IEC 60115-2-10:2023

Fixed resistors for use in electronic equipment - Part 2-10: Blank detail specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G

IEC 60115-2-10:2023 is a detail specification which specifies the characteristics and ratings of low-power film resistors with leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards. This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures specified by IEC 60115-1:2020, Annex Q.
This first edition cancels and replaces IEC 60115-2-1:1982. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
it employs the product classification based on application requirements as defined in the generic specification IEC 60115‑1:2020;
it permits the specification of additional dimensional requirements concerning the eccentricity of termination wires and the coating extending onto wires;
it provides for a tabulated presentation of resistance ranges in relationship to the temperature coefficient and the tolerance;
it supports solderability testing for both traditional lead-bearing soldering and up-to-date lead-free soldering, as required;
it introduces a test for the specimens’ robustness to electrostatic discharge;
it introduces a test for the specimens’ resistance to solvents;
it introduces a test for the flammability of the specimens;
it employs consistent stability requirements grouped in stability classes;
it supports the provision of detailed visual acceptance criteria;
it includes the requirement for a visual examination of the primary and proximity packaging;
it provides the correlated test schedules for a qualification approval and for subsequent quality conformance inspections side by side;
it employs quality assessment procedures which meet the requirements of a zero-defect approach, which evades the use of historic AQL levels and the permission of non-conforming specimens in test groups;
it provides for the inclusion of specific visual acceptance criteria, to be applied in addition to those given in Annex B of the sectional specification IEC 60115-2:2023;
it provides for the optional coverage of 0 Ω resistors (jumpers) within the scope of the drafted detail specification;
furthermore, it employs a new document structure, for which a transition guidance is provided in Annex X.

Résistances fixes utilisées dans les équipements électroniques - Partie 2-10: Spécification particulière-cadre: Résistances à broches à couche, à faible dissipation, pour assemblage par trous traversants sur cartes de circuit imprimé (carte THT) pour des équipements électroniques généraux, niveau de classification G

L'IEC 60115-2-10:2023 spécifie les caractéristiques et valeurs assignées des résistances à broches à couche, à faible dissipation, utilisées dans les équipements électroniques, et qui sont généralement assemblées sur les cartes de circuit imprimé au moyen de la technologie à trous traversants (THT).
Cette première édition annule et remplace l’IEC 60115-2-1:1982. Cette édition constitue une révision technique.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) recours à la classification de produit basée sur les exigences d’application, telle qu’elle est définie dans la spécification générique IEC 60115‑1:2020;
b) autorisation de la spécification d’exigences dimensionnelles supplémentaires, concernant l’excentricité des fils de sortie et la prolongation du revêtement sur ces fils;
c) présentation sous forme de tableau des plages de résistances, en relation avec le coefficient de température et la tolérance;
d) acceptation des essais de brasabilité couvrant à la fois la brasure traditionnelle contenant du plomb et la brasure plus contemporaine, sans plomb, selon ce qui est exigé;
e) introduction d’un essai couvrant la robustesse des éprouvettes aux décharges électrostatiques;
f) introduction d’un essai couvrant la robustesse des éprouvettes aux solvants;
g) introduction d’un essai couvrant l’inflammabilité des éprouvettes;
h) recours à des exigences de stabilité homogènes regroupées dans des classes de stabilité;
i) prise en charge de la spécification de critères d’acceptation visuelle détaillés;
j) spécification d’une exigence d’examen visuel portant sur l’emballage principal et l’emballage de proximité;
k) spécification groupée des programmes d’essais corrélés pour l’homologation et les contrôles ultérieurs de conformité de la qualité;
l) recours à des procédures d’assurance de la qualité satisfaisant aux exigences d’une approche zéro défaut, qui évite l’utilisation des anciens niveaux NQA et l’autorisation d’éprouvettes non conformes au sein de groupes d’essai;
m) inclusion de critères d’acceptation visuelle spécifiques, s’appliquant en complément de ceux donnés à l’Annexe B de la spécification intermédiaire IEC 60115-2:2023;
n) couverture facultative des résistances 0 Ω (cavaliers) relevant du domaine d’application du projet de spécification particulière;
o) recours à une nouvelle structure documentaire, avec des recommandations facilitant la transition vers celle-ci données à l’Annexe X.

General Information

• Status: Published
• Publication Date: 14-Feb-2023
• ICS: 31.040.10 - Fixed resistors
• Technical Committee: TC 40 - Capacitors and resistors for electronic equipment
• Drafting Committee: MT 60115-2-1 - TC 40/MT 60115-2-1
• Current Stage: PPUB - Publication issued
• Start Date: 20-Mar-2023
• Completion Date: 15-Feb-2023

Standards Content (Sample)

IEC 60115-2-10 ®
Edition 1.0 2023-02
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –
Part 2-10: Blank detail specification: Low-power film resistors with leads for
through-hole assembly on circuit boards (THT), for general electronic
equipment, classification level G
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IEC 60115-2-10 ®
Edition 1.0 2023-02
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –
Part 2-10: Blank detail specification: Low-power film resistors with leads for
through-hole assembly on circuit boards (THT), for general electronic
equipment, classification level G
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.040.10 ISBN 978-2-8322-6465-2
– 2 – IEC 60115-2-10:2023 © IEC 2023
CONTENTS
FOREWORD . 5
0 Introduction to the template provided by this blank detail specification. 7
0.1 Scope of this blank detail specification . 7
0.2 Function of this blank detail specification . 7
0.3 Identification of the detail specification and the resistor . 8
1 Scope . 10
2 Normative references . 10
3 Terms and definitions . 11
4 Characteristics and ratings . 11
4.1 General . 11
4.2 Dimensions . 11
4.3 Ratings . 14
4.4 Resistance range and tolerance on resistance . 15
5 Tests and test severities . 16
5.1 General . 16
5.2 Resistance . 16
5.3 Temperature coefficient of resistance . 17
5.4 Temperature rise . 17
5.5 Endurance at the rated temperature 70 °C . 17
5.6 Endurance at a maximum temperature: UCT . 17
5.7 Short-term overload . 17
5.8 Electrostatic discharge (ESD) test . 18
5.9 Visual examination . 18
5.10 Gauging of dimensions . 18
5.11 Detail dimensions . 18
5.12 Robustness of terminations . 19
5.13 Vibration . 19
5.14 Rapid change of temperature . 19
5.15 Climatic sequence. 19
5.16 Damp heat, steady state . 19
5.17 Solderability, with lead-free solder . 20
5.18 Solderability, with SnPb solder . 20
5.19 Resistance to soldering heat . 20
5.20 Solvent resistance . 21
5.21 Insulation resistance . 21
5.22 Voltage proof . 21
5.23 Flammability . 21
6 Performance requirements. 21
6.1 General . 21
6.2 Limits for change of resistance at tests . 22
6.3 Temperature coefficient of resistance . 22
6.4 Temperature rise . 23
6.5 Visual examination . 23
6.5.1 General visual criteria . 23
6.5.2 Visual criteria after tests . 24
6.5.3 Visual criteria for packaging . 24

6.6 Solderability . 24
6.7 Insulation resistance . 24
6.8 Flammability . 25
7 Marking, packaging and ordering information . 25
7.1 Marking of the component . 25
7.2 Packaging . 25
7.3 Marking of the packaging . 25
7.4 Ordering information . 25
8 Additional information . 26
8.1 General . 26
8.2 Storage and transportation . 26
8.3 Substrate for assembly . 26
8.4 Soldering process . 26
8.5 Use of cleaning agents or solvents . 26
8.6 Coating or potting after assembly . 27
9 Quality assessment procedures . 27
9.1 General . 27
9.1.1 100 % test . 27
9.1.2 Certificate of conformity (CoC) . 27
9.1.3 Certified test records of released lots . 28
9.2 Qualification approval . 28
9.3 Maintenance of a qualification approval . 28
9.3.1 Quality conformance inspection . 28
9.3.2 Non-conforming specimen . 28
Annex A (normative) Symbols and abbreviated terms . 37
A.1 Symbols . 37
A.2 Abbreviated terms . 39
Annex B (normative) Reference for visual examination . 40
Annex C (normative) Zero Ohm resistors (jumpers). 41
C.1 General . 41
C.2 Characteristics and ratings . 41
C.3 Tests and test severities . 42
C.4 Performance requirements . 42
C.5 Marking, packaging and ordering information . 42
C.6 Additional information . 42
C.7 Quality assessment procedures . 42
C.7.1 Test schedule for qualification approval . 42
C.7.2 Test schedule for quality conformance inspection . 43
Annex X (informative) Cross-references to the prior revision of this specification . 44
Bibliography . 45

Figure 1 – Outline and dimensions . 12
Figure 2 – Lead eccentricity of the wire terminations . 13
Figure 3 – Length of excessive coating on the wire terminations . 13
Figure 4 – Derating curve . 15

Table 1 – Styles and dimensions. 12

– 4 – IEC 60115-2-10:2023 © IEC 2023
Table 2 – Climatic categories . 14
Table 3 – Ratings. 14
Table 4 – Temperature coefficients, tolerances
...