Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices

IEC 61340-5-3:2015 defines the ESD protective packaging properties needed to protect electrostatic discharge sensitive devices (ESDS) through all phases of production, rework/maintenance, transport and storage. Test methods are referenced to evaluate packaging and packaging materials for these product and material properties. Performance limits are provided. This standard does not address protection from electromagnetic interference (EMI), electromagnetic pulsing (EMP) or protection of volatile materials. This edition includes the following significant technical changes with respect to the previous edition:
a) removal of all references to ANSI/ESD STM11.13, replaced by normative reference IEC 61340-4-10;
b) additional notes added to Table 1;
c) addition of a new Table 3 related to the "ESD classification symbol" and the "primary function code".

Electrostatique - Partie 5-3: Protection des dispositifs électroniques contre les phénomènes électrostatiques - Classification des propriétés et des exigences relatives à l'emballage destiné aux dispositifs sensibles aux décharges électrostatiques

IEC 61340-5-3:2015 définit les propriétés des emballages de protection contre les ESD nécessaires pour protéger les dispositifs sensibles aux décharges électrostatiques (ESDS) pendant toutes les phases de production, réusinage/maintenance, de transport et de stockage. Les méthodes d'essai sont référencées pour évaluer les emballages et les matériaux d'emballages concernant les propriétés de ces produits et matériaux. Des limites de performance sont données. La présente norme ne traite pas de la protection contre le brouillage électromagnétique (EMI, Electromagnetic Interference), le brouillage radioélectrique (RFI, Radio Frequency Interference), les impulsions électromagnétiques (IEM) ni de la protection des matériaux volatils. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) suppression de toutes les références à l'ANSI/ESD STM11.13, remplacée par la référence normative IEC 61340-4-10;
b) notes supplémentaires ajoutées dans le Tableau 1;
c) ajout d'un Tableau supplémentaire 3 lié au "symbole de classification ESD" et au "code de fonction primaire".

General Information

Status
Published
Publication Date
15-Jul-2015
Technical Committee
Drafting Committee
Current Stage
DELPUB - Deleted Publication
Start Date
27-Apr-2022
Completion Date
29-Mar-2019
Ref Project

Relations

Overview

IEC 61340-5-3:2015 is an international standard published by the International Electrotechnical Commission (IEC) that addresses the protection of electrostatic discharge sensitive (ESDS) electronic devices through effective packaging. The standard specifies the essential properties and requirements for packaging materials designed to safeguard such devices from electrostatic discharge (ESD) throughout all phases-production, rework, transport, and storage.

This second edition replaces the 2010 version, introducing key technical updates such as replacing ANSI/ESD STM11.13 references with IEC 61340-4-10, enhancing classification tables for packaging, and introducing an ESD classification symbol system with primary function codes. Importantly, the standard focuses exclusively on electrostatic phenomena, excluding electromagnetic interference (EMI), electromagnetic pulsing (EMP), or protection of volatile substances.

Key Topics

  • ESD Protective Packaging Properties
    IEC 61340-5-3 defines material characteristics such as resistance (conductive, dissipative, insulating) and electrostatic shielding properties necessary to prevent electrostatic discharge damage.

  • Classification and Marking
    The standard provides a clear classification system for packaging based on material properties and functionality, including mandatory markings that denote the ESD classification symbol and primary function code. This supports traceability and easier identification during handling.

  • Test Methods and Performance Limits
    Referenced test procedures evaluate packaging materials against standardized requirements, ensuring consistent protection across different manufacturing and logistics environments.

  • Tailoring for Environment and Device Sensitivity
    Guidance is offered to tailor packaging requirements according to the specific environmental conditions and the sensitivity of the electronic devices, ensuring appropriate levels of ESD protection.

  • Scope of Protection
    The standard applies to packaging used inside and outside electrostatic protected areas (EPA), addressing the entire supply chain from material receipt to end-use.

Applications

IEC 61340-5-3 is critical for industries involved in the manufacture, handling, and transportation of electronic components and devices that are sensitive to electrostatic discharge. Practical applications include:

  • Manufacturing: Packaging materials compliant with IEC 61340-5-3 prevent ESD damage during device assembly and testing within a production environment.

  • Rework and Maintenance: Protective packaging assists in safe handling during servicing or refurbishing electronic modules, reducing risk of discharge damage.

  • Logistics and Storage: Shipping and storage of ESDS devices require packaging that adheres to the standard’s classification to maintain device integrity through transit and warehousing.

  • Quality Assurance: The standard’s traceability and marking systems facilitate quality control inspections, ensuring that appropriate protective packaging is consistently used.

Utilizing IEC 61340-5-3 compliant packaging effectively mitigates risks associated with static electricity, thereby enhancing product reliability and reducing costs due to ESD-related failures.

Related Standards

IEC 61340-5-3:2015 is part of the broader IEC 61340 series on electrostatics protection, which includes:

  • IEC 61340-4-10: Test methods for evaluation of ESD protective packaging materials, now a normative reference within IEC 61340-5-3.

  • IEC 61340-5-1: Protection of electronic devices from electrostatic phenomena-General requirements, complementing packaging protection strategies.

  • ANSI/ESD STM11.11 and STM11.12: Other widely referenced standards on the testing and qualification of ESD protective packaging and materials.

  • ISO/IEC Directives Part 2: Guidelines on drafting international standards applicable to IEC publications for consistency and clarity.

For professionals engaged in ESD control, familiarization with IEC 61340-5-3 alongside these standards ensures comprehensive approaches to mitigating electrostatic risks throughout the lifecycle of electronic components.


Keywords: IEC 61340-5-3, ESD protective packaging, electrostatic discharge, electrostatic sensitive devices, ESDS, packaging classification, ESD testing, electrostatic shielding, electrostatic resistance, electronic device protection, IEC electrostatics standards, ESD packaging materials standards.

Standard
IEC 61340-5-3:2015 - Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices
English and French language
42 pages
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Frequently Asked Questions

IEC 61340-5-3:2015 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices". This standard covers: IEC 61340-5-3:2015 defines the ESD protective packaging properties needed to protect electrostatic discharge sensitive devices (ESDS) through all phases of production, rework/maintenance, transport and storage. Test methods are referenced to evaluate packaging and packaging materials for these product and material properties. Performance limits are provided. This standard does not address protection from electromagnetic interference (EMI), electromagnetic pulsing (EMP) or protection of volatile materials. This edition includes the following significant technical changes with respect to the previous edition: a) removal of all references to ANSI/ESD STM11.13, replaced by normative reference IEC 61340-4-10; b) additional notes added to Table 1; c) addition of a new Table 3 related to the "ESD classification symbol" and the "primary function code".

IEC 61340-5-3:2015 defines the ESD protective packaging properties needed to protect electrostatic discharge sensitive devices (ESDS) through all phases of production, rework/maintenance, transport and storage. Test methods are referenced to evaluate packaging and packaging materials for these product and material properties. Performance limits are provided. This standard does not address protection from electromagnetic interference (EMI), electromagnetic pulsing (EMP) or protection of volatile materials. This edition includes the following significant technical changes with respect to the previous edition: a) removal of all references to ANSI/ESD STM11.13, replaced by normative reference IEC 61340-4-10; b) additional notes added to Table 1; c) addition of a new Table 3 related to the "ESD classification symbol" and the "primary function code".

IEC 61340-5-3:2015 is classified under the following ICS (International Classification for Standards) categories: 17.220.99 - Other standards related to electricity and magnetism; 29.020 - Electrical engineering in general. The ICS classification helps identify the subject area and facilitates finding related standards.

IEC 61340-5-3:2015 has the following relationships with other standards: It is inter standard links to IEC 61340-5-3:2022, IEC 61340-5-3:2010. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

You can purchase IEC 61340-5-3:2015 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of IEC standards.

Standards Content (Sample)


IEC 61340-5-3 ®
Edition 2.0 2015-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electrostatics –
Part 5-3: Protection of electronic devices from electrostatic phenomena –
Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices

Électrostatique –
Partie 5-3: Protection des dispositifs électroniques contre les phénomènes
électrostatiques – Classification des propriétés et des exigences relatives à
l'emballage destiné aux dispositifs sensibles aux décharges électrostatiques
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IEC 61340-5-3 ®
Edition 2.0 2015-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electrostatics –
Part 5-3: Protection of electronic devices from electrostatic phenomena –

Properties and requirements classification for packaging intended for

electrostatic discharge sensitive devices

Électrostatique –
Partie 5-3: Protection des dispositifs électroniques contre les phénomènes

électrostatiques – Classification des propriétés et des exigences relatives à

l'emballage destiné aux dispositifs sensibles aux décharges électrostatiques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 17.220.99; 29.020 ISBN 978-2-8322-2787-9

– 2 – IEC 61340-5-3:2015  IEC 2015
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviations . 7
3.1 Terms and definitions . 7
3.2 Abbreviations . 9
4 Tailoring . 9
5 Packaging application requirement . 9
5.1 General . 9
5.2 Inside an EPA . 9
5.3 Outside an EPA . 9
6 Classification of ESD packaging material properties . 10
6.1 General . 10
6.2 Material resistance properties . 10
6.2.1 General . 10
6.2.2 Resistance of conductive materials . 10
6.2.3 Resistance of electrostatic field shielding materials . 10
6.2.4 Resistance of dissipative materials . 11
6.2.5 Resistance of insulating materials. 11
6.3 Material electrostatic shielding properties . 11
6.3.1 Electrostatic discharge shielding . 11
6.3.2 Electrostatic field shielding . 11
7 Technical requirements for ESD protective packaging . 11
7.1 Packaging and material properties . 11
7.2 Packaging marking . 13
7.2.1 Classification symbol . 13
7.2.2 Packaging classification. 13
7.2.3 Traceability . 14
Annex A (informative) ESD packaging material guidance . 15
A.1 Environment and device sensitivity . 15
A.1.1 General . 15
A.1.2 Environment . 15
A.1.3 Device sensitivity . 16
A.2 Equipotential bonding . 17
A.3 Dissipative material for intimate contact . 17
A.4 Packaging from incoming material to the point of use . 17
A.5 Periodic verification . 18
A.6 Examples of measurement procedures for qualification and verification of
packaging . 19
Annex B (informative) Device damage . 20
B.1 Damage from ESD . 20
B.2 Discharge to a device . 20
B.2.1 Human body model (HBM) [2] and isolated conductors . 20
B.2.2 Retained charge . 20

B.3 Discharge from a device . 20
B.3.1 Charged device model (CDM) . 20
B.3.2 Tribo-electrification . 20
Bibliography . 21

Figure 1 – Example of packaging label (*Primary function code) . 13
Figure A.1 – Examples of EPA configurations . 16
Figure A.2 – Application of ESD protective packaging . 18

Table 1 – Test methods for electrostatic protective packaging . 12
Table 2 – Test methods and requirements for electrostatic discharge shielding
packaging . 12
Table 3 – Primary function code/ESD classification symbol . 14
Table A.1 – Packaging characteristics for environmental consideration . 15
Table A.2 – Examples for qualification and verification of packaging . 19

– 4 – IEC 61340-5-3:2015  IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTROSTATICS –
Part 5-3: Protection of electronic devices from electrostatic phenomena –
Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
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assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61340-5-3 has been prepared by IEC technical committee 101:
Electrostatics.
This second edition cancels and replaces the first edition published in 2010. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) removal of all references to ANSI/ESD STM11.13, replaced by normative reference
IEC 61340-4-10;
b) additional notes added to Table 1;
c) addition of a new Table 3 related to the “ESD classification symbol” and the “primary
function code”.
The text of this standard is based on the following documents:
CDV Report on voting
101/428/CDV 101/457/RVC
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61340 series, under the general title Electrostatics, can be found
on the IEC website
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – IEC 61340-5-3:2015  IEC 2015
INTRODUCTION
Packaging is necessary to protect electrostatic discharge sensitive devices (ESDS) from
physical and environmental damage during manufacture, transportation and storage.
Additionally, packaging for ESDS should also prevent damage from static electricity.

ELECTROSTATICS –
Part 5-3: Protection of electronic devices from electrostatic phenomena –
Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices

1 Scope
This part of IEC 61340 defines the ESD protective packaging properties needed to protect
electrostatic discharge sensitive devices (ESDS) through all phases of production,
rework/maintenance, transport and storage. Test methods are referenced to evaluate
packaging and packaging materials for these product and material properties. Performance
limits are provided.
This standard does not address protection from electromagnetic interference (EMI),
electromagnetic pulsing (EMP) or protection of volatile materials.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61340-2-3, Electrostatics – Part 2-3: Methods of test for determining the resistance and
resistivity of solid planar materials used to avoid electrostatic charge accumulation
IEC 61340-4-8, Electrostatics – Part 4-8: Standard test methods for specific applications –
Electrostatic discharge shielding − Bags
IEC 61340-4-10, Electrostatics – Part 4-10: Standard test methods for specific applications –
Two-point resistance measurement1
IEC 60417, Graphical symbols for use on equipment (available at http://www.graphical-
symbols.info/equipment)
3 Terms, definitions and abbreviations
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1.1
electrostatic discharge
ESD
rapid transfer of charge between bodies at different electrostatic potentials
Note 1 to entry: This note applies to the French language only.
—————————
At the time of writing, it is proposed withdrawing IEC 61340-4-10: 2012 and incorporating the test method into
the next edition of IEC 61340-2-3.

– 8 – IEC 61340-5-3:2015  IEC 2015
3.1.2
electrostatic discharge sensitive device
ESDS
sensitive devices, integrated circuit or assembly that may be damaged by electrostatic fields
or electrostatic discharge
Note 1 to entry: This note applies to the French language only.
3.1.3
ESD protected area
EPA
area in which an ESDS can be handled with acceptable risk of damage caused by
electrostatic discharge or fields
3.1.4
unprotected area
UPA
areas outside an EPA
SEE: Figure A.1
Note 1 to entry: This note applies to the French language only.
3.1.5
intimate packaging
material which makes contact with ESDS
3.1.6
proximity packaging
material not making contact with ESDS, which is used to enclose one or more devices
3.1.7
secondary packaging
material used primarily to give additional physical protection to the outside of a proximity
package
3.1.8
volume resistance
R
V
ratio of a d.c. voltage (V) applied between two electrodes placed on two (opposite) surfaces of
a specimen and the current (A) between the electrodes
Note 1 to entry: Volume resistance is expressed in ohms.
3.1.9
point-to-point resistance
R
p-p
ratio of a d.c. voltage (V) applied between two electrodes on a surface of a specimen and the
current (A) between the electrodes
Note 1 to entry: The electrode configuration for point-to-point resistance measurements is usually a pair of
circular faced electrodes with a defined distance apart.
Note 2 to entry: Point-to-point resistance is expressed in ohms.
3.1.10
surface resistance
R
S
ratio of a d.c. voltage (V) applied between two electrodes in a defined configuration on a
surface of a specimen and the current (A) between the electrodes

Note 1 to entry: The electrode configuration for surface resistance measurement is usually a pair of parallel
rectangular electrodes or a pair of circular concentric electrodes.
Note 2 to entry: Surface resistance is expressed in ohms.
3.2 Abbreviations
Term Meaning
CDM Charged device model
ESD Electrostatic discharge
ESDS Electrostatic discharge sensitive device
EMI Electromagnetic interference
EMP Electromagnetic pulsing
EPA ESD protected area
HMB Human body model
MM Machine model
UPA Unprotected area
4 Tailoring
This standard, or portions thereof, may not apply to all applications. Tailoring is accomplished
by evaluating the applicability of each requirement for the specific application. Upon
completion of the evaluation, requirements may be added, modified or deleted.
Tailoring decisions, including rationale, shall be documented.
5 Packaging application requirement
5.1 General
Transportation of ESDS requires packaging that provides protection from electrostatic
hazards (for example from an electrostatic discharge). Within an EPA in which all ESD risks
are well controlled, ESD protective packaging may not be necessary.
5.2 Inside an EPA
Packaging used within an EPA shall consist of dissipative or conductive materials for intimate
contact.
Items sensitive to <100 V human body model (HBM) may need additional protection
depending on application and program plan requirements.
NOTE Dissipative materials are preferred for intimate packaging in situations where charged device model (CDM)
damage is a concern.
5.3 Outside an EPA
Transportation of sensitive products outside of an EPA shall require packaging that provides
both
a) dissipative or conductive materials for intimate contact,
b) a structure that provides electrostatic discharge shielding.

– 10 – IEC 61340-5-3:2015  IEC 2015
If electrostatic field shielding materials are used to provide discharge shielding, a material
that provides a barrier to current flow should be used in combination with the electrostatic
field shielding material.
NOTE Dissipative materials are preferred for intimate packaging in situations where charged device model (CDM)
damage is a concern.
6 Classification of ESD packaging material properties
6.1 General
Materials and packages that are useful in preventing damage to sensitive electronic devices
exhibit certain properties. These properties include:
a) resistance properties:
– conductive;
– dissipative;
b) shielding properties:
– electrostatic discharge;
– electrostatic field.
6.2 Material resistance properties
6.2.1 General
Most standard packaging materials are electrically insulating and insulating materials retain
charge. Making the package less insulating provides a path for the charge to dissipate from
the package to a material at a lower potential.
Specific ranges of resistance are useful for different purposes. Packaging can be classified by
these resistance ranges of the material used in its construction.
6.2.2 Resistance of conductive materials
Conductive materials may be surface conductive, volume conductive or both.
a) Surface conductive materials
A surface conductive material shall have a surface resistance of <1 × 10 Ω.
b) Volume conductive materials
Volume conductive materials shall have a volume resistance of <1 × 10 Ω .
6.2.3 Resistance of electrostatic field shielding materials
Within the conductive materials classification, electrostatic field shielding materials shall have
a homogeneous layer with a surface resistance of <1 × 10 Ω or a volume resistance of
<1 × 10 Ω.
Other methods may also define the electrostatic field shielding classification.
NOTE These resistance values do not necessarily imply EMI/EMP shielding.
—————————
The thickness of the material might have a significant influence on the measured value of a volume resistance.

6.2.4 Resistance of dissipative materials
Dissipative materials may be surface dissipative, volume dissipative or both.
a) Surface dissipative materials
4 11
Surface dissipative materials shall have a surface resistance ≥1 × 10 and <1 × 10 Ω.
b) Volume dissipative materials
4 11
Volume dissipative materials shall have a volume resistance ≥1 × 10 and <1 × 10 Ω .
6.2.5 Resistance of insulating materials
Electrostatic insulating materials may be surface insulating, volume insulating or both.
a) Surface insulating materials

Electrostatic surface insulating materials have a surface resistance ≥1 × 10 Ω.
b) Volume insulating materials

Electrostatic volume insulating materials have a volume resistance ≥1 × 10 Ω.
6.3 Material electrostatic shielding properties
NOTE Electrostatic shielding materials protect packaged sensitive electronic items from the effects of electrostatic
discharges and fields that are external to the package.
6.3.1 Electrostatic discharge shielding
Electrostatic discharge shielding packaging is capable of attenuating an electrostatic
discharge. The calculated energy allowed inside a static discharge shielding bag shall be less
than 50 nJ when tested according to IEC 61340-4-8 or equivalent test method modified to
accommodate the product.
6.3.2 Electrostatic field shielding
Electrostatic field shielding packaging is capable of attenuating an electrostatic field.
NOTE Classified field-shielding materials can allow current flow through their volume.
7 Technical requirements for ESD protective packaging
7.1 Packaging and material properties
Table 1 and 2 provide test methods for determining material classifications for finished
packages and materials. When possible, testing shall be performed on the finished package.
When testing cannot be performed on a finished package, the material classification shall be
defined by the bulk material used for the production of the final package.
—————————
The thickness of the material might have a significant influence on the measured value of a volume resistance.

– 12 – IEC 61340-5-3:2015  IEC 2015
Table 1 – Test methods for electrostatic protective packaging
Material
a
Test method Method description Limits
classification
Surface conductive IEC 61340-2-3 R Surface resistance Ω
<1 × 10
S
4 c
IEC 61340-2-3 R Point-to-point resistance
<1 × 10 Ω
p-p
b
4 c
IEC 61340-4-10 R Point-to-point resistance
<1 × 10 Ω
p-p
4 d
Volume conductive IEC 61340-2-3 R Volume resistance <1 × 10 Ω
V
e 3
Electrostatic field IEC 61340-2-3 R Surface resistance <1 × 10 Ω
S
shielding
e
3 d
IEC 61340-2-3 R Volume resistance
<1 × 10 Ω
V
4 11
Surface dissipative IEC 61340-2-3 R Surface resistance ≥1 × 10 to <1 × 10 Ω
S
c
4 11
IEC 61340-2-3 R Point-to-point resistance
≥1 × 10 to <1 × 10 Ω
p-p
b
c
4 11
IEC 61340-4-10 R Point-to-point resistance
≥1 × 10 to <1 × 10 Ω
p-p
d
4 11
Volume dissipative IEC 61340-2-3 R Volume resistance
≥1 × 10 to <1 × 10 Ω
V
Surface insulating IEC 61340-2-3 R Surface resistance
≥1 × 10 Ω
S
b
11 c
IEC 61340-4-10 R Point-to-point resistance
≥1 × 10 Ω
p-p
11 d
Volume insulating IEC 61340-2-3 R Volume resistance ≥1 × 10 Ω
V
a
For product qualification of packaging materials, the environmental conditions for preconditioning and testing
shall be 23 °C ±2 °C and 12 % ±3 % relative humidity. The preconditioning before the measurement shall be
≥48 h.
b
IEC 61340-4-10 describes the R point-to-point resistance measurement with a two point probe.
p-p
IEC 61340-2-3 describes all three test methods R , R and R .
S V p-p
c
The results of a measurement of R according to IEC 61340-2-3 or IEC 61340-4-10 can be different compared
p-p
to the results of a measurement of R according to IEC 61340-2-3 due to the usage of different probes.
s
d
The thickness of the material might have a significant influence on the values of a measured volume resistance.
The requirement is the same despite the thickness of the material.
e
IEC 61340-2-3 describes test methods for the determination of the electrical resistance and resistivity of solid

4 12
materials in the range from 10 Ω to 10 Ω, and refers to other standards for measurements outside this range.
However, the other test methods referred to may not be appropriate for measuring packaging materials or
products. Therefore, for the purposes stated in this table, the concentric ring probe specified in IEC 61340-2-3
shall be used. The instrumentation used shall be able to measure to below 10 Ω; it is acceptable for the open
circuit voltage or voltage under load of the instrumentation used to be less than 10 V.

Table 2 – Test methods and requirements for electrostatic
discharge shielding packaging
Packaging system
Other ESD shielding
Shielding bags
packaging design
Test method IEC 61340-4-8 User defined
Requirement – intimate packaging shall be
Energy < 50 nJ
dissipative or conductive
– a barrier layer or a defined air
gap attenuating ESD energy shall
a
be included
a
No component of the packaging system shall cause ESD risk when taken within EPA.

7.2 Packaging marking
7.2.1 Classification symbol
ESD protective packaging shall be marked with the ESD classification symbol given in
IEC 60417-6202 and as shown in Figure 1 or in accordance with customer contracts,
purchase orders, drawings or other documentation.
IEC
Figure 1 – Example of packaging label (*Primary function code)
7.2.2 Packaging classification
The primary function code shall be marked below the ESD classification symbol given in
IEC 60417-6202 and as shown in Table 3:
S electrostatic discharge shielding;
F electrostatic field shielding;
C electrostatic conductive;
D electrostatic dissipative.
– 14 – IEC 61340-5-3:2015  IEC 2015
Table 3 – Primary function code/ESD classification symbol
Primary function code
Primary function ESD classification symbol
*
S Electrostatic discharge shielding
IEC
F Electrostatic field shielding
IEC
C Electrostatic conductive
IEC
D Electrostatic dissipative
IEC
7.2.3 Traceability
Packaging shall be marked with information that allows traceability to the packaging
manufacturer and to the manufacturer’s date/lot code information.
The date/lot code shall allow traceability to quality control information pertaining to the
manufacture of the specific lot of packaging.

Annex A
(informative)
ESD packaging material guidance
A.1 Environment and device sensitivity
A.1.1 General
Environment and device sensitivity are two primary considerations for selecting ESD
packaging materials.
A.1.2 Environment
Since the threat to a sensitive item is usually undetermined when the item is outside an ESD
protected area (EPA), electrostatic sensitive devices (ESDS) should be placed in ESD
protective packaging whenever the item is in an unprotected area (UPA) – see Table A.1.
Table A.1 – Packaging characteristics for environmental consideration
EPA UPA
Item to be
packed
Intimate Proximity Intimate Proximity
Electrostatic Electrostatic As for inside EPA and Electrostatic discharge
ESDS conductive conductive or electrostatic shielding
a b
or dissipative dissipative discharge shielding
a
For battery operated ESDS, the selection of the material or the design of the packaging should ensure that the
battery does not become discharged.
b
Electrostatic discharge shielding property is only needed when proximity packaging is not electrostatic
discharge shielding.
– 16 – IEC 61340-5-3:2015  IEC 2015
ESD protected area
Workstation Room Building
Print Pick and Place Reflow Packing
EPA
Storage
Storage
Manual assembly
IEC
Figure A.1 – Examples of EPA configurations
A.1.3 Device sensitivity
If the sensitivity of the ESDS is unknown and the device is being shipped outside of the EPA,
it should be packaged using an electrostatic discharge shielding structure that also provides
protection against electrostatic fields.

However, if the sensitivity of the ESDS is known and the ESD threat environment is well
understood, the protection level of the packaging may be reduced.
A.2 Equipotential bonding
While not always recognized as being a packaging consideration, equipotential bonding, or
the shunting of leads, can be an effective method to mitigate damage. By placing a conductive
shunt across device leads or card connectors, the various parts of the item share the same
electrical potential. While not necessarily at ground potential, the fact that parts of the item
share the same potential means that damaging current will not flow between them. Shunting
has limitations. Energy from direct discharge and electric fields may impact the item in a
manner that does not allow the energy to equalize through the shunt, but instead through the
device. ESD protective packaging that offers other protective properties is usually used in
conjunction with shunting devices.
A.3 Dissipative material for intimate contact
To avoid rapid discharge of ESDS due to contact with conductive surfaces, dissipative
materials are preferred.
A.4 Packaging from incoming material to the point of use
Figure A.1 shows a simplified layout of a generic electronic packaging application. Each area
has the recommended ESD packaging material properties noted. As discussed in A.1.3, if the
item sensitivity and threats are documented, the level of protective packaging can be reduced
after confirming packaging functionality.
NOTE This layout shows an “islands of protection” approach to ESD safeguards. Many manufacturing processes
employ a “total factory” approach, where the entire factory is a safeguarded area – see Figure A.1.

– 18 – IEC 61340-5-3:2015  IEC 2015
Storage/kitting
Print /pick and place/
reflow/packing
Assembly
Quality control
testing
Rework/assembly
Point of use
IEC
Figure A.2 – Application of ESD protective packaging
A.5 Periodic verification
The static control properties of some packaging materials can deteriorate with time and use.
Periodic verification of static control properties should be considered.

A.6 Examples of measurement procedures for qualification and verification of
packaging
Table A.2 – Examples for qualification and verification of packaging
a
Packaging item Test method Product qualification Compliance verification
Bags IEC 61340-2-3 R R
S S
Inside and outside layers Inside and outside layers
R
V
Inside layers to metal
plate
b
Energy bag test
IEC 61340-4-8
Tote boxes IEC 61340-2-3 R R
S p-p
Inside and outside Inside and outside surfaces
surfaces
R
V
Inside surface to metal
plate
Foams IEC 61340-2-3 R R
S p-p
Top and bottom surface Top and bottom surfaces
R
V
Top surface to metal plate
c
Carrier tapes IEC 61340-4-10 R R

p-p p-p
Inside cavities Inside cavities
Cavity to cavity
R
V
Cavity to metal plate
c
Thermoformed and IEC 61340-4-10 R R

p-p p-p
injection molded trays
Inside cavities Inside cavities
Cavity to cavity
R
V
Cavity to metal plate
Corrugated cardboard IEC 61340-2-3 R R
S S
Inside and outside layers Inside and outside layers
R
V
Inside layers to metal
plate
a
For product qualification, the environmental conditions for testing should be 23 °C ±2 °C and 12 % ±3 %
relative humidity.
b
Only relevant if an ESD discharge shielding bag needs to be qualified.
c
It may happen that the two-point-probe described in IEC 61340-4-10 does not fit inside the cavities. Other test
methods outside the current scope of this standard may then be needed to be used to measure the packaging
limits.
The compliance verification plan according to IEC 61340-5-1 [1] should document the
method used to verify the limits according to the material classification in Table A.2.
—————————
Numbers in square brackets refer to the Bibliography.

– 20 – IEC 61340-5-3:2015  IEC 2015
Annex B
(informative)
Device damage
B.1 Damage from ESD
Damage to devices usually occurs in one of two situations:
– electrostatic discharge to a device;
– electrostatic discharge from a charged device.
This distinction is important for packaging considerations because different properties are
required to manage each situation. The source of the static electricity needs to be considered
and then the path the charge travels to damage the device.
B.2 Discharge to a device
B.2.1 Human body model (HBM) [2] and isolated conductors
Common items that discharge to packaged devices include the human body and conductive
objects used to handle packages like conveyors, carts and vehicles. Tribo-electrification is
usually the charge source.
Since the discharge must pass through the package to reach the device, the package can be
used to protect the device from an ESD event external to the package.
B.2.2 Retained charge
The package can gain charge from ESD or tribo-electrification. Where the package exterior is
isolated from the package interior and therefore the device, it is possible for charge on the
package to discharge to the device as it is removed from the package.
B.3 Discharge from a device
B.3.1 Charged device model (CDM)
If a device is momentarily grounded in the presence of an electric field emanating from an
electrostatically charged item, a discharge occurs and the device retains a charge of opposite
polarity. When the device contacts an object with a different potential, like a grounded hand
removing the device from a package, an electrostatic discharge occurs. Since the electric field
passes through the package, the package can be used to protect the device from a field that
is external to the package. The package may also isolate the device from ground.
B.3.2 Tribo-electrification
As a device and package move in relation to each other, charge can accumulate on the
package and on the device. When the charged device contacts an object with a different
potential, an electrostatic discharge occurs.

Bibliography
[1] IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena – General requirements
[2] IEC 60749-26, Semiconductor devices – Mechanical and climatic test methods –
Part26: Electrostatic discharge (ESD) sensitivity testing – Human body model (HBM)

___________
– 22 – IEC 61340-5-3:2015  IEC 2015
SOMMAIRE
AVANT-PROPOS . 24
INTRODUCTION . 26
1 Domaine d'application . 27
2 Références normatives . 27
3 Termes, définitions et abréviations . 27
3.1 Termes et définitions . 27
3.2 Abréviations . 29
4 Personnalisation . 29
5 Exigence d’application de l’emballage . 29
5.1 Généralités . 29
5.2 À l’intérieur d’une EPA . 29
5.3 A l’extérieur d’une EPA . 30
6 Classification des propriétés des matériaux d’emballage contre les ESD . 30
6.1 Généralités . 30
6.2 Propriétés des matériaux liées à la résistance . 30
6.2.1 Gén
...

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IEC 61340-5-3:2015 is a standard that defines the properties and requirements for packaging used to protect electronic devices from electrostatic phenomena. It covers the different phases of production, transport, and storage. The standard provides test methods for evaluating packaging materials and sets performance limits. It does not address protection from electromagnetic interference, electromagnetic pulsing, or volatile materials. This edition of the standard includes changes such as the removal of references to ANSI/ESD STM11.13 and the addition of new tables.

기사 제목: IEC 61340-5-3:2015 - 정전기 - 파트 5-3: 정전기 방지 요소를 위한 전자기기 보호 - 정전기 방전 감수성 기기용 포장재의 특성 및 요구 사항 분류 기사 내용: IEC 61340-5-3:2015는 생산, 재작업/유지보수, 운송 및 저장의 모든 단계에서 정전기 방전 감수성 기기(ESDS)를 보호하기 위해 필요한 ESD 보호 포장 특성을 정의합니다. 제품 및 재료의 이러한 특성을 평가하기 위해 테스트 방법이 참조됩니다. 성능 한계가 제공됩니다. 이 표준은 전자기 간섭(EMI), 전자기 펄스(EMP)로부터의 보호 또는 휘발성 물질의 보호에 대해 다루지 않습니다. 이 판은 다음과 같은 이전 판에 비해 중요한 기술적 변경 사항을 포함합니다: 가) ANSI/ESD STM11.13에 대한 참조를 호출 제거하고 IEC 61340-4-10에 대한 규범 참조로 대체; 나) 테이블 1에 추가적인 참고 사항 추가; 다) "ESD 분류 심볼"과 "주요 기능 코드"와 관련된 새로운 테이블 3 추가.

記事タイトル:IEC 61340-5-3:2015 - 静電気 - Part 5-3: 静電気現象からの電子デバイス保護 - 静電気放電感受性デバイス向けパッケージングの特性と要件の分類 記事内容:IEC 61340-5-3:2015は、生産、再作業/保守、輸送、保管のすべてのフェーズで静電気放電感受性デバイス(ESDS)を保護するために必要なESD保護パッケージングの特性を定義します。これらの製品や材料の特性を評価するためのテスト方法が参照されます。性能の制限が提供されます。この規格は電磁干渉(EMI)、電磁パルス(EMP)、揮発性物質からの保護には対応していません。この版には、以下の重要な技術的変更が含まれています: a)ANSI/ESD STM11.13へのすべての参照を削除し、IEC 61340-4-10への規範参照で置き換える。 b)表1に追加の注釈を追加。 c)新しい「ESD分類記号」と「主な機能コード」に関するテーブル3を追加。