Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers

Provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave frequency prescalers. This consolidated version consists of the first edition (2001) and its amendment 1 (2007). Therefore, no need to order amendment in addition to this publication.

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IEC 60747-16-2
Edition 1.1 2008-01

Semiconductor devices –
Part 16-2: Microwave integrated circuits – Frequency prescalers

IEC 60747-16-2:2001+A1:2007(E)

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IEC 60747-16-2
Edition 1.1 2008-01

Semiconductor devices –
Part 16-2: Microwave integrated circuits – Frequency prescalers

ICS 31.080.01 ISBN 2-8318-9451-4

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1 Scope.5
2 Normative references.5
3 Terms and definitions .5
4 Essential ratings and characteristics.7
4.1 General.7
4.2 Application-related description .7
4.3 Specification of the function .8
4.4 Limiting values (absolute maximum rating system) .10
4.5 Operating conditions (within the specified operating temperature range) .11
4.6 Electrical characteristics.12
4.7 Mechanical and environmental ratings, characteristics and data.13
4.8 Additional information.13
5 Measuring methods.14
5.1 General.14
5.2 Output power (P ) .14
5.3 Output voltage (V ) .15
) .17
5.4 Minimum operating input power (P
i, min
5.5 Maximum operating input power (P ).18
i, max
5.6 Minimum operating input voltage (V ) .20
i, min
5.7 Maximum operating input voltage (V ) .22
i, max
5.8 Maximum input frequency (f ).24
i, max
5.9 Minimum input frequency (f ) .25
i, min
5.10 High-level modulus control input voltage (V
5.11 Low-level modulus control input voltage (V ) .28
5.12 High-level modulus control input current (I ) .29
5.13 Low-level modulus control input current (I ).30

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Part 16-2: Microwave integrated circuits –
Frequency prescalers

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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-16-2 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This consolidated version of IEC 60747-16-2 consists of the first edition (2001) [documents
47E/160/FDIS and 47E/172/RVD] and its amendment 1 (2007) [documents 47E/338/FDIS and
The technical content is therefore identical to the base edition and its amendment and has
been prepared for user convenience.
It bears the edition number 1.1.
A vertical line in the margin shows where the base publication has been modified by
amendment 1.

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The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the maintenance result date indicated on the IEC web site under
"" in the data related to the specific publication. At this date,
the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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60747-16-2 © IEC:2001+A1:2007(E) – 5 –

Part 16-2: Microwave integrated circuits –
Frequency prescalers

1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave frequency
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60617:2001, Graphical symbols for diagrams
IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60748-2, Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits
IEC 60748-3, Semiconductor devices. Integrated circuits – Part 3: Analogue integrated
IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated
IEC 61340-5-1:2007, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena - General requirements
IEC/TR 61340-5-2:2007, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
3 Terms and definitions
For the purpose of this part of IEC 60747, the following terms and definitions apply:
power supply voltage V
(terminal voltage)
d.c. voltage required to be applied to an 'i'-th terminal noted by 'xx'
power supply current I
d.c. current flowing through an 'i'-th terminal noted by 'xx'

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output power P
a.c. power measured at the output terminal
output voltage V
amplitude of voltage swing measured at the output terminal
input power P
a.c. power delivered to the input terminal
input voltage V
amplitude of input voltage swing
high-level modulus control input voltage V
control voltage value to transfer the division ratio from low-level modulus to high-level
low-level modulus control input voltage V
control voltage value to transfer the division ratio from high-level modulus to low-level
high-level modulus control input current I
control current value to transfer the division ratio from low-level modulus to high-level
low-level modulus control input current I
control current value to transfer the division ratio from high-level modulus to low-level
input frequency f
input frequency for which the device functions
division ratio N
ratio of the output frequency and input frequency
set-up time t
(under consideration)

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4 Essential ratings and characteristics
4.1 General
This clause gives ratings and characteristics required for specifying integrated circuit
microwave frequency prescalers used at the microwave or millimetre-wave frequency band.
The integrated circuits contain fixed and two modulus prescalers.
4.1.1 Circuit identification and types Designation and types
Indication of type (device name), category of circuit and technology applied should be given.
Microwave frequency prescalers are divided into two categories:
• type A: fixed modulus type;
• type B: two modulus type. General function description
A general description should be made of the function performed by the integrated circuit
microwave frequency prescalers, and the features for the application. Manufacturing technology
The manufacturing technology, e.g. semiconductor monolithic integrated circuit, thin film
integrated circuit, micro-assembly, should be stated. This statement should include details of
the semiconductor technologies such as MESFET, MISFET, MOSFET, Si bipolar transistor,
HBT, etc. Package identification
The following should be stated:
a) chip or packaged form;
b) IEC and/or national reference number of the outline drawing or of the drawing of a non-
standard package including terminal numbering;
c) principal package material, for example, metal, ceramic, plastic;
d) for chip form, outlines, dimensions, pad sizes, contact material, and recommended contact
technologies. Main application
The main application should be stated if necessary. If the device has restrictive applications,
these should be stated here.
4.2 Application-related description
Information on the application of the integrated circuit and its relation to the associated
devices should be given.

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4.2.1 Conformance to system and/or interface information
It should be stated whether the integrated circuit conforms to an application system and/or an
interface standard or recommendation.
Detailed information about application systems, equipment and circuits such as VSAT
systems, DBS receivers, and microwave landing systems should also be given.
4.2.2 Overall block diagram
A block diagram of the applied systems should be given if necessary.
4.2.3 Reference data
The most important properties required to permit comparison between derivative types should
be given.
4.2.4 Electrical compatibility
It should be stated whether the integrated circuit is electrically compatible with other particular
integrated circuits or families of integrated circuits, or whether special interfaces are required.
Details should be given concerning the type of input and output circuits, for example,
input/output impedances, d.c. block, open-drain.
Interchangeability with other devices, if any, should be given.
4.2.5 Associated devices
If applicable, the following should be stated here:
– devices necessary for correct operation (list with type number, name, and function);
– peripheral devices with direct interfacing (list with type number, name, and function).
4.3 Specification of the function
4.3.1 Detailed block diagram-functional blocks
A detail block diagram or equivalent circuit information concerning the integrated circuit
microwave frequency prescalers should be given. The block diagram should be composed of
the following:
a) functional blocks;
b) mutual interconnections among the functional blocks;
c) individual functional units within the functional blocks;
d) mutual interconnections among the individual functional blocks;
e) function of each external connection;
f) inter-dependence between the separate functional blocks.
The block diagram should identify the function of each external connection, and where no
ambiguity can arise, can also show the terminal symbols and/or numbers. If the encapsulation
has metallic parts, any connection to them from external terminals should be indicated. The
connections with any associated external electrical elements should be stated, where

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For the purpose of providing additional information, the complete electrical circuit diagram can
be reproduced, though this will not necessarily involve giving indications of the function. Rules
governing such diagrams may be obtained from IEC 60617.
4.3.2 Identification and function of terminals
All terminals should be identified on the block diagram (supply terminals, input or output
terminals, input/output terminals).
The terminal functions 1) to 4) should be indicated in a table as follows:
Function of terminal
1) Terminal
3) Input/output 4) Type of
Terminal number Terminal symbol 2) Function
identification input/output

1) Terminal designation
A terminal name indicating the function of the terminal should be given. Supply terminals,
ground terminals, blank terminals (with abbreviation NC) and non-usable terminals (with
abbreviation NU) should be distinguished.
2) Function
A brief indication of terminal function should be given:
– each function of multi-role terminals, i.e. terminals having multiple functions;
– each function of integrated circuits selected by mutual pin connections or function
selection data applied to the function selection pin such as mode selection pin.
3) Input/output identification
Input, output, input/output, and multiple input/output terminals should be distinguished.
4) Type of input/output circuits
The type of input and output circuits, for example, input/output impedances, with or
without d.c. block, etc., should be distinguished.
5) Type of ground
If the baseplate of the package is used as ground, this should be stated.
Supply voltages
Input(s) NC
NU Output(s)
IEC  113/01

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4.3.3 Functional description
The function performed by the circuit should be specified and include the following
– basic function;
– relation to external terminals;
– operation mode (for example, set-up method, preference, etc.);
– interrupt handling.
4.3.4 Family-related characteristics
In this part, all family specific functional descriptions shall be provided (with reference to
IEC 60748-2, IEC 60748-3 and IEC 60748-4).
If ratings and characteristics and function characteristics exist for the family, the relevant part
of IEC 60748 should be used (for example, for microprocessors, see IEC 60748-2, Chapter III,
section 3).
NOTE For each new device family, specific items shall be added to the relevant part of IEC 60748.
4.4 Limiting values (absolute maximum rating system)
The table of these values should contain the following.
– Any interdependence of limiting conditions shall be specified.
– If externally connected and/or attached elements, for example heatsinks, have an
influence on the values of the ratings, the ratings shall be prescribed for the integrated
circuit with the elements connected and/or attached.
– If limiting values are exceeded for transient overload, the permissible excess and their
durations shall be specified.
– Where minimum and maximum values differ during programming of the device, this should
be stated.
– All voltages are referenced to a specified reference terminal (V , GND, etc.).
– In satisfying the following clauses, if maximum and/or minimum values are quoted, the
manufacturer must indicate whether he refers to the absolute magnitude or to the
algebraic value of the quantity.
– The ratings given must cover the operation of the multi-function integrated circuit over the
specified range of operating temperatures. Where such ratings are temperature-
dependent, such dependence should be indicated.
4.4.1 Electrical limiting values
Limiting values should be specified as follows:

Subclause Parameters Min. Max. Power supply voltage(s) + + Power supply current(s) (where appropriate) + Terminal voltage(s) (where appropriate) + + Terminal current(s) (where appropriate) + Input power + Power dissipation (where appropriate) +

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The detail specification may indicate those values within the table including notes 1 and 2.
Parameters Symbols Min. Max. Unit
(Note 1, Note 2)

NOTE 1 Where appropriate, in accordance with the type of circuit considered.
NOTE 2 For power supply voltage range:
– limiting value(s) of the continuous voltage(s) at the supply terminal(s) with respect to a
special electrical reference point;
– where appropriate, limiting value between specified supply terminals;
– when more than one voltage supply is required, a statement should be made as to
whether the sequence in which these supplies are applied is significant; if so, the
sequence should be stated;
– when more than one supply is needed, it may be necessary to state the combinations of
ratings for these supply voltages and currents.

4.4.2 Temperatures
a) Operating temperature (ambient or reference-point temperature)
b) Storage temperature
c) Channel temperature
d) Lead temperature (for soldering)
The detail specification may indicate those values within the table including the note.
Parameters Symbols Min. Max. Unit

NOTE Where appropriate, in accordance with the type of circuit considered.

4.5 Operating conditions (within the specified operating temperature range)
They are not to be inspected but may be used for quality assessment purposes.
4.5.1 Power supplies – positive and/or negative values
4.5.2 Initialization sequences (where appropriate)
If special initialization sequences are necessary, the power supply sequencing and
initialization procedure should be specified.
4.5.3 Input voltage(s) or input signal (where appropriate)
For RF input signal, waveform and characteristic impedance should be specified.
4.5.4 Output current(s) (where appropriate)
RF or d.c. current with relevant impedance should be specified.

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4.5.5 Voltage and/or current of other terminal(s)
4.5.6 External elements (where appropriate)
4.5.7 Operating temperature range
4.6 Electrical characteristics
The characteristics shall apply over the full operating temperature range, unless otherwise
Each characteristic should be stated: either
a) over the specified range of operating temperatures, or
b) at a temperature of 25 °C, and at maximum and minimum operating temperatures.
The parameters should be specified according to the type as follows:
Subclause Types
Parameters Min.Typ* Max.
4.6.1 Power supply current(s) + + + +
4.6.2 Output power + + + +
4.6.3 Output voltage + + + +
4.6.4 Minimum operating input power + + + +
4.6.5 Maximum operating input power + + + +
4.6.6 Minimum operating input voltage + + + +
4.6.7 Maximum operating input voltage + + + +
4.6.8 High-level modulus control input voltage + + + +
4.6.9 Low-level modulus control input voltage + + + +
4.6.10 High-level modulus control input current + + +
4.6.11 Low-level modulus control input current + +  +
4.6.12 Minimum operating input frequency + + + +
4.6.13 Maximum operating input frequency + + + +
4.6.14 Set-up time + + + +
* Optional.
NOTE 1 It is necessary to select either the parameter set of 4.6.2, 4.6.4 and 4.6.5 or that of 4.6.3,
4.6.6 and 4.6.7.
NOTE 2 The values of 4.6.2 and 4.6.3 depend on output impedance.
NOTE 3 The values of 4.6.4, 4.6.5, 4.6.6 and 4.6.7 depend on input impedance.

The detail specification may indicate those values within the table.
Characteristics Symbols Conditions Min. Typ.* Max. Units

* Optional

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4.7 Mechanical and environmental ratings, characteristics and data
Any specific mechanical and environmental ratings applicable should be stated. (See also
Clauses 5.10 and 5.11 of IEC 60747-1.)
4.8 Additional information
Where appropriate, the information detailed in the following subclauses should be given.
4.8.1 Equivalent input and output circuit
Detail information should be given regarding the type of input and output circuits, for example,
input/output impedances, d.c. block, open-drain.
4.8.2 Internal protection
A statement shall be given to indicate whether the integrated circuit contains internal
protection against high static voltages or electrical fields.
4.8.3 Capacitors at terminals
If capacitors for input/output d.c. block are needed, these capacitances should be stated.
4.8.4 Thermal resistance
4.8.5 Interconnections to other types of circuit
Where appropriate, details of the interconnections to other circuits, for example, detector
circuit for AGC, sense amplifiers, buffer, should be given.
4.8.6 Effects of externally connected component(s)
Curves or data indicating the effect of externally connected component(s) that influence the
characteristics may be given.
4.8.7 Recommendations for any associated device(s)
For example, decoupling of the power supply to a high-frequency device should be stated.
4.8.8 Handling precautions
Where appropriate, handling precautions specific to the circuit should be stated. (See also
IEC 61340-5-1 and IEC/TR 61340-5-2 concerning electrostatic-sensitive devices.)
4.8.9 Application data
4.8.10 Other application information
4.8.11 Date of issue of the data sheet

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5 Measuring methods
5.1 General
This clause prescribes measuring methods for electrical characteristics of integrated circuit
microwave frequency prescalers used at microwave frequency bands.
5.1.1 General precautions
The general precautions listed in Clauses 6.3, 6.4 and 6.6 of IEC 60747-1, will be applied. In
addition, special care should be taken to use low-ripple d.c. supplies and to decouple
adequately all bias supply voltages at the frequency of measurement. Although the level of
the input and/or output signal can be specified in either power or voltage, in this document it
is expressed in power unless otherwise specified.
5.1.2 Characteristic impedance
Input/output impedances of the device should be fixed. Generally, the input impedance of the
device should be 50 Ω; if it is much higher than 50 Ω, then a shunt resistor of 50 Ω should be
connected to the port.
5.1.3 Handling precautions
When handling electrostatic-sensitive devices, reference should be made to the handling
precautions given in IEC 61340-5-1 and IEC/TR 61340-5-2.
5.1.4 Types
The devices in this clause are both packaged and chip types.
5.2 Output power (P )
5.2.1 Purpose
To measure the output power under specified conditions.
5.2.2 Circuit diagram
Signal Power Power Power
generator divider divider divider
f f
dB being
Bias supply
f W
Frequency Power Power
meter meter 1 meter 2
IEC  114/01

Figure 1 – Circuit for the measurement of output power

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5.2.3 Principle of measurements
In the circuit diagram shown in figure 1, the input power P and output power P of the device
i o
being measured are derived from the following equation:
P = P – L (1)
i 1 1

P = P – L (2)
o 2 2
where P and P are the values indicated by power meters 1 and 2, respectively; L is the
1 2 1
power difference between points A and B; L is defined by a subtraction from the power
at point A to the power at point B; L is defined by a subtraction from the power at point D to
the power at the point C; P , P , P and P are expressed in dBm; and L and L are
i o 1 2 1 2
expressed in dB.
5.2.4 Circuit description and requirements
The circuit losses L and L should be measured beforehand. f is the frequency of the output
1 2 o
signal, which equals the divided input frequency f by the division ratio N.
5.2.5 Precautions to be observed
The output signa

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