IEC 60747-14-1:2010
(Main)Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
IEC 60747-14-1:2009 describes general items concerning the specifications for sensors, which are the basis for specifications given in other parts of this series for various types of sensors. Sensors described in this standard are basically made of semiconductor materials, however, the statements made in this standard are also applicable to sensors using materials other than semiconductor, for example dielectric and ferroelectric materials. The major changes with regard to the previous edition are as follows: a) Title change from "Semiconductor sensors - General and classification" to "Semiconductor sensors - Generic specification for sensors"; b) Clause 3 has been divided into three Clauses 3, 4 and 5; c) Added new terms from IEC 60747-14-5; d) Added a new Clause relating to Quality assessment procedures; e) Added a Bibliography; f) Added a new Annex for the sampling procedure.
Dispositifs à semiconducteurs - Partie 14-1: Capteurs à semiconducteurs - Spécification générique pour les capteurs
La CEI 60747-14-1:2009 décrit des points généraux concernant les spécifications pour capteurs, qui sont le fondement des spécifications données dans d'autres parties de cette série pour divers types de capteurs. Les capteurs décrits dans cette norme sont essentiellement constitués de matériaux semi-conducteurs; cependant, les indications figurant dans la présente norme sont également applicables aux capteurs utilisant des matériaux autres que semiconducteurs, comme par exemple, des matériaux diélectriques et ferroélectriques. Les modifications principales par rapport à l'édition précédente sont les suivantes: a) Modification du titre, antérieurement "Capteurs à semiconducteurs - Généralités et classification" remplacé par "Capteurs à semiconducteurs - Spécification générique pour les capteurs"; b) L'Article 3 a été divisé en trois Articles 3, 4 et 5; c) Ajouts de nouveaux termes de la CEI 60747-14-5; d) Ajout d'un nouvel Article relatif aux Procédures d'assurance de la qualité; e) Ajout d'une Bibliographie; f) Ajout d'une Annexe relative à la procédure d'échantillonnage.
General Information
Standards Content (Sample)
IEC 60747-14-1
®
Edition 2.0 2010-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 14-1: Semiconductor sensors – Generic specification for sensors
Dispositifs à semiconducteurs –
Partie 14-1: Capteurs à semiconducteurs – Spécification générique pour les
capteurs
IEC 60747-14-1:2010
---------------------- Page: 1 ----------------------
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IEC 60747-14-1
®
Edition 2.0 2010-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 14-1: Semiconductor sensors – Generic specification for sensors
Dispositifs à semiconducteurs –
Partie 14-1: Capteurs à semiconducteurs – Spécification générique pour les
capteurs
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.080.01 ISBN 978-2-88910-276-1
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
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CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .5
3 Terminology, units, letter symbols, terms and definitions .6
3.1 Terminology, units and letter symbols.6
3.2 Terms and definitions .8
4 Standard environmental conditions.12
5 Marking .12
6 Quality assessment procedures.12
6.1 General .12
6.2 Eligibility .12
6.3 Qualification approval procedure .13
7 Test and measurement procedures.18
7.1 Standard conditions and general precautions .18
7.2 Physical examination.18
7.3 Climatic and mechanical tests .19
7.4 Alternative test methods .19
Annex A (normative) Sampling procedures .20
Bibliography.21
Figure 1 – Output-measurand relationship of a linear-output sensor with an offset.9
Figure 2 – Hysteresis and repeatability. .11
Table 1 – Measurands .6
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60747-14-1 © IEC:2010 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 14-1: Semiconductor sensors –
Generic specification for sensors
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-14-1 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This second edition cancels and replaces the first edition, published in 2000, and constitutes
a technical revision.
The major changes with regard to the previous edition are as follows:
a) Title change from "Semiconductor sensors - General and classification" to "Semiconductor
sensors - Generic specification for sensors";
b) Clause 3 has been divided into three Clauses 3, 4 and 5;
c) Added new terms from IEC 60747-14-5;
d) Added a new Clause relating to Quality assessment procedures;
e) Added a Bibliography;
f) Added a new Annex for the sampling procedure.
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The text of this standard is based on the following documents:
FDIS Report on voting
47E/387/FDIS 47E/391/RVD
Full information on the voting for the approval on this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The list of all parts of the IEC 60747 series, under the general title Semiconductor devices –
Discrete devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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60747-14-1 © IEC:2010 – 5 –
SEMICONDUCTOR DEVICES –
Part 14-1: Semiconductor sensors –
Generic specification for sensors
1 Scope
This part of IEC 60147-14 describes general items concerning the specifications for sensors,
which are the basis for specifications given in other parts of this series for various types of
sensors. Sensors described in this standard are basically made of semiconductor materials,
however, the statements made in this standard are also applicable to sensors using materials
other than semiconductor, for example dielectric and ferroelectric materials.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60068-2 (all parts), Environmental testing – Part 2: Tests
IEC 60410, Sampling plans and procedures for inspection by attributes
IEC 60617-DB, Graphical symbols for diagrams
IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60749 (all parts), Semiconductor device – Test method of mechanical and environment test
IEC 62047-1, Semiconductor devices – Micro-electromechanical devices – Part 1: Terms and
definitions
ISO 1000, SI units and recommendations for the use of their multiples and of certain other
units
ISO 2859-1, Sampling procedures for inspection by attributes – Part 1: Sampling schemes
indexed by acceptance quality limit (AQL) for lot-by-lot inspection
IEC 61193-2, Quality assessment systems – Part 2: Selection and use of sampling plans for
inspection of electronic components and packages
IEC QC 001002-3:2005, IEC Quality Assessment System for Electronic Components (IECQ) –
Rules of Procedure – Part 3: Approval procedures
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3 Terminology, units, letter symbols, terms and definitions
3.1 Terminology, units and letter symbols
For the purposes of this document, the terms and definitions given in IEC 62047-1 and the
following apply.
Units, graphical and letter symbols shall, wherever possible, be taken from the following
standards:
IEC 60027;
IEC 60617;
ISO 1000.
Any other units, symbols or terminology peculiar to one of the devices covered by this generic
specification shall be taken from the relevant IEC or ISO standards (see Clause 2) or derived
in accordance with the principles of the standards listed above.
Table 1 lists the measurands which are defined as the input quantities, properties, or
conditions that are to be detected or measured by sensors. For example if the measurand is
heat, it is measured by a thermal sensor; if it is pressure, it is measured by a pressure sensor.
The measurands, arranged in alphabetical order are: acoustic, biological, chemical, electrical,
magnetic, mechanical, optical, radiational, and thermal properties. Each entry in Table 1 not
only represents the measurand itself, but also its temporal or spatial distribution.
Table 1 – Measurands
1 Acoustic
1.1 Wave amplitude, phase, polarization, spectrum
1.2 Wave velocity
1.3 Other (specify)
2 Biological
2.1 Biomass (identities, concentrations, states)
2.2 Other (specify)
3 Chemical
3.1 Components (identities, concentrations, states)
3.2 Other (specify)
4 Electrical
4.1 Charge, current
4.2 Potential, potential difference
4.3 Electric field (amplitude, phase, polarization, spectrum)
4.4 Conductivity
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60747-14-1 © IEC:2010 – 7 –
4.5 Permittivity
4.6 Other (specify)
5 Magnetic
5.1 Magnetic field (amplitude, phase, polarization, spectrum)
5.2 Magnetic flux
5.3 Other (specify)
6 Mechanical
6.1 Position (linear, angular)
6.2 Velocity
6.3 Acceleration
6.4 Force
6.5 Stress, pressure
6.6 Strain
6.7 Mass, density
6.8 Moment, torque
6.9 Speed or flow, rate of mass transport
6.10 Shape, roughness, orientation
6.11 Stiffness, compliance
6.12 Viscosity
6.13 Crystallinity, structural integrity
6.14 Level (of liquid)
6.15 Other (specify)
7 Optical
7.1 Wave amplitude, phase, polarization, spectrum
7.2 Wave velocity
7.3 Other (specify)
8 Radiation
8.1 Type
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8.2 Energy
8.3 Intensity
8.4 Other (specify)
9 Thermal
9.1 Temperature
9.2 Flux
9.3 Specific heat
9.4 Thermal conductivity
9.5 Other (specify)
10 Humidity
10.1 Humidity, moisture
11 Other (specify)
3.2 Terms and definitions
3.2.1
ambient conditions allowed
specified tolerance which the sensor can perform, including temperature, acceleration,
vibration, shock, ambient pressure (e.g. high altitudes), moisture, corrosive materials, and
electromagnetic field
IEC 60721-2-1 and IEC60 721-3-0 shall be referred to for basic conditions.
3.2.2
bias
voltage or current that apply to signal electrode, etc., to decide action datum of sensor
3.2.3
full scale output
upper limit of sensor output over the measuring range
3.2.4
full scale span
FSS
algebraic difference between the end points of the output. The upper limit of sensor output
over the measuring range is called the full scale output (FSO), see Figure 1. This signal is the
sum of the offset signal plus the full scale span
3.2.5
hysteresis
maximum difference in output, at any measurand value, within the measuring range when the
value is approached first with an increasing and then decreasing measurand (Figure 2).
Hysteresis is expressed in percent of FSO during one calibration cycle
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60747-14-1 © IEC:2010 – 9 –
3.2.6
input full scale
upper limit of sensor input over the measuring range
3.2.7
linearity
closeness between the calibration curve and a specified straight line. There are two basic
methods for calculating linearity: end point straight line fit or a least squares best line fit.
While a least squares fit gives the “best case” linearity error (lower numerical value), the
calculations required are burdensome. Conversely, an end point fit will give the “worst case”
error (often more desirable in error budget calculations) and the calculation are more
straightforward for the user. The result is called the end-point or terminal linearity
3.2.8
long term stability
ability that can keep feature of sensor during certain period
3.2.9
measuring range
set of values for a measurand for which the error of a measuring instrument is intended to lie
within specified limits (Figure 1)
NOTE 1 The upper and lower limits of the specified measuring range are sometimes called “maximum capacity”
and “minimum capacity”, respectively.
NOTE 2 In some other fields of knowledge, “range” is used to mean the difference between the greatest and the
smallest values.
3.2.10
measurable temperature range
temperature range that sensor can measure
3.2.11
offset
output of a sensor, under room-temperature condition unless otherwise specified, with zero
measurand applied (Figure 1)
Output
(e.g. voltage)
Full scale output (FSO)
100 %
0 %
Measurand
Measuring range
(e.g pressure)
IEC 2462/09
Figure 1 – Output-measurand relationship of a linear-output sensor with an offset
Full scale span (FSS)
1
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3.2.12
operating life
minimum duration over which the sensor will operate, either continuously or over a number of
on-off cycles whose duration is specified, without changing performance characteristics
beyond specified tolerances
3.2.13
operating temperature range
temperature range that sensor can operate in without giving damage in sensor normally
3.2.14
output quantity
output is usually the electrical quantity produced by a sensor and is a function of the
measurable. The output format includes analogue output (e.g. a continuous function of the
measurand such as voltage amplitude, voltage ratio, and changes in capacitance). Frequency
output (i.e. the number of cycles or pulses per second as a function of the measurand) and
frequency-modulated output (i.e. frequency deviation from a centre frequency) are also forms
of analogue output. Another output format is the digital output which represents the
measurand in the form of discrete quantities coded in some system of notation (e.g. binary
code)
3.2.15
overload characteristics
overload (or overrange) is the maximum magnitude of measurand that can be applied to a
sensor without causing a change in performance beyond specified tolerance. A key parameter
of the overload characteristics is the recovery time, which is the amount of time allowed to
elapse after removal of an overload condition before the sensor again performs within the
specified tolerance
3.2.16
precision
ability that can measure real value repeatedly
3.2.17
repeatability
ability of a sensor to reproduce output readings at room temperature, unless otherwise
specified, when the same measurand is applied to it consecutively, under the same conditions
and in the same direction (Figure 2). It is expressed as the maximum difference between
output readings as determined by two calibration cycles (Figure 2). It is usually stated as
"within x % FSO"
3.2.18
resolution
minimal change of the value necessary to produce a detectable change at the output. When
the measurand increment is from zero, it is called the threshold
3.2.19
selectivity
ability of sensor to measure one (e.g. one chemical component) in the presence of others
3.2.20
sensitivity
ratio of the change in sensor output to the change in the value of the measurable. It is the
slope of the calibration curve (Figure1). For a sensor in which the output y is related to the
measurand x by the equation y = f(x), the sensitivity S(x ), at point x is
a a
dy
S ( x ) =
a
dx
x = x
a
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60747-14-1 © IEC:2010 – 11 –
It is desirable to have a high and, if possible, constant sensitivity. For a sensor having y =
kx+b, where k and b are constants, the sensitivity S is k for the entire measuring range. For a
2
sensor having y = kx +b, the sensitivity S is 2kx and changes from one point to another over
the measuring range
3.2.21
sensor
device which is affected by the measurand (stimulus) and provides an output quantity
(response)
3.2.22
supply voltage range
supply voltage range not to affect the change for sensibility and feature of sensor
3.2.23
span
modulus of the difference between the two limits of the range
3.2.24
stability
ability of a sensor to maintain its performance characteristics for a certain period of time.
Unless otherwise stated, stability is the ability of a sensor to reproduce output readings,
obtained during the original calibration, and constant room conditions, for a specified period of
time. It is typically expressed as a percentage of FSO
3.2.25
temperature coefficient
ratio of resistance change to temperature change
3.2.26
time of response
time interval, with the apparatus in a warmed-up condition, between the time when an
instantaneous variation in volume ratio is produced at the apparatus inlet and the time when
the response reaches a stated percentage (x) of the final indication.
Output
Repeatability
Hysteresis
Start
0 %
100 % Measurand
IEC 2463/09
Figure 2 – Hysteresis and repeatability
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4 Standard environmental conditions
Standard environmental conditions for the measurement of characteristics, for tests and
operating conditions are at temperature of 25 °C ± 3 °C, a relative humidity of 25 % to 85 %,
and pressure of 86 kPa to 106 kPa.
5 Marking
5.1.1 Device identification
The marking on the device shall enable clear identification of the device.
5.1.2 Device traceability
The device shall be provided with a traceability code which enables back-tracing of the device
to a certain production or inspection lot.
5.1.3 Packing
Marking on the packing shall state:
a) the device identification code;
b) the traceability code(s) of the enclosed devices;
c) the number of enclosed devices;
d) the required precautions, if any.
This marking shall be in accordance with custom regulations.
NOTE Additional requirements can be specified in the relevant detail specification.
6 Quality assessment procedures
6.1 General
When this standard, and related standard are used for the purpose of a full quality
assessment system such as IEC Quality Assessment System for Electronic Components
(IECQ), Clause 4 applies.
6.2 Eligibility
6.2.1 Eligibility for qualification and/or capability approval
A type of device becomes eligible for qualification and/or capability approval when the rules of
the following procedures are satisfied: IEC QC 001002-3:2005, Clause 3: Qualification
Approval of electronic components, describing the procedure for qualification approval (QA),
the release for delivery and validity of release.
6.2.2 Primary stage of manufacture
The primary stage of manufacture is defined in the sectional specification.
6.2.3 Formation of inspection lots
See the rules of procedure given in 3.3.1 of IEC QC 001002-3:2005.
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60747-14-1 © IEC:2010 – 13 –
6.2.4 Structurally similar device
See the rules of procedure given in 3.3.2 of IEC QC 001002-3:2005.
6.2.5 Subcontracting
The use of subcontracting is permitted, unreservedly.
See the rules of procedure given in 3.1.2.3 to 3.1.2.7 of IEC QC 001002-3:2005.
6.2.6 Incorporated components
See the rules of procedure given in 5.2.3 of IEC QC 001002-3:2005.
6.2.7 Validity of release
See the rules of procedure given in 3.2.2 of IEC QC 001002-3:2005.
6.3 Qualification approval procedure
6.3.1 Qualification approval testing
Methods a), b) or c) of IEC QC 001002-3:2005, Subclause 3.1.4 of the rules of procedure may
be used at the manufacturer's discretion in accordance with the inspection requirements given
in the sectional or blank detail specifications.
Samples may be composed of appropriate structurally similar devices.
All measurements called for in the detail specification shall be recorded.
The qualification report shall include a summary of all the test results for each group and
subgroup, including number of devices tested and number of devices failed. This summary
shall be derived from the recorded data. The manufacturer shall retain all data for submission
to the NSI on demand.
6.3.2 Environmental and climatic tests
For environmental and climatic tests, refer to IEC 60749 series.
6.3.3 Granting of qualification approval
6.3.3.1 General
See the rules of procedure given in 3.1.5 of IEC QC 001002-3:2005.
Quality conformance tests are those tests which are performed on a lot-by-lot basis and
periodically on specimens taken from production to establish that the quality of the product is
being maintained. The sectional or detail specification shall prescribe those tests which have
to be performed.
6.3.3.2 Lot-by-lot inspection
Lot-by-lot tests are carried out on each inspection lot. The results are used to determine
whether the lot complies with the specified requirements.
Lot-by-lot tests may be divided into two groups:
– Group A, covering visual and dimensional inspection of the devices and the principal
characteristics of the devices (initial measurement);
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– Group B, covering additional important characteristics.
Each group may be divided into two or more subgroups. The following subgroups are
recommended.
Subgroup A1
This subgroup comprises a visual examination as specified in 7.2.1.
Subgroup A2
This subgroup comprises measurements of primary electrical characteristics of the device.
Subgroup A3
This subgroup comprises measurements of primary optical characteristics of the device.
Subgroup A4 and A5
These subgroups may not be required. They comprise measurements of secondary
characteristics of the device. The correct requirements for each device quality cate
...
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