEC 60068-1 and
IEC 60068-2-20, apply.
4 General description of the test
The specimen is suspended from a sensitive balance (typically a spring system) and immersed
edgewise to a set depth in a bath of molten solder at a controlled temperature. The resultant of
the vertical forces of buoyancy and surface tension acting upon the immersed specimen is
detected by a transducer and converted into a signal which is continuously recorded as a
function of time on a high-speed chart recorder. The trace may be compared with that derived
from a perfectly wetted specimen of the same nature and dimensions.
Two modes of testing exist:
– The stationary mode, intended to study the solderability of a particular place on the
specimen. It is this mode which is standardized in this standard.
– The scanning mode, intended to study the homogeneity of the solderability of an extended
region of the surface of the specimen. The standardization of this mode is still under
consideration.
– 6 – 60068-2-54 IEC:2006(E)
5 Description of the test apparatus
5.1 Test system
A diagram of an arrangement suita
...
IEC 60068-2-54 ®
Edition 2.0 2006-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-54: Tests – Test Ta: Solderability testing of electronic components by
the wetting balance method
Essais d’environnement –
Partie 2-54: Essais – Essai Ta: Essais de la soudabilité des composants
électroniques à l'aide de la méthode de la balance de mouillage
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
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IEC 60068-2-54 ®
Edition 2.0 2006-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-54: Tests – Test Ta: Solderability testing of electronic components by
the wetting balance method
Essais d’environnement –
Partie 2-54: Essais – Essai Ta: Essais de la soudabilité des composants
électroniques à l'aide de la méthode de la balance de mouillage
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX R
ICS 19.040; 31.020 ISBN 978-2-8322-0879-3
– 2 – 60068-2-54 IEC:2006
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references. 5
3 Terms and definitions . 5
4 General description of the test . 5
5 Description of the test apparatus . 6
5.1 Test system . 6
5.2 Solder bath . 6
6 Preconditioning . 6
6.1 Preparation of specimens . 6
6.2 Ageing . 6
7 Materials . 7
7.1 Solder . 7
7.2 Flux . 7
8 Procedure . 7
8.1 Test temperature . 7
8.2 Fluxing . 7
8.3 Flux drying . 8
8.4 Test . 8
9 Presentation of results . 8
9.1 Form of chart-recorder trace . 8
9.2 Points of significance . 9
9.3 Reference wetting force . 9
9.4 Test requirements. 10
10 Information to be given in the relevant specification . 10
Annex A (normative) Equipment specification . 11
Annex B (informative) Guide to the use of the wetting balance for solderability testing . 12
Bibliography . 18
Figure 1 – Test arrangement . 6
Figure 2 – Wetting conditions . 9
Figure B.1 – Representative force-time curves . 15
Table 1 – Time sequence of the test . 8
60068-2-54 IEC:2006 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
ENVIRONMENTAL TESTING –
Part 2-54: Tests – Test Ta: Solderability testing
of electronic components by the wetting balance method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60068-2-54 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition, published in 1985 and constitutes a
technical revision.
The major technical changes with regard to the previous edition concern:
– the addition of lead free solder alloy (see Clause 7, Materials);
– reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1);
– modification to the test requirement for progress of wetting (see Clause 9).
– 4 – 60068-2-54 IEC:2006
This bilingual version (2013-07) corresponds to the monolingual English version, published in
2006-04.
The text of this standard is based on the following documents:
FDIS Report on voting
91/576/FDIS 91/587/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 60068 consists of the following parts, under the general title Environmental testing:
Part 1: General and guidance
Part 2: Tests
Part 3: Supporting documentation and guidance
Part 4: Information for specification writers - Test summaries
Part 5: Guide to drafting of test methods
The committee has decided that the contents of this publication will remain unchanged until the
maintenance resul
...
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