iTeh StandardsiTeh Standards
EURUSD
Your shopping cart is empty.
IEC

IEC 60115-2-10:2023

(Main)

Fixed resistors for use in electronic equipment - Part 2-10: Blank detail specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G

Fixed resistors for use in electronic equipment - Part 2-10: Blank detail specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G

IEC 60115-2-10:2023(E) is a detail specification which specifies the characteristics and ratings of low-power film resistors with leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards. This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures specified by IEC 60115-1:2020, Annex Q.
This first edition cancels and replaces IEC 60115-2-1:1982. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
it employs the product classification based on application requirements as defined in the generic specification IEC 60115‑1:2020;
it permits the specification of additional dimensional requirements concerning the eccentricity of termination wires and the coating extending onto wires;
it provides for a tabulated presentation of resistance ranges in relationship to the temperature coefficient and the tolerance;
it supports solderability testing for both traditional lead-bearing soldering and up-to-date lead-free soldering, as required;
it introduces a test for the specimens’ robustness to electrostatic discharge;
it introduces a test for the specimens’ resistance to solvents;
it introduces a test for the flammability of the specimens;
it employs consistent stability requirements grouped in stability classes;
it supports the provision of detailed visual acceptance criteria;
it includes the requirement for a visual examination of the primary and proximity packaging;
it provides the correlated test schedules for a qualification approval and for subsequent quality conformance inspections side by side;
it employs quality assessment procedures which meet the requirements of a zero-defect approach, which evades the use of historic AQL levels and the permission of non-conforming specimens in test groups;
it provides for the inclusion of specific visual acceptance criteria, to be applied in addition to those given in Annex B of the sectional specification IEC 60115-2:2023;
it provides for the optional coverage of 0 Ω resistors (jumpers) within the scope of the drafted detail specification;
furthermore, it employs a new document structure, for which a transition guidance is provided in Annex X.

General Information

Status
Published
Publication Date
14-Feb-2023
ICS
31.040.10 - Fixed resistors
Technical Committee
TC 40 - Capacitors and resistors for electronic equipment
Drafting Committee
MT 60115-2-1 - TC 40/MT 60115-2-1
Current Stage
PPUB - Publication issued
Start Date
20-Mar-2023
Completion Date
15-Feb-2023
Ref Project

Buy Standard

IEC 60115-2-10:2023 - Fixed resistors for use in electronic equipment - Part 2-10: Blank detail specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G Released:2/15/2023IEC 60115-2-10:2023 - Fixed resistors for use in electronic equipment - Part 2-10: Blank detail specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G Released:2/15/2023
PreviousNext
Standard
IEC 60115-2-10:2023 - Fixed resistors for use in electronic equipment - Part 2-10: Blank detail specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G Released:2/15/2023
English language
46 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (Sample)


IEC 60115-2-10 ®
Edition 1.0 2023-02
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –
Part 2-10: Blank detail specification: Low-power film resistors with leads for
through-hole assembly on circuit boards (THT), for general electronic
equipment, classification level G
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.
IEC Secretariat Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always have
committee, …). It also gives information on projects, replaced access to up to date content tailored to your needs.
and withdrawn publications.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc
If you wish to give us your feedback on this publication or need
further assistance, please contact the Customer Service
Centre: sales@iec.ch.
IEC 60115-2-10 ®
Edition 1.0 2023-02
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –
Part 2-10: Blank detail specification: Low-power film resistors with leads for
through-hole assembly on circuit boards (THT), for general electronic
equipment, classification level G
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.040.10 ISBN 978-2-8322-6465-2
– 2 – IEC 60115-2-10:2023 © IEC 2023
CONTENTS
FOREWORD . 5
0 Introduction to the template provided by this blank detail specification. 7
0.1 Scope of this blank detail specification . 7
0.2 Function of this blank detail specification . 7
0.3 Identification of the detail specification and the resistor . 8
1 Scope . 10
2 Normative references . 10
3 Terms and definitions . 11
4 Characteristics and ratings . 11
4.1 General . 11
4.2 Dimensions . 11
4.3 Ratings . 14
4.4 Resistance range and tolerance on resistance . 15
5 Tests and test severities . 16
5.1 General . 16
5.2 Resistance . 16
5.3 Temperature coefficient of resistance . 17
5.4 Temperature rise . 17
5.5 Endurance at the rated temperature 70 °C . 17
5.6 Endurance at a maximum temperature: UCT . 17
5.7 Short-term overload . 17
5.8 Electrostatic discharge (ESD) test . 18
5.9 Visual examination . 18
5.10 Gauging of dimensions . 18
5.11 Detail dimensions . 18
5.12 Robustness of terminations . 19
5.13 Vibration . 19
5.14 Rapid change of temperature . 19
5.15 Climatic sequence. 19
5.16 Damp heat, steady state . 19
5.17 Solderability, with lead-free solder . 20
5.18 Solderability, with SnPb solder . 20
5.19 Resistance to soldering heat . 20
5.20 Solvent resistance . 21
5.21 Insulation resistance . 21
5.22 Voltage proof . 21
5.23 Flammability . 21
6 Performance requirements. 21
6.1 General . 21
6.2 Limits for change of resistance at tests . 22
6.3 Temperature coefficient of resistance . 22
6.4 Temperature rise . 23
6.5 Visual examination . 23
6.5.1 General visual criteria . 23
6.5.2 Visual criteria after tests . 24
6.5.3 Visual criteria for packaging . 24

6.6 Solderability . 24
6.7 Insulation resistance . 24
6.8 Flammability . 25
7 Marking, packaging and ordering information . 25
7.1 Marking of the component . 25
7.2 Packaging . 25
7.3 Marking of the packaging . 25
7.4 Ordering information . 25
8 Additional information . 26
8.1 General . 26
8.2 Storage and transportation . 26
8.3 Substrate for assembly . 26
8.4 Soldering process . 26
8.5 Use of cleaning agents or solvents . 26
8.6 Coating or potting after assembly . 27
9 Quality assessment procedures . 27
9.1 General . 27
9.1.1 100 % test . 27
9.1.2 Certificate of conformity (CoC) . 27
9.1.3 Certified test records of released lots . 28
9.2 Qualification approval . 28
9.3 Maintenance of a qualification approval . 28
9.3.1 Quality conformance inspection . 28
9.3.2 Non-conforming specimen . 28
Annex A (normative) Symbols and abbreviated terms . 37
A.1 Symbols . 37
A.2 Abbreviated terms . 39
Annex B (normative) Reference for visual examination . 40
Annex C (normative) Zero Ohm resistors (jumpers). 41
C.1 General . 41
C.2 Characteristics and ratings . 41
C.3 Tests and test severities . 42
C.4 Performance requirements . 42
C.5 Marking, packaging and ordering information . 42
C.6 Additional information . 42
C.7 Quality assessment procedures . 42
C.7.1 Test schedule for qualification approval . 42
C.7.2 Test schedule for quality conformance inspection . 43
Annex X (informative) Cross-references to the prior revision of this specification . 44
Bibliography . 45

Figure 1 – Outline and dimensions . 12
Figure 2 – Lead eccentricity of the wire terminations . 13
Figure 3 – Length of excessive coating on the wire terminations . 13
Figure 4 – Derating curve . 15

Table 1 – Styles and dimensions. 12

– 4 – IEC 60115-2-10:2023 © IEC 2023
Table 2 – Climatic categories . 14
Table 3 – Ratings. 14
Table 4 – Temperature coefficients, tolerances
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.

This May Also Interest You

IEC
IEC 60115-4-10:2023(Main)
Fixed resistors for use in electronic equipment - Part 4-10: Blank detail specification: Power resistors with axial leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G

IEC 60115-4-10:2023(E) is applicable to the drafting of detail specifications for fixed power resistors with leads, classified to level G, which is defined in IEC 60115‑1:2020, 3.4 for general electronic equipment. It is a supplementary document to the sectional specification and contains requirements for style, layout and minimum contents of detail specifications.

  • Standard
    47 pages
    English language
    sale 15% off
IEC
IEC 60115-8:2023(Main)
Fixed resistors for use in electronic equipment - Part 8: Sectional specification: Fixed surface mount resistors

IEC 60115-8:2023 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. These resistors have metallized terminations and are primarily intended to be mounted directly onto a circuit board.
The object of this document is to specify preferred ratings and characteristics and to select from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor.
This edition includes the following significant technical changes with respect to the previous edition:
a) definitions of product technologies and product classification levels of the generic specification, IEC 60115-1:2020, have been adopted;
b) new style of transverse (RT) resistors has been added in 3.1.5 and 4.2.2 to cover resistors with wide terminals, which have become common in market;
c) recommended test boards in 5.2.2 have been revised to fit the demands from the market for higher rated dissipation in resistors;
d) test boards have been revised so that they can be set vertically instead of horizontally during specified tests to optimize the temperature rise stability, area and spacing inside the test chamber;
e) 'Periodic-pulse high-voltage overload test' of IEC 60115‑1:2020, 8.3 has been added to the default test method in 5.3.8, however, the legacy test 'periodic-pulse overload test' of IEC 60115‑1:2020, 8.4 is still maintained for historical products;
and more. Please see the foreword for the list of changes.

  • Standard
    214 pages
    English and French language
    sale 15% off
IEC
IEC 60115-2:2023(Main)
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT)

IEC 60115-2:2023(E) is applicable to fixed low-power film resistors with termination leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards.
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating. These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole technique.
The object of this document is to state preferred ratings and characteristics and to select from IEC 60115-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor.
This edition includes the following significant technical changes with respect to the previous edition:  
the definitions of product technologies and product classification levels of the generic specification, IEC 60115‑1:2020, have been adopted;
the preferred dimensions given in Table 1 have been reviewed, and the legacy style RA_0922 has been removed;
a basis for the optional specification of the lead eccentricity of axial leaded resistors has been amended in 4.2;
the 'period-pulse high-voltage overload test' of IEC 60115‑1:2020, 8.3 has been adopted as default test method in 5.3.8, thereby replacing the legacy test 'periodic-pulse overload test' of IEC 60115‑1:2020, 8.4;
the revised solderability test of IEC 60115‑1:2020, 11.1 has been adopted in 5.3.19 and 5.3.20;
the combined solvent resistance test of IEC 60115‑1:2020, 11.3 has been adopted in 5.3.22;
the 'endurance at room temperature test' of IEC 60115‑1:2020, 7.2 (prior IEC 60115 2:2014, Annex C) has been adopted as an optional test in 5.4.1;
the 'single-pulse high-voltage overload test' of IEC 60115 1:2020, 8.2, applied with the pulse shape 10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse shape 1,2/50 in 5.4.2;
climatic tests for 'operation at low temperature' of IEC 60115‑1:2020, 10.2, and for 'damp heat, steady state, accelerated' of IEC 60115‑1:2020, 10.5, have been adopted as optional tests in 5.4.4 and 5.4.5, respectively;
new guidance is provided in 6.2 on the presentation of stability requirements with their permissible absolute and relative deviations;
acceptance criteria for the visual examination have been added in 6.5 and in Annex B;
visual examination for the primary and proximity packaging has been added in 6.5.2 and in 7.2;
the periodical evaluation of termination platings has been added as a new topic of quality assessment in 9.8;
the revised test clause numbering of IEC 60115‑1:2020 has been applied;
a new Annex C has been added to summarize workmanship requirements for the assembly of leaded film resistors, e.g. as given in the prior IEC 61192 series of standards;
the informative Annex F (prior Annex B) on radial formed styles has been amended with details on a formed Z-bend style for surface-mount assembly.

  • Standard
    95 pages
    English language
    sale 15% off
IEC
IEC 60115-4:2022(Main)
Fixed resistors for use in electronic equipment - Part 4: Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis

IEC 60115-4:2022(E) relates to resistors having a rated dissipation typically greater than 1 W up to and including 1 000 W for use in electronic equipment. This document is applicable to fixed power resistors with a maximum surface temperature (MET) higher than the preferred upper category temperature (UCT) of 200 °C.
NOTE Heat sink resistors, i.e. resistors which in their operation depend on being mounted on a dedicated heat sink, owing to their special temperature conditions, are covered by a special sectional specification (under consideration at the time of publication).
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions), and product technology.
The object of this document is to define preferred ratings and characteristics and to select from IEC 60115-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor.
NOTE SMD resistors are covered by IEC 60115-8, regardless of their dissipation.
This edition includes the following significant technical changes with respect to the previous edition:  
the definitions of product technologies and product classification levels of the generic specification, IEC 60115-1:2020, have been adopted;
a basis for the optional specification of the lead eccentricity of axial leaded resistors has been amended in 4.2;
the 'period-pulse high-voltage overload test' of IEC 60115-1:2020, 8.3 has been adopted as default test method in 5.3.9, thereby replacing the legacy test 'periodic-pulse overload test of IEC 60115-1:2020, 8.4;
the revised solderability test of IEC 60115-1:2020, 11.1 has been adopted in 5.3.22 and 5.3.23;
the combined solvent resistance test of IEC 60115-1:2020, 11.3 has been adopted in 5.3.25;
the 'endurance at room temperature test' of IEC 60115-1:2020, 7.2 has been reworked and adopted in 5.3.5;
the 'single-pulse high-voltage overload test' of IEC 60115-1:2020, 8.2, applied with the pulse shape 10/700 in 5.3.8, is complemented with the optional alternative provided by the pulse shape 1,2/50 in 5.4.1.
climatic tests for 'operation at low temperature' of IEC 60115 1:2020, 10.2, and for 'damp heat, steady state, accelerated' of IEC 60115‑1:2020, 10.5, have been adopted as optional tests in 5.4.5. and 5.4.6, respectively;
inclusion of an optional flammability test as 5.4.8;
new guidance is provided in 6.2 on the presentation of stability requirements with their permissible absolute and relative deviations;
acceptance criteria for the visual inspection have been added in 6.5 and in Annex B;
visual inspection for the primary and proximity packaging has been added in 6.5.3 and in 7.2;
the periodical evaluation of termination platings has been added as a new topic of quality assessment in 9.8;
the revised test clause numbering of IEC 60115-1:2020 has been applied;
a new Annex C has been added to summarize workmanship requirements for the assembly of leaded power resistors, e.g. as given in the prior IEC 61192 series of standards;
the informative Annex F on radial formed styles has been amended with details on a formed Z-bend style for surface-mount assembly;
furthermore, the informative Annex X has been ad

  • Standard
    113 pages
    English language
    sale 15% off
IEC
IEC 60115-1:2020(Main)
Fixed resistors for use in electronic equipment - Part 1: Generic specification

IEC 60115-1:2020 is a generic specification and is applicable to fixed resistors for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.
This edition contains the following significant technical changes with respect to the previous edition:
this 5th edition employs a new document structure, where the tests of prior Clause 4 are given in Clauses 6 to 12 now, with an informative Annex X providing cross-references for references to the prior revision of this standard;
the terms and definitions have been revised and amended, supplemented by a new section on resistor technologies and a new section on product classification levels;
a new Subclause 4.7 on recommendations for permissible substitutions has been added;
the provisions for packaging, storage and transportation in Subclauses 4.8, 4.9 and 4.10 have been completely revised;
a new Subclause 5.3 on default tolerances for the most common test parameters has been added;
the generic method of measuring resistance, now Sublause 5.6, has been separated from the test for compliance with a prescribed resistance value in 6.1, as a revision of the prior 4.5;
the test for the temperature coefficient of resistance of Subclause 6.2 is a revision of the prior test 4.8, variation of resistance with temperature, where the special concessions for resistors below 10 Ω have been waived;
the test methods for endurance testing of Subclauses 7.1 to 7.3 (prior 4.25.1 to 4.25.3) have been completely revised;
the single‑pulse high‑voltage overload test of Subclause 8.2 (prior 4.27) has been completely revised, and now offers adjustable severities for the 1,2/50 and for the 10/700 pulse shape for the benefit of detail specifications with improved significance;
the periodic-pulse high-voltage overload test of Subclause 8.3 (prior 4.28) has been revised and a corrected table of severities provided;
the period-pulse overload test of Subclause 8.4 (prior 4.39) has been deprecated and streamlined to only offer the severity historically applied in subordinate specifications;
the Subclauses 9.1 on visual inspection, 9.2 on the gauging of dimensions, and 9.3 on the assessment of detail dimensions (all parts of prior 4.4) have been completely revised;
the tests for robustness of terminations (prior 4.16) have been revised and separated into tests for the robustness of solderable terminations, Subclause 9.5, and tests for the robustness of threaded stud or screw terminations, Subclause 9.6;
the bump test of Subclause 9.9 (prior 4.20) and the shock test of Subclause 9.10 (prior 4.21) have been revised to reflect the merged relevant test standard IEC 60068-2-29;
the dry heat and cold test of the climatic sequence of Subclause 10.3 (prior 4.23) have been revised to reflect the changes of the relevant test standards IEC 60068‑2‑2 and IEC 60068‑2‑1;
the accelerated damp heat, steady state test of Subclause 10.5 (prior 4.37) has been amended with an option for a reduced number of bias voltages;
the corrosion test of Subclause 10.6 has been completely revised in order to employ the better suitable test method of IEC 60068-2-52 instead of the prior used IEC 60068-2-11;
the whisker growth test of Subclause 10.7 has been revised to reflect the changes of the new revision of the test methods of IEC 60068-2-82;
the test methods for solderability of Subclause 11.1 (prior 4.17) and for resistance to soldering heat of Subclause 11.2 (prior 4.18) have been completely revised to incorporate the necessary option for the variety of lead-bearing and lead-free solder alloys and respective process conditions;
the solvent resistance test of Subclause 11.3 combines the prior tests 4.29, component solvent resistance, and 4.30, solvent resistance of marking, in one test;
the accidental overload test of Subclause 12.3 (prior 4.26) has been completely r

  • Standard
    322 pages
    English and French language
    sale 15% off
IEC
IEC TR 63091:2017(Main)
Study for the derating curve of surface mount fixed resistors - Derating curves based on terminal part temperature

IEC TR 63091:2017(E) is a technical report and is applicable to SMB resistors with sizes equal or smaller than the RR6332M, including the typical rectangular and cylindrical SMD resistors mentioned in IEC 60115-8.

  • Technical report
    123 pages
    English language
    sale 15% off
IEC
IEC 60195:2016(Main)
Method of measurement of current noise generated in fixed resistors

IEC 60195:2016 specifies a method of measurement and associated test conditions to assess the "noisiness", or magnitude of current noise, generated in fixed resistors of any given type. The method applies to all classes of fixed resistors. The aim is to provide comparable results for the determination of the suitability of resistors for use in electronic circuits having critical noise requirements. This edition includes the following significant technical changes with respect to the previous edition:
- harmonization of the allocation of isolation resistors RM in the recommended operating conditions given in Table 2;
- correction of erroneous numeric values of the contribution of system noise, f(T - S) in Table 3;
- addition of advice on the prescription of requirements in a relevant component specification;
- addition of a set of recommended measuring conditions for specimens with a rated dissipation of less than 100 mW;
- complete editorial revision.

  • Standard
    58 pages
    English and French language
    sale 15% off
IEC
IEC 60115-8-1:2014(Main)
Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G

IEC 60115-8-1:2014 is applicable to the drafting of detail specifications for fixed surface mount (SMD) low-power film resistors in rectangular chip shape (styles RR) or in cylindrical MELF shape (styles RC) classified to level G, which is defined in IEC 60115-8:2009, 1.5 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals. This edition includes the following significant technical changes with respect to the previous edition:
- It includes minor revisions related to tables, figures and references.
- Dedication to resistors of product classification level G, which is for general electronic equipment, typically operated under benign or moderate environmental conditions, like e.g. consumer products, or telecommunication user terminals.
- Implementation of the zero defect policy with the application of the single assessment level EZ in all test schedules.
- Substitution of the temperature coefficient of resistance (TCR), specified over the full defined temperature range, for the inferior and less significant temperature characteristic.
- Adition of a test for the immunity against electrostatic discharge.
- Implementation of the concept of stability classes with coordinated requirements to the performance at all prescribed tests.
- Addition of information relevant for the component user in his assembly process.
- Addition of an Annex providing special provisions for 0 resistors (jumpers), which may be part of a range of products covered by a detail specification derived from this blank detail specification.

  • Standard
    89 pages
    English and French language
    sale 15% off
IEC
IEC 60115-2:2014(Main)
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors

IEC 60115-2:2014 is applicable to leaded fixed low-power film resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating. These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole technique. The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor. This edition includes the following significant technical changes with respect to the previous edition:
- it includes test conditions and requirements for lead-free soldering and assessment procedures meeting the requirements of a "zero defect" approach;
- it introduces a product classification based on application requirements;
- it includes an extension of the list of styles and dimensions;
- it includes the use of an extended scope of stability class definitions;
- it includes the extension of the lists of preferred values of ratings;
- it includes test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD);
- it includes a new set of severities for a shear test;
- it includes definitions for a test board;
- it includes the replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a "zero defect" approach;
- it includes an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test;
- it includes requirements applicable to 0-ohm resistors (jumpers);
- it includes recommendations for the denomination, description, packaging and quality assessment of radial formed styles;
- it includes prescriptions for endurance testing at room temperature, supplementary to the rulings of IEC 60115-1.

  • Standard
    139 pages
    English and French language
    sale 15% off
IEC
IEC 60115-8:2009(Main)
Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors

IEC 60115-8:2009 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions). They have metallized terminations and are primarily intended to be mounted directly on to a circuit board. The major technical changes with regard to the first edition are the following:
- introduction of a product classification based on application requirements;
- extension of the list of styles and dimensions;
- use of an extended scope of stability class definitions;
- extension of the lists of preferred values of ratings;
- inclusion of test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD);
- inclusion of a new set of severities for a shear test;
- inclusion of definitions for a test board;
- replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a "zero defect" approach;
- inclusion of an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test;
- inclusion of requirements applicable to 0 ohm resistors (jumpers).

  • Standard
    41 pages
    English language
    sale 15% off
  • Standard
    84 pages
    English and French language
    sale 15% off