IEC 60115-2:2014
(Main)Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
IEC 60115-2:2014 is applicable to leaded fixed low-power film resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating. These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole technique. The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor. This edition includes the following significant technical changes with respect to the previous edition:
- it includes test conditions and requirements for lead-free soldering and assessment procedures meeting the requirements of a "zero defect" approach;
- it introduces a product classification based on application requirements;
- it includes an extension of the list of styles and dimensions;
- it includes the use of an extended scope of stability class definitions;
- it includes the extension of the lists of preferred values of ratings;
- it includes test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD);
- it includes a new set of severities for a shear test;
- it includes definitions for a test board;
- it includes the replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a "zero defect" approach;
- it includes an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test;
- it includes requirements applicable to 0-ohm resistors (jumpers);
- it includes recommendations for the denomination, description, packaging and quality assessment of radial formed styles;
- it includes prescriptions for endurance testing at room temperature, supplementary to the rulings of IEC 60115-1.
Résistances fixes utilisées dans les équipements électroniques - Partie 2: Spécification intermédiaire: Résistances fixes à broches à couches, à faible dissipation
L'IEC 60115-2:2014 est applicable aux résistances fixes à broches à couches, à faible dissipation utilisées dans les équipements électroniques. Ces résistances sont généralement décrites en fonction des types (formes géométriques différentes), des modèles (dimensions différentes) et de la technologie de produit. L'élément résistif de ces résistances est généralement protégé par un revêtement de laque conforme. Ces résistances comportent des fils de sortie et sont principalement destinées à être montées sur une carte de circuits avec la technique des trous traversants. L'objectif de la présente norme est de prescrire des valeurs assignées et des caractéristiques préférentielles et de sélectionner d'après l'IEC 60115-1 les procédures d'assurance de qualité, les essais et les méthodes de mesures appropriés, et de fournir des exigences générales pour ce type de résistance. Les modifications techniques majeures par rapport à la première édition sont les suivantes:
- inclut des conditions d'essai et des exigences pour le brasage sans plomb et des procédures d'évaluation satisfaisant aux exigences d'une approche "zéro défaut";
- introduction d'une classification de produit basée sur des exigences d'application;
- extension de la liste des modèles et dimensions;
- utilisation d'un domaine d'application élargi des définitions de classes de stabilité;
- extension des listes de valeurs assignées préférentielles;
- introduction de conditions d'essais et d'exigences pour la brasure sans plomb, pour les surcharges périodiques et pour la résistance aux décharges électrostatiques (ESD);
- introduction de nouvelles sévérités pour un essai de cisaillement;
- introduction de définitions pour une carte d'essai;
- remplacement du niveau d'assurance E et d'autres niveaux possibles par le seul niveau d'assurance EZ, satisfaisant aux exigences d'une approche "zéro défaut";
- introduction d'un essai d'endurance prolongée, d'un essai d'inflammabilité, d'un essai d'échauffement, d'un essai de vibrations, d'un essai de variation rapide de température étendu et d'un essai de surcharge haute tension à une seule impulsion;
- introduction d'exigences applicables aux résistances de 0 (câbles de liaison);
- introduction de recommandations pour la dénomination, la description, l'emballage et l'évaluation de la qualité des modèles de forme radiale;
- introduction de prescriptions pour les essais d'endurance à la température ambiante, en complément des règles de l'IEC 60115-1.
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Standards Content (Sample)
IEC 60115-2
®
Edition 3.0 2014-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fixed resistors for use in electronic equipment –
Part 2: Sectional specification: Leaded fixed low power film resistors
Résistances fixes utilisées dans les équipements électroniques –
Partie 2: Spécification intermédiaire: Résistances fixes à broches à couches, à
faible dissipation
IEC 60115-2:2014-05(en-fr)
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IEC 60115-2
®
Edition 3.0 2014-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fixed resistors for use in electronic equipment –
Part 2: Sectional specification: Leaded fixed low power film resistors
Résistances fixes utilisées dans les équipements électroniques –
Partie 2: Spécification intermédiaire: Résistances fixes à broches à couches, à
faible dissipation
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX XB
ICS 31.040.10 ISBN 978-2-8322-1584-5
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 60115-2:2014 © IEC 2014
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions, product technologies and product classification . 9
3.1 Terms and definitions . 9
3.2 Product technologies . 9
3.2.1 Metal film technology . 9
3.2.2 Metal glaze technology . 9
3.2.3 Metal oxide technology . 10
3.2.4 Carbon film technology . 10
3.3 Product classification . 10
4 Preferred characteristics . 11
4.1 General . 11
4.2 Style and dimensions . 11
4.3 Preferred climatic categories . 12
4.4 Resistance . 13
4.5 Tolerances on resistance . 13
4.6 Rated dissipation P . 13
70
4.7 Limiting element voltage U . 14
max
4.8 Insulation voltage U . 14
ins
4.9 Insulation resistance R . 14
ins
5 Tests and test severities . 14
5.1 Preparation of specimen . 14
5.1.1 Drying . 14
5.1.2 Mounting of components on a test rack . 14
5.1.3 Specification of test boards . 14
5.1.4 Mounting of components on test boards . 16
5.2 Tests . 17
5.2.1 Dimensions . 17
5.2.2 Insulation resistance . 17
5.2.3 Voltage proof . 17
5.2.4 Short time overload . 18
5.2.5 Temperature rise . 18
5.2.6 Robustness of terminations . 18
5.2.7 Solderability. 18
5.2.8 Resistance to soldering heat . 19
5.2.9 Rapid change of temperature . 19
5.2.10 Rapid change of temperature, ≥100 cycles . 20
5.2.11 Vibration . 20
5.2.12 Climatic sequence . 20
5.2.13 Damp heat, steady state . 21
5.2.14 Endurance at 70 °C . 21
5.2.15 Endurance at room temperature . 22
5.2.16 Endurance at the upper category temperature . 22
5.2.17 Single pulse high voltage overload test . 23
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IEC 60115-2:2014 © IEC 2014 – 3 –
5.2.18 Component solvent resistance . 23
5.2.19 Solvent resistance of marking . 23
5.2.20 Flammability test . 24
5.2.21 Electrostatic discharge (ESD) test . 24
5.2.22 Periodic pulse overload test . 24
6 Performance requirements . 25
6.1 General . 25
6.2 Limits for change of resistance . 25
6.3 Insulation resistance . 27
6.4 Variation of resistance with temperature . 27
6.5 Temperature rise . 28
6.6 Solderability . 28
6.7 Flammability . 28
7 Marking, packaging and ordering information . 28
7.1 Marking of the component . 28
7.2 Packaging . 28
7.3 Marking of the packaging . 28
7.4 Ordering information . 28
8 Detail specifications. 29
8.1 General . 29
8.2 Information to be specified in a detail specification . 29
8.2.1 Outline drawing or illustration . 29
8.2.2 Style and dimensions . 29
8.2.3 Climatic category . 29
8.2.4 Resistance range . 29
8.2.5 Tolerances on resistance . 30
8.2.6 Rated dissipation P . 30
70
8.2.7 Limiting element voltage U . 30
max
8.2.8 Insulation voltage U . 30
ins
8.2.9 Insulation resistance R . 30
ins
8.2.10 Test severities . 30
8.2.11 Limits of resistance change after testing . 30
8.2.12 Temperature coefficient of resistance . 30
8.2.13 Marking . 30
8.2.14 Ordering information . 30
8.2.15 Mounting . 31
8.2.16 Storage. 31
8.2.17 Additional information . 31
8.2.18 Quality assessment procedures . 31
8.2.19 0 Ω resistors . 31
9 Quality assessment procedures . 31
9.1 General . 31
9.2 Definitions. 31
9.2.1 Primary stage of manufacture . 31
9.2.2 Structurally similar components . 31
9.2.3 Assessment level EZ . 32
9.3 Formation of inspection lots . 32
9.4 Qualification approval (QA) procedures . 33
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– 4 – IEC 60115-2:2014 © IEC 2014
9.5 Quality conformance inspection . 33
9.6 Capability approval (CA) procedures . 33
9.7 Technology approval (TA) procedures . 34
9.8 Delayed delivery . 34
9.9 Certified test records. 34
9.10 Certificate of conformity (CoC) . 34
Annex A (normative) 0 Ω Resistors (Jumper) . 45
A.1 General . 45
A.2 Preferred characteristics . 45
A.3 Tests and test severities . 45
A.4 Performance requirements . 46
A.5 Marking, packaging and ordering information . 46
A.6 Detail specification . 46
A.7 Quality assessment procedures . 46
Annex B (informative) Radial formed styles . 48
B.1 General . 48
B.1.1 Scope of this annex . 48
B.1.2 Denomination of radial formed styles . 48
B.1.3 Coated lead wires . 49
B.1.4 Means for support of mounting height . 49
B.1.5 Means for retention . 49
B.2 Radial formed styles . 50
B.2.1 Radial formed style with lateral body position . 50
B.2.2 Radial formed style with upright body position . 51
B.3 Packaging . 54
B.4 Quality assessment . 55
B.4.1 General . 55
B.4.2 Quality assessment of formed resistors . 55
B.4.3 Forming of finished resistors of assessed quality . 55
B.4.4 Special inspection requirements . 55
Annex C (normative) Endurance at room temperature . 57
C.1 Remark on the temporary relevance of this annex . 57
C.2 General . 57
C.3 Test chamber and mounting of specimen . 57
C.4 Initial measurement . 58
C.5 Temperature and load . 58
C.6 Duration . 60
C.7 Intermediate measurements . 60
C.8 Final inspection, measurements and requirements . 60
Annex D (informative) Letter symbols and abbreviations . 62
D.1 Letter symbols . 62
D.2 Abbreviations . 64
Annex X (informative) Cross reference for references to the prior revision of this
standard . 66
Bibliography . 68
Figure 1 – Shape and dimensions of axial leaded resistors . 11
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IEC 60115-2:2014 © IEC 2014 – 5 –
Figure 2 – Alternative methods for specification of the length of excessive protective
coating on axial leaded resistors . 12
Figure 3 – Lead-wire spacing of axial leaded resistors with bent leads . 12
Figure 4 – Derating curve . 13
Figure 5 – Basic layout for mechanical, environmental and electrical tests,
Kelvin (4 point) connections . 15
Figure 6 – Basic layout for mechanical, environmental and electrical tests,
standard connections . 16
Figure 7 – Assembly of specimen to the test board . 17
Figure B.1 – Shape and dimensions of radial formed resistor for lateral body position . 50
Figure B.2 – Shape and dimensions of radial formed resistor for lateral body position
with kinked lead wires . 50
Figure B.3 – Shape and dimensions of a radial formed resistor for upright body position . 52
Figure B.4 – Shape and dimensions of a radial formed resistor for upright body position
and wide spacing . 52
Figure B.5 – Shape and dimensions of a radial formed resistor for upright body position
and wide spacing, with kinked lead wire . 53
Figure C.1 – Derating curve with specification of a suitable test dissipation . 59
Figure C.2 – Derating curve without specification of a suitable test dissipation . 59
Table 1 – Preferred styles of axial leaded resistors . 11
Table 2 – Test board dimensions . 15
Table 3 – Limits for change of resistance at tests . 26
Table 4 – Permitted change of resistance due to variation of temperature . 27
Table 5 – Test schedule for qualification approval. 35
Table 6 – Test schedule for quality conformance inspection . 40
Table B.1 – Feasible lead-wire spacing of radial formed resistor for
lateral body position . 51
Table B.2 – Feasible lead-wire spacing of a radial formed resistor for
upright body position. 54
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– 6 – IEC 60115-2:2014 © IEC 2014
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –
Part 2: Sectional specification:
Leaded fixed low power film resistors
FOREWORD
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International Standard IEC 60115-2 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.
This third edition cancels and replaces the second edition, published in 1982, and it
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
– it includes test conditions and requirements for lead-free soldering and assessment
procedures meeting the requirements of a “zero defect” approach;
– it introduces a product classification based on application requirements;
– it includes an extension of the list of styles and dimensions;
– it inc
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