IEC 62137-1-4:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

Technologie de montage en surface - Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface - Partie 1-4: Essai de flexion cyclique

La méthode d'essai décrite dans la CEI 62137-1-4:2009 s'applique aux composants pour montage en surface avec un plan de base fin et large tel que les QFP ou les BGA. La présente méthode d'essai évalue l'endurance des joints de soudure situés entre les broches de raccordement et les plages de connexion sur un substrat par flexion cyclique de ce dernier. Cet essai évalue également les effets des contraintes mécaniques répétées, tels que le fait d'appuyer sur les touches d'un téléphone cellulaire, sur la résistance du joint de soudure situé entre les bornes du composant et les plages de connexion sur un substrat.

General Information

• Status: Published
• Publication Date: 25-Jan-2009
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 3 - TC 91/WG 3
• Current Stage: PPUB - Publication issued
• Start Date: 15-Jan-2009
• Completion Date: 26-Jan-2009

Standards Content (Sample)

IEC 62137-1-4
Edition 1.0 2009-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology – Environmental and endurance test methods for
surface mount solder joint –
Part 1-4: Cyclic bending test
Technologie de montage en surface – Méthodes d’essais d’environnement et
d’endurance des joints brasés montés en surface –
Partie 1-4: Essai de flexion cyclique

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IEC 62137-1-4
Edition 1.0 2009-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology – Environmental and endurance test methods for
surface mount solder joint –
Part 1-4: Cyclic bending test
Technologie de montage en surface – Méthodes d’essais d’environnement et
d’endurance des joints brasés montés en surface –
Partie 1-4: Essai de flexion cyclique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
M
CODE PRIX
ICS 31.190 ISBN 978-2-88910-627-1
– 2 – 62137-1-4 © IEC:2009
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .6
3 Terms and definitions .6
4 Test equipment and material .6
4.1 Test equipment for cyclic bending .6
4.2 Test substrate .7
4.3 Solder alloy .7
4.4 Solder paste.7
4.5 Reflow soldering equipment .7
4.6 Surface mount component for testing .7
5 Mounting method.7
6 Test conditions .8
6.1 Pre-treatment .8
6.2 Test procedures .8
6.3 Judging criteria.9
7 Items to be included in the test report.9
8 Items to be prescribed in the product specifications.9
Annex A (normative) Cyclic bending test equipment.11

Figure 1 – Image drawing on evaluation area of joint strength.5
Figure 2 – Typical reflow soldering profile.8
Figure A.1 – Sample structure of substrate bending jig .12
Figure A.2 – Sample structure of cyclic bending strength test .13

62137-1-4 © IEC:2009 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS
FOR SURFACE MOUNT SOLDER JOINT –

Part 1-4: Cyclic bending test
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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International Standard IEC 62137-1-4 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/815/FDIS 91/835/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 62137-1-4 © IEC:2009
A list of all parts of the IEC 62137 series, under the general title Surface mounting
technology – Environmental and endurance test methods for surface mount solder joint, can
be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
62137-1-4 © IEC:2009 – 5 –
SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS
FOR SURFACE MOUNT SOLDER JOINT –

Part 1-4: Cyclic bending test
1 Scope
The test method described in this part of IEC 62137 applies to surface mount components
with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the
endurance of the solder joints between component leads and lands on a substrate by cyclic
bending of substrate.
This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell
phones, the strength of the solder joint between component terminals and lands on a
substrate.
In this test method, the evaluation requires first to mount the surface mount component on the
substrate by reflow soldering, then cyclically bend the substrate to a certain degree of depth
until fracture of the solder joints occurs. The properties of the solder joints (e.g, solder alloy,
substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of
the solder joints.
Component
lead
Component lead
Enlarge
Solder Plated layers
Evaluation area
Intermetallic compound
layers
Substrate
Substrate land
Substrate
IEC  1174/07
Figure 1 – Image drawing on evaluation area of joint strength

– 6 – 62137-1-4 © IEC:2009
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61188-5 (all parts 5), P
...