Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library

IEC TR 61188-8:2021(E) describes the configuration of part shape data of semiconductor devices and electrical components registered in the CAD library. This document mainly describes the configuration of 2D and 3D parts shape data.

General Information

Status
Published
Publication Date
13-Jan-2021
Current Stage
PPUB - Publication issued
Completion Date
14-Jan-2021
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IEC TR 61188-8:2021 - Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
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IEC TR 61188-8
Edition 1.0 2021-01
TECHNICAL
REPORT
colour
inside
Circuit boards and circuit board assemblies – Design and use –
Part 8: 3D shape data for CAD component library
IEC TR 61188-8:2021-01(en)
---------------------- Page: 1 ----------------------
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IEC TR 61188-8
Edition 1.0 2021-01
TECHNICAL
REPORT
colour
inside
Circuit boards and circuit board assemblies – Design and use –
Part 8: 3D shape data for CAD component library
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 31.190 ISBN 978-2-8322-9226-6

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC TR 61188-8:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 4

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms, definitions and abbreviated terms ........................................................................ 6

3.1 Terms and definitions .............................................................................................. 6

3.2 Abbreviated terms ................................................................................................... 6

4 Classification of component shape data ........................................................................... 6

4.1 Classification by technical drawing .......................................................................... 6

4.2 Classification by the kind of component shape data ................................................ 7

4.2.1 General ........................................................................................................... 7

4.2.2 Master data ..................................................................................................... 7

4.2.3 Design-use data .............................................................................................. 7

4.2.4 Complement data ............................................................................................ 7

4.3 Relation between technical drawing and component shape data ............................. 7

5 Configuration data of shape data ..................................................................................... 7

5.1 General ................................................................................................................... 7

5.2 Dimensions ............................................................................................................. 8

5.2.1 Dimensions of 2D drawing ............................................................................... 8

5.2.2 Dimensions of 3D shape models ...................................................................... 8

5.3 Material distinction .................................................................................................. 8

5.4 Marking ................................................................................................................... 8

5.5 Component identification information ...................................................................... 8

5.6 Reference point and placement angle ..................................................................... 9

5.6.1 Rules for 2D drawings ..................................................................................... 9

5.6.2 Rules for 3D shape models (component with no moving part) .......................... 9

5.6.3 Rules for 3D shape models (component with moving part) ............................. 10

5.7 Scale .................................................................................................................... 11

5.8 CAD format ........................................................................................................... 11

5.8.1 2D drawings .................................................................................................. 11

5.8.2 3D shape models ........................................................................................... 11

5.9 Component shape levels ....................................................................................... 11

5.9.1 General ......................................................................................................... 11

5.9.2 Level 1 .......................................................................................................... 11

5.9.3 Level 2 .......................................................................................................... 11

5.9.4 Level 3 .......................................................................................................... 12

5.9.5 Level 4 .......................................................................................................... 12

5.10 Other attributes ..................................................................................................... 13

5.10.1 Land pattern data .......................................................................................... 13

5.10.2 Courtyard data ............................................................................................... 13

5.10.3 Other attributes data ...................................................................................... 13

6 Basic design logic classification for components ............................................................ 13

Bibliography .......................................................................................................................... 17

Figure 1 – Marking .................................................................................................................. 8

Figure 2 – Reference point and placement angle .................................................................. 10

Figure 3 – Placement angle of connectors ............................................................................ 10

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IEC TR 61188-8:2021 © IEC 2021 – 3 –

Figure 4 – Placement angle of switches ................................................................................ 10

Figure 5 – Example of shape level 1 ..................................................................................... 11

Figure 6 – Examples of shape level 2 ................................................................................... 12

Figure 7 – Examples of shape level 3 ................................................................................... 12

Figure 8 – An example of shape level 4 ................................................................................ 13

Table 1 – Abbreviated terms ................................................................................................... 6

Table 2 – Relation between technical drawing and component shape data .............................. 7

Table 3 – Basic design logic classification for SMD ............................................................... 14

Table 4 – Basic design logic classification for IMD ................................................................ 16

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– 4 – IEC TR 61188-8:2021 © IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES –
DESIGN AND USE –
Part 8: 3D shape data for CAD component library
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

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rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 61188-8 has been prepared by IEC technical committee 91: Electronics assembly

technology. It is a Technical Report.
The text of this Technical Report is based on the following documents:
Draft Report on voting
91/1640/DTR 91/1682/RVDTR

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this Technical Report is English.
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IEC TR 61188-8:2021 © IEC 2021 – 5 –

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/standardsdev/publications.

A list of all parts in the IEC 61188 series, published under the general title Circuit boards and

circuit board assemblies – Design and use, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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– 6 – IEC TR 61188-8:2021 © IEC 2021
CIRCUIT BOARDS AND
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