IEC 62137-1-1:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Technologie de montage en surface - Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface - Partie 1-1: Essai de résistance à la traction

La méthode d'essai décrite dans la CEI 62137-1-1:2007 est applicable aux composants montés en surface, munis d'une sortie en aile de mouette. La méthode est conçue pour soumettre à essai et évaluer l'endurance du joint brasé entre les broches de raccordements et les plages d'accueil sur un substrat, via une contrainte mécanique de type traction. Cet essai permet d'évaluer les effets de variations répétées de la température sur la résistance du joint brasé entre les bornes du composant et les plages d'accueil sur un substrat.

General Information

• Status: Published
• Publication Date: 10-Jul-2007
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 3 - TC 91/WG 3
• Current Stage: PPUB - Publication issued
• Start Date: 15-Aug-2007
• Completion Date: 11-Jul-2007

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD 62137-1-1
First edition
2007-07
Surface mounting technology –
Environmental and endurance test
methods for surface mount solder joint –
Part 1-1:
Pull strength test
Reference number
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

IEC Central Office
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Switzerland
Email: [e-mail]
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
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latest edition, a corrigenda or an amendment might have been published.
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INTERNATIONAL IEC
STANDARD 62137-1-1
First edition
2007-07
Surface mounting technology –
Environmental and endurance test
methods for surface mount solder joint –
Part 1-1:
Pull strength test
PRICE CODE
Commission Electrotechnique Internationale P
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 62137-1-1 © IEC:2007(E)
CONTENTS
FOREWORD.3

1 Scope.5

2 Normative references .5

3 Terms and definitions .6

4 General remarks.6

5 Test equipment and materials.7

5.1 Flow soldering equipment.7
5.2 Reflow soldering equipment .7
5.3 Pull strength test equipment .7
5.4 Optical microscope.7
5.5 Test substrate .7
5.6 Solder alloy .8
5.7 Flux for flow soldering .8
5.8 Solder paste.8
6 Mounting method.8
6.1 Flow soldering.8
6.2 Reflow soldering.9
7 Test conditions .10
7.1 Test: Rapid change of temperature.10
7.2 Pull strength test .10
8 Test procedure .10
8.1 Test sequence.10
8.2 Pre-conditioning .11
8.3 Initial pull strength measurement.11
8.4 Rapid change of temperature .11
8.5 Recovery.11
8.6 Intermediate/final pull strength measurement .11
9 Items to be included in the test report.11
10 Items to be given in the product specification .12

Annex A (normative) Pull strength test – Details .13

Bibliography.15

Figure 1 – Gull-wing leaded component .6
Figure 2 – Area under evaluation in the pull strength test.7
Figure 3 – Example of a flow soldering profile (actual measurement for double-wave
soldering) .
Figure 4 – Typical reflow profile .10
Figure 5 – Test procedure.11
Figure A.1 – Pull strength test.14
Figure A.2 – An example of the shape of the tip of the pulling jig .14
Figure A.3 – Failure modes in pull strength test .14

62137-1-1 © IEC:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS

FOR SURFACE MOUNT SOLDER JOINT –

Part 1-1: Pull strength test
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62137-1-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/681/FDIS 91/697/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 62137-1-1 © IEC:2007(E)
A list of all the parts in the IEC 62137 series, under the general title Surface mounting
technology – Environmental and endurance test methods for surface mount solder joint, can

be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until

the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in

the data related to the specific publication. At this date, the publication will be

• reconfirmed,
• withdrawn,
• replaced by a revised edition, or

• amended.
A bilingual version of this publication may be issued at a later date.

62137-1-1 © IEC:2007(E) – 5 –
SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS

FOR SURFACE MOUNT SOLDER JOINT –

Part 1-1: Pull strength test
1 Scope
The test method described in this part of IEC 62137 is applicable to gull-wing lead surface
mounting components.
The method is designed to test and evaluate the endurance of the solder joint between
component leads and lands on a substrate, by means of a pull type mechanical stress. This
test is suitable for evaluating the effects of repeated temperature change on the strength of
the solder joint between component terminals and lands on a substrate.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1: Environmental testing – Part 1: General and guidance
IEC 60068-2-14: Environmental testing – Part 2-14: Test N: Change of temperature
IEC 60194: Printed board design, manufacture and assembly – Terms and definitions
IEC 61188-5-5, Printed boards and printed board assemblies – Design and use – Part 5-5:
Sectional requirements - Attachment (land/joint) considerations – Components with gull-wing
leads on four sides
IEC 61190-1-1, Attachment materials for electronic assembly – Part 1-1: Requirements for
soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2: Attachment materials for electronic assembly – Part 1-2: Requirements for

solder pastes for high-quality interconnections in electronics assembly
IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
IEC 61249-2-7, Materials for printed boards and other interconnecting structures – Part 2-7:
Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet of
defined flammability (vertical burning test), copper-clad

—————————
In preparation.
– 6 – 62137-1-1 © IEC:2007(E)
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

NOTE Key terms used in this standard are taken mostly from IEC 60194 and IEC 60068-1.

3.1
gu
...

IEC 62137-1-1
Edition 1.0 2007-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology – Environmental and endurance test methods for
surface mount solder joint –
Part 1-1: Pull strength test
Technologie de montage en surface – Méthodes d’essais d’environnement et
d’endurance des joints brasés montés en surface –
Partie 1-1: Essai de résistance à la traction

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
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IEC 62137-1-1
Edition 1.0 2007-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology – Environmental and endurance test methods for
surface mount solder joint –
Part 1-1: Pull strength test
Technologie de montage en surface – Méthodes d’essais d’environnement et
d’endurance des joints brasés montés en surface –
Partie 1-1: Essai de résistance à la traction

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
P
CODE PRIX
ICS 31.190 ISBN 2-8318-9782-3
– 2 – 62137-1-1 © IEC:2007
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .5
3 Terms and definitions .5
4 General remarks.6
5 Test equipment and materials.7
5.1 Flow soldering equipment.7
5.2 Reflow soldering equipment .7
5.3 Pull strength test equipment .7
5.4 Optical microscope.7
5.5 Test substrate .7
5.6 Solder alloy .8
5.7 Flux for flow soldering .8
5.8 Solder paste.8
6 Mounting method.8
6.1 Flow soldering.8
6.2 Reflow soldering.9
7 Test conditions .10
7.1 Test: Rapid change of temperature.10
7.2 Pull strength test .10
8 Test procedure .10
8.1 Test sequence.10
8.2 Pre-conditioning .11
8.3 Initial pull strength measurement.11
8.4 Rapid change of temperature .11
8.5 Recovery.11
8.6 Intermediate/final pull strength measurement .11
9 Items to be included in the test report.11
10 Items to be given in the product specification .12
Annex A (normative) Pull strength test – Details .13
Bibliography.15

Figure 1 – Gull-wing leaded component .6
Figure 2 – Area under evaluation in the pull strength test.7
Figure 3 – Example of a flow soldering profile (actual measurement for double-wave
soldering) .9
Figure 4 – Typical reflow profile .10
Figure 5 – Test procedure.11
Figure A.1 – Pull strength test.14
Figure A.2 – An example of the shape of the tip of the pulling jig .14
Figure A.3 – Failure modes in pull strength test .14

62137-1-1 © IEC:2007 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS
FOR SURFACE MOUNT SOLDER JOINT –

Part 1-1: Pull strength test
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62137-1-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This bilingual version, published in 2008-05, corresponds to the English version.
The text of this standard is based on the following documents:
FDIS Report on voting
91/681/FDIS 91/697/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.

– 4 – 62137-1-1 © IEC:2007
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62137 series, under the general title Surface mounting
technology – Environmental and endurance test methods for surface mount solder joint, can
be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result
...