IEC 60068-2-82:2007

Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

IEC 60068-2-82:2007 specifies whisker tests for electric or electronic components representing the finished stage, with tin or tin-alloy finish. However, the standard does not specify tests for whiskers that may grow as a result of external mechanical stress. This test method is employed by a relevant specification (international component or application specification) with transfer of the test severities to be applied and with defined acceptance criteria. Where tests described in this standard are considered for other components, e.g. mechanical parts as used in electrical or electronic equipment, it should be ensured that the material system and whisker growth mechanisms are comparable. The contents of the corrigendum of December 2009 have been included in this copy.

Essais d'environnement - Partie 2-82: Essais - Essai XW1: Méthodes de vérification des trichites pour les composants électroniques et électriques

La CEI 60068-2-82:2007 spécifie des essais de vérification de la présence de trichites pour les composants électriques ou électroniques qui représentent la phase de finition, avec un fini en étain ou en alliage d'étain. Toutefois, la norme ne spécifie aucun essai pour les trichites susceptibles de se développer du fait d'une contrainte mécanique externe. L'utilisation de la présente méthode d'essai relève d'une spécification correspondante (spécification de composants ou d'application internationale) avec transfert des sévérités d'essai à appliquer et avec des critères d'acceptation définis. Lorsqu'il est prévu d'effectuer les essais décrits dans la présente norme pour d'autres composants, par exemple les pièces mécaniques utilisées dans les équipements électriques ou électroniques, il convient de s'assurer que le matériau constitutif et les mécanismes de développement des trichites sont comparables. Le contenu du corrigendum de décembre 2009 a été pris en considération dans cet exemplaire.

General Information

• Status: Published
• Publication Date: 22-May-2007
• ICS: 19.040 - Environmental testing
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 3 - TC 91/WG 3
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 14-May-2019

Relations

• Corrected By: IEC 60068-2-82:2007/COR1:2009 - Corrigendum 1 - Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
• Effective Date: 05-Sep-2023
• Revised: IEC 60068-2-82:2019 - Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60068-2-82 ®
Edition 1.0 2007-05
INTERNATIONAL
STANDARD
Environmental testing –
Part 2-82: Tests – Test XW : Whisker test methods for electronic and electric
components
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,

please contact the address below or your local IEC member National Committee for further information.

IEC Central Office
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CH-1211 Geneva 20
Switzerland
Email: [e-mail]
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
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IEC 60068-2-82 ®
Edition 1.0 2007-05
INTERNATIONAL
STANDARD
Environmental testing –
Part 2-82: Tests – Test XW : Whisker test methods for electronic and electric
components
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
V
ICS 19.040; 31.190 ISBN 2-8318-9162-0
– 2 – 60068-2-82 © IEC:2007(E)

CONTENTS
FOREWORD.4

1 Scope.6

2 Normative references .6

3 Terms and definitions .6

4 Test equipment.7

4.1 Desiccator .7

4.2 Humidity chamber .7
4.3 Thermal cycling chamber.7
4.4 Optical microscope.7
4.5 Scanning electron microscope microscopy .7
4.6 Fixing jig .8
5 Preparation for test.8
5.1 General .8
5.2 Selection of test methods .8
5.3 Storage conditions prior to testing .8
5.4 Handling of the specimen .8
5.5 Preconditioning by heat treatment .8
5.6 Specimen preparation by leads forming.9
6 Test condition.10
6.1 Ambient test .10
6.2 Damp heat test.10
6.3 Temperature cycling test .10
7 Test schedule.11
7.1 Procedure for test method selection .11
7.2 Initial measurement .12
7.3 Test.12
7.4 Recovery.12
7.5 Intermediate or final assessment .12
8 Information to be given in the relevant specification .12
9 Minimum requirements for a test report .13

Annex A (normative) Measurement of the whisker length .14
Annex B (informative) Examples of whiskers.15
Annex C (informative) Guidance on the sample lots and test schedules .17
Annex D (informative) Guidance on acceptance criteria .19
Annex E (informative) Background on whisker growth.21
Annex F (informative) Background on ambient test .22
Annex G (informative) Background on damp heat test.24
Annex H (informative) Background on temperature cycling test.27

Bibliography.32

60068-2-82 © IEC:2007(E) – 3 –

Figure A.1 – Definition of the whisker length .14

Figure B.1 – Nodule.15

Figure B.2 – Column whisker .15

Figure B.3 – Filament whisker.15

Figure B.4 – Kinked whisker .16

Figure B.5 – Spiral whisker .16

Figure D.1 – Smallest distance of components and circuit boards .19

Figure F.1 – Whisker growth of tin plating in ambient test condition .23

Figure G.1 – Growth of the oxide layer in damp heat conditions.25
Figure G.2a – Growth of whiskers in damp heat conditions .25
Figure G.2b – Growth of whiskers in damp heat conditions .26
Figure G.2 – Growth of whiskers.26
Figure H.1 – Distribution of whisker length grown on FeNi (Alloy42) base material.28
Figure H.2 – Whisker grown on FeNi (Alloy42) base material.29
Figure H.3 – Relationship of Δϑ and number of cycles for whisker growth on FeNi
(Alloy 42) base material .29
Figure H.4 – Whisker growth on Cu based leadframes (QFP) in temperature cycling
tests .31

Table 1 – Methods of preconditioning: Soldering simulation .
Table 2 – Methods of preconditioning: Soldering.9
Table 3 – Severities of the ambient test .10
Table 4 – Severities of the temperature cycling test: temperature .10
Table 5 – Severities of the temperature cycling test: cycles .11
Table 6 – Suitability of test methods for different plating situations .11
Table H.1 – Example for a relationship between realistic application conditions and
test conditions .30

– 4 – 60068-2-82 © IEC:2007(E)

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
ENVIRONMENTAL TESTING –
Part 2-82: Tests – Test XW : Whisker test methods
for electronic and electric components

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
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indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60068-2-82 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/651/FDIS 91/685/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

------------------
...

IEC 60068-2-82
Edition 1.0 2007-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-82: Tests – Test XW : Whisker test methods for electronic and electric
components
Essais d’environnement –
Partie 2-82: Essais – Essai XW : Méthodes de vérification des trichites pour les
composants électroniques et électriques

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by

any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or

IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
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publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

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Switzerland
Email: [e-mail]
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
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It also gives information on projects, withdrawn and replaced publications.
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Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
ƒ Electropedia: www.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
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IEC 60068-2-82
Edition 1.0 2007-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-82: Tests – Test XW : Whisker test methods for electronic and electric
components
Essais d’environnement –
Partie 2-82: Essais – Essai XW : Méthodes de vérification des trichites pour les
composants électroniques et électriques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
V
CODE PRIX
ICS 19.040 ISBN 2-8318-9718-1
– 2 – 60068-2-82 © IEC:2007
CONTENTS
FOREWORD.4

1 Scope.6

2 Normative references .6

3 Terms and definitions .6

4 Test equipment.7

4.1 Desiccator .7

4.2 Humidity chamber .7

4.3 Thermal cycling chamber.7
4.4 Optical microscope.7
4.5 Scanning electron microscope.7
4.6 Fixing jig .8
5 Preparation for test.8
5.1 General .8
5.2 Selection of test methods .8
5.3 Storage conditions prior to testing .8
5.4 Handling of the specimen .8
5.5 Preconditioning by heat treatment .8
5.6 Specimen preparation by leads forming.9
6 Test conditions .10
6.1 Ambient test .10
6.2 Damp heat test.10
6.3 Temperature cycling test .10
7 Test schedule.11
7.1 Procedure for test method selection .11
7.2 Initial measurement .12
7.3 Test.12
7.4 Recovery.12
7.5 Intermediate or final assessment .12
8 Information to be given in the relevant specification .12
9 Minimum requirements for a test report .13
Annex A (normative)  Measurement of the whisker length .14
Annex B (informative) Examples of whiskers.15

Annex C (informative)  Guidance on the sample lots and test schedules .17
Annex D (informative) Guidance on acceptance criteria .19
Annex E (informative) Background on whisker growth.21
Annex F (informative) Background on ambient test .22
Annex G (informative) Background on damp heat test.24
Annex H (informative) Background on temperature cycling test.27
Bibliography.32

Figure A.1 – Definition of the whisker length .
Figure B.1 – Nodule.15
Figure B.2 – Column whisker .15
Figure B.3 – Filament whisker.15

60068-2-82 © IEC:2007 – 3 –
Figure B.4 – Kinked whisker .16

Figure B.5 – Spiral whisker .16

Figure D.1 – Smallest distance of components and circuit boards .19

Figure F.1 – Whisker growth of tin plating in ambient test condition .23

Figure G.1 – Growth of the oxide layer in damp heat conditions.25

Figure G.2a – Growth of whiskers in damp heat conditions .25

Figure G.2b – Growth of whiskers in damp heat conditions .26

Figure G.2 – Growth of whiskers.26

Figure H.1 – Distribution of whisker length grown on FeNi (Alloy42) base material.28
Figure H.2 – Whisker grown on FeNi (Alloy42) base material.29
Figure H.3 – Relationship of Δϑ and number of cycles for whisker growth on FeNi
(Alloy42) base material .29
Figure H.4 – Whisker growth on Cu based leadframes (QFP) in temperature cycling
tests .31

Table 1 – Methods of preconditioning – Soldering simulation .9
Table 2 – Methods of preconditioning – Soldering.9
Table 3 – Severities of the ambient test .10
Table 4 – Severities of the temperature cycling test – Temperature .10
Table 5 – Severities of the temperature cycling test – Cycles.11
Table 6 – Suitability of test methods for different plating situations .11
Table H.1 – Example for a relationship between realistic application conditions and test
conditions .

– 4 – 60068-2-82 © IEC:2007
INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
ENVIRONMENTAL TESTING –
Part 2-82: Tests – Test XW : Whisker test methods
for electronic and electric components

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as poss
...