IEC 60747-16-3:2002+AMD1:2009 CSV

Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

IEC 60747-16-3:2002+A1:2009 provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave frequency converters. This consolidated version consists of the first edition (2002) and its amendment 1 (2009). Therefore, no need to order amendment in addition to this publication.

Dispositifs à semiconducteurs - Partie 16-3: Circuits intégrés hyperfréquences - Convertisseurs de fréquence

La CEI 60747-16-3:2002+A1:2009 spécifie de nouvelles méthodes de mesure, la terminologie et des symboles littéraux, ainsi que des valeurs limites et des caractéristiques essentielles pour les convertisseurs d'hyperfréquences à circuit intégré.  Cette version consolidée comprend la première édition (2002) et son amendement 1 (2009). Il n'est donc pas nécessaire de commander l'amendement avec cette publication.

General Information

• Status: Published
• Publication Date: 27-Apr-2010
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 29.140.10 - Lamp caps and holders
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: SC 47E - Discrete semiconductor devices
• Current Stage: PPUB - Publication issued
• Start Date: 08-Nov-1995

Standards Content (Sample)

IEC 60747-16-3
®
Edition 1.1 2010-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-3: Microwave integrated circuits – Frequency converters

Dispositifs à semiconducteurs –
Partie 16-3: Circuits intégrés hyperfréquences – Convertisseurs de fréquence
IEC 60747-16-3:2002+A1:2009

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IEC 60747-16-3
®
Edition 1.1 2010-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-3: Microwave integrated circuits – Frequency converters

Dispositifs à semiconducteurs –
Partie 16-3: Circuits intégrés hyperfréquences – Convertisseurs de fréquence

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CN
CODE PRIX
ICS 31.080.99 ISBN 978-2-88910-282-2
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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– 2 – 60747-16-3 © IEC:2002+A1:2009
CONTENTS
FOREWORD.4
1 Scope.6
2 Normative references .6
3 Terms and definitions .7
4 Abbreviated terms .8
5 Essential ratings and characteristics.8
5.1 General .8
5.2 Application description .9
5.3 Specification of the function .10
5.4 Limiting values (absolute maximum rating system) .12
5.5 Operating conditions (within the specified operating temperature range) .14
5.6 Electrical characteristics.14
5.7 Mechanical and environmental ratings, characteristics and data.15
5.8 Additional information.15
6 Measuring methods .16
6.1 General .16
6.2 Conversion gain (G ) .17
c
6.3 Conversion gain flatness (ΔG ).19
c
6.4 LO/IF isolation (P /P ) .21
LO LO(IF)
6.5 LO/RF isolation (P /P ).22
LO LO(RF)
6.6 RF/IF isolation.24
6.7 Image rejection (P /P ).28
o o(im)
6.8 Sideband suppression (P /P ) .29
o o(U)
6.9 Output power (P ) .31
o
6.10 Output power at 1-dB conversion compression (P ) .32
o(1dB)
6.11 Noise figure (F) .33
6.12 Intermodulation distortion (P /P ) (P /P ) .35
1 n
n 1
6.13 Output power at the intercept point (for intermodulation products) (P ) .38
n(IP)
6.14 LO port return loss (L ) .39
ret(LO)
6.15 RF port return loss (L ) .40
ret(RF)
6.16 IF port return loss (L ).42
ret(IF)

Figure 1 – Electrical terminal symbols.11
Figure 2 – Circuit diagram for the measurement of conversion gain .17
Figure 3 – Circuit diagram for the measurement of the LO/IF isolation .21
Figure 4 – Circuit diagram for the measurement of the LO/RF isolation.23
Figure 5 – Circuit diagram for the measurement of the RF/IF isolation for type A .24
Figure 6 – Circuit diagram for the measurement of the RF/IF isolation for type B .26
Figure 7 – Circuit diagram for measurement of noise figure .33
Figure 8 – Circuit for the measurement of intermodulation distortion .36
Figure 9 – Circuit for the measurement of the LO port return loss .39
Figure 10 – Circuit for the measurement of the RF/IF port return loss .41

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60747-16-3 © IEC:2002+A1:2009 – 3 –
Table 1 – Function of terminals.11
Table 2 – Electrical limiting values .13
Table 3 – Electrical characteristics.15

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– 4 – 60747-16-3 © IEC:2002+A1:2009
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –

Part 16-3: Microwave integrated circuits –
Frequency converters



FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

This consolidated version of IEC 60747-16-3 consists of the first edition (2002)
[documents 47E/212/FDIS and 47E/219/RVD] and its amendment 1 (2009) [documents
47E/357/CDV and 47E/372/RVC]. It bears the edition number 1.1.
The technical content is therefore identical to the base edition and its amendment and
has been prepared for user convenience. A vertical line in the margin shows where the
base publication has been modified by amendment 1. Additions and deletions are
displayed in red, with deletions being struck through.

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60747-16-3 © IEC:2002+A1:2009 – 5 –
International Standard IEC 60747-16-3 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This bilingual version, published in 2010-03, corresponds to the English version.
The French version of this standard has not been voted upon.
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date,
the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

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– 6 – 60747-16-3 © IEC:2002+A1:2009
SEMICONDUCTOR DEVICES –

Part 16-3: Microwave integrated circuits –
Frequency converters



1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave frequency
converters.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60050-702:1992, International Electrotechnical Vocabulary – Chapter 702: Oscillations,
signals and related devices
IEC 60617-12, Graphical symbols for diagrams – Part 12: Binary logic elements
IEC 60617-13, Graphical symbols for diagrams – Part 13: Analogue elements
IEC 60747-1:1983, Semiconductor devices – Discrete devices and integrated circuits – Part 1:
General
IEC 60617, Graphical symbols for diagrams
IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60747-16-1:2001, Semiconductor devices – Part 16-1: Microwave integrated circuits –
Amplifiers
1
Amendment 1 (2007)
IEC 60748-2:1997, Semiconductor devices – Integrated circuits – Part 2: Digital integrated
circuits
IEC 60748-3, Semiconductor devices – Integrated circuits – Part 3: Analogue integrated circuits
IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated circuits
IEC 61340-5-1:2007, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena – General requirements
IEC/TR 61340-5-2:2007, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
———————
1
 There exists a consolidated edition 1.1 published in 2007, including the base publication (2001) and its
Amendment 1 (2007).

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60747-16-3 © IEC:2002+A1:2009 – 7 –
3 Terms and definitions
For the purpose of this part of IEC 60747, the following terms and definitions apply:
3.1
conversion gain, G
c
ratio of the desired converted output power to the input power
NOTE Usually, the conversion gain is expressed in decibels.
3.2
conversion gain flatness, ΔG
c
difference between the maximum and the minimum conversion gain for a specified input
power in a specified frequency range
3.3
LO/RF isolation, P /P
LO LO(RF)
ratio of the incident local power to the local leakage power at the RF port with the IF port
terminated in a specified impedance
3.4
LO/IF isolation, P /P
LO LO(IF)
ratio of the incident local power to the local leakage power at the IF port with the RF port
terminated in a specified impedance
3.5
RF/IF isolation, P /P
RF RF(IF)
ratio of the incident RF power to the RF feedthrough power at the IF port for a specified
local power
NOTE Usually, the RF/IF isolation is applied to the down-converter.
3.6
IF/RF isolation, P /P
IF IF(RF)
ratio of the incident IF power to the IF feedthrough power at the RF port for a specified
local power
NOTE Usually, the IF/RF isolation is applied to the up-converter.
3.7
/P
image rejection, P
o o(im)
ratio of the output power when the RF signal is applied, to the output power when the image
signal is applied
NOTE Usually, the image rejection is applied to the down-converter.
3.8
sideband suppression, P /P
o o(U)
ratio of the output power of the desired sideband to the output power of the undesired
sideband
NOTE Usually, the sideband suppression is applied to the up-converter.
3.9
LO port return loss, L
ret(LO)
ratio of the specified incident power at the LO port to the reflected power at the LO port, with
the RF port and the IF port terminated in each specified impedance

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3.10
RF port return loss, L
ret(RF)
ratio of the incident power at the RF port to the reflected power at the RF port for a specified
local power, with the IF port terminated in a specified impedance
3.11
IF port return loss, L
ret(IF)
ratio of the incident power at the IF port to the reflected power at the IF port for a specified
local power, with the RF port terminated in a specified impedance
3.12
output power, P
o
2
see IEC 60747-16-2, 3.3
3.13
output power at 1-dB conversion compression, P
o(1dB)
output power where the conversion gain decreases by 1 dB compared with the linear
conversion gain
3.14
noise figure, F
see IEC 60747-1 Chapter IV, 5.4.4 see 702-08-57 of IEC 60050-702
NOTE The term "noise figure" expresses "noise factor" in decibels.
3.15
intermodulation distortion, P /P P /P
1 n
n 1
ratio of the output power of the nth order component to the output power of the fundamental
component, at a specified input power see 3.7 of Amendment 1 of IEC 60747-16-1
3.16
output power at the intercept point (for intermodulation products), P
n(IP)
output power at the intersection between the extrapolated output powers of the fundamental
component and the nth order intermodulation components, when the extrapolation is carried
out in a diagram showing the output power of the components (in decibels) as a function of
the input power (in decibels)
4 Abbreviated terms
The abbreviations used in this part of IEC 60747 are as follows:
RF Radio Frequency;
IF Intermediate Frequency;
LO Local Oscillator.
5 Essential ratings and characteristics
5.1 General
This clause gives ratings and characteristics required for specifying integrated circuit
microwave frequency converters.
———————
2
IEC 60747-16-2:2001, Semiconductor devices – Part 16-2: Microwave integrated circuits – Frequency prescalers

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60747-16-3 © IEC:2002+A1:2009 – 9 –
5.1.1 Circuit identification and types
5.1.1.1 Designation and types
The identification of type (device name), the category of circuit and technology applied shall
be given.
Microwave frequency converters are divided into two categories:
– type A: down-converter;
– type B: up-converter.
5.1.1.2 General function description
A general description shall be made of the function performed by the integrated circuit
microwave frequency converters and the features for the application.
5.1.1.3 Manufacturing technology
The manufacturing technology, for example, semiconductor monolithic integrated circuit, thin
film integrated circuit, micro-assembly, shall be stated. This statement shall include details
of the semiconductor technologies such as Schottoky-barrier diode, MESFET, Si bipolar
transistor, HBT.
5.1.1.4 Package identification
The following shall be stated:
a) chip or packaged form;
b) IEC and/or national reference number of the outline drawing, or of drawing of non-standard
package including terminal numbering;
c) principal package material, for example, metal, ceramic, plastic;
d) for chip form: outlines, dimensions, pad sizes, contact material, and recommended contact
technologies.
5.1.1.5 Main application
The main application shall be stated if necessary. If the device has restrictive applications,
these too shall be stated here.
5.2 Application description
Information on the application of the integrated circuit and its relation to the associated
devices shall be given.
5.2.1 Conformance to system and/or interface information
It shall be stated whether the integrated circuit conforms to an application system and/or an
interface standard or recommendation.
Detailed information about application systems, equipment and circuits such as VSAT
systems, DBS receivers, microwave landing systems shall also be given.
5.2.2 Overall block diagram
A block diagram of the applied systems shall be given if necessary.

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5.2.3 Reference data
The most important properties required to permit comparison between derivative types shall
be given.
5.2.4 Electrical compatibility
It shall be stated whether the integrated circuit is electrically compatible with other particular
integrated circuits or families of integrated circuits, or whether special interfaces are required.
Details shall be given concerning the type of the input and output circuits, for example,
input/output impedances, d.c. block, open-drain.
Interchangeability with other devices, if any, shall be given.
5.2.5 Associated devices
If applicable, mention shall be made here of
– devices necessary for correct operation (list with type number, name, and function);
– peripheral devices with direct interfacing (list with type number, name, and function).
5.3 Specification of the function
5.3.1 Detailed block diagram − functional blocks
A detail block diagram or equivalent circuit information of the integrated circuit microwave
frequency converters shall be given. The block diagram shall be composed of the following:
a) functional blocks;
b) mutual interconnections among the functional blocks;
c) individual functional units within the functional blocks;
d) mutual interconnections among the individual functional blocks;
e) function of each external connection;
f) interdependence between the separate functional blocks.
The block diagram shall identify the function of each external connection, and, where no
ambiguity can arise, it can also show the terminal symbols and/or numbers. If the
encapsulation has metallic parts, any connection to them from external terminals shall be
indicated. The connections with any associated external electrical elements shall be stated,
where necessary.
For the purpose of providing additional information, the complete electrical circuit diagram can
be reproduced, though this will not necessarily involve giving indications of the function. Rules
governing such diagrams may be obtained from IEC 60617-12 or IEC 60617-13 IEC 60617.
5.3.2 Identification and function of terminals
All terminals shall be identified on the block diagram (supply terminals, input or output
terminals, input/output terminals).
The terminal functions 1) to 4) shall be indicated, as shown in table 1 below.

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60747-16-3 © IEC:2002+A1:2009 – 11 –
Table 1 – Function of terminals
1 2 3 4
Terminal Terminal
Terminal Function Input/output Type of input/
number symbol
designation identification output circuits



5.3.2.1 Function 1: Terminal designation
The terminal designation to indicate the terminal function shall be given. Supply terminals,
ground terminals, blank terminals (with abbreviation NC) and non-usable terminals (with
abbreviation NU) shall be distinguished.
5.3.2.2 Function 2: Function
A brief indication of the terminal function shall be given:
– each function of multi-role terminals, i.e. terminals having multiple functions;
– each function of the integrated circuit selected by mutual pin connections, or
programming and/or application of function selection data to the function selection pin
such as mode selection pin.
5.3.2.3 Function 3: Input/output identification
Input, output, input/output, and multiples of the input/output terminal shall be distinguished.
5.3.2.4 Function 4: Type of input/output circuits
The type of input and output circuits, for example, input/output impedances, with or without
d.c. block, etc., shall be distinguished.
5.3.2.5 Function 5: Type of ground
If the baseplate of the package is used as ground, this shall be stated.
EXAMPLE:
Supply voltage(s)
Integrated
Input(s) NC
circuit
microwave
frequency
NU Output(s)
converter
Ground
IEC  1072/02

Figure 1 – Electrical terminal symbols

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5.3.3 Function description
The function performed by the circuit shall be specified, including the following information:
− basic function;
− relation to external terminals;
− operation mode (e.g., set-up method, preference, etc.);
− interruption handling.
5.3.4 Family related characteristics
All family-specific functional descriptions shall be stated (with reference to IEC 60748-2,
IEC 60748-3 and IEC 60748-4).
If ratings, characteristics and function characteristics exist for the family, the relevant part of
IEC 60748 shall be used (for example, for microprocessors, see IEC 60748-2, chapter III,
section 3).
NOTE For each new device family, specific items shall be added to the relevant part of IEC 60748.
5.4 Limiting values (absolute maximum rating system)
The table giving these values shall specify the following:
− any interdependence of limiting conditions;
− if externally connected and/or attached elements, for example heatsinks, have an
influence on the values of the ratings, the ratings shall be prescribed for the integrated
circuit with the elements connected and/or attached;
− if limiting values are exceeded for transient overload, the permissible excess and their
durations shall be specified;
− where minimum and maximum values differ during programming of the device, this shall
be stated;
− all voltages referenced to a specified reference terminal (V , GND, etc.);
ss
− in satisfying the following clauses, if maximum and/or minimum values are quoted, the
manufacturer shall indicate whether he refers to the absolute magnitude or to the
algebraic value of the quantity;
− the ratings given shall cover the operation of the multi-function integrated circuit over the
specified range of operating temperatures. Where such ratings are temperature-
dependent, such dependence shall be indicated.

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60747-16-3 © IEC:2002+A1:2009 – 13 –
5.4.1 Electrical limiting values
Limiting values shall be specified as follows:
Table 2 – Electrical limiting
...