IEC PAS 62307:2002
(Main)Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits
Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits
Details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of IC components. These two material properties are important parameters for the effective reliability performance of plastic packaged ICs after exposure to moisture and subjected to high temperature solder reflow.
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IEC/PAS 62307
Edition 1.0
2002-03
Test method for the measurement
of moisture diffusivity and water solubility in
organic materials used in integrated circuits
PUBLICLY AVAILABLE SPECIFICATION
INTERNATIONAL Reference number
ELECTROTECHNICAL
IEC/PAS 62307
COMMISSION
JEDEC
STANDARD
Test Method for the Measurement of
Moisture Diffusivity and Water
Solubility in Organic Materials Used in
Integrated Circuits
JESD22-A120
JUNE 2001
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHOD FOR THE MEASUREMENT
OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN
ORGANIC MATERIALS USED IN INTEGRATED CIRCUITS
FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the
public and established in an organization operating under given procedures.
IEC-PAS 62307 was submitted by the JEDEC and has been processed by IEC technical committee 47:
Semiconductor devices.
This PAS was approved for
The text of this PAS is based on the
publication by the P-members of the
following document:
committee concerned as indicated in
the following document:
Draft PAS Report on voting
47/1595/PAS 47/1608/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and JEDEC and is
recorded at the Central Office.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical
committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work.
International, governmental and non-governmental organizations liaising with the IEC also participate in this
preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance
with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form of
standards, technical specifications, technical reports or guides and they are accepted by the National Committees in
that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any divergence
between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.
NOTE DIN 53495 has been withdrawn and replaced by DIN EN ISO 62:1999-08.
Page i
JEDEC Standard No. 22-A120
Page 1
Standard Test Method for the Measurement of Moisture Diffusivity and Water Solubility
in Organic Materials Used in Integrated Circuits
(From JEDEC Board Ballot JCB-00-62, formulated under the cognizance of the JC-14.1 Subcommittee
on Reliability Test Methods for Packaged Devices)
1 Scope
This specification details the procedures for the measurement of characteristic bulk material properties of
moisture diffusivity and water solubility in organic materials used in the packaging of IC components.
These two material properties are important parameters for the effective reliability performance of plastic
packaged ICs after exposure to moisture and subjected to high temperature solder reflow.
This test method outlines the requirements necessary for the measurement of water sorption properties of
organic materials used in the packaging of IC components.
2 Reference documents
ASTM standard D570-98, “Standard Test Method for Water Absorption of Plastics”.
SEMI G66-96, “Test Method for the Measurement of Water Absorption Characteristics for
Semiconductor Plastic Molding Compounds”.
DIN 53495, “Determination of water absorption”.
3 Apparatus
3.1 Analytical balance capable of a resolution of either 0.00001g or 0.001% of sample weight.
3.2 High temperature oven capable of maintaining uniform temperatures from 100 °C – 250 °C ±2 °C.
3.3 Temperature / humidity chamber(s) capable of maintaining temperatures of 30 °C - 85 °C and
relative humidities from 60%RH – 85%RH. Within the chamber working area, temperature
tolerance must be ±2 °C and the RH tolerance must be ±3%RH.
3.4 Perforated stainless steel trays or wire mesh baskets used for holding samples and for placement
into ovens.
3.5 Large aluminum plate or disk used for heat sink capability.
3.6Desiccator for holding dry samples.
Test Method A120
JEDEC Standard No. 22-A120
Page 2
4 Test samples
4.1 Test samples must be flat parallel-sided discs or coupons. The linear dimensions must be
accurately measured to within ±0.02mm.
4.1.1 To approximate one-dimensional diffusion behavior with edge effects limited to less than 5% of
the total diffusional moisture mass uptake, the free surface area in the thickness dimension must
be less than 5% of the flat-sided free surface area of the sample. For a disc of radius r, and
thickness h, the following relation must be met:
h < 0.05r (1)
for a coupon of length L, and width W,
0.05(W • L)
h < (2)
(W + L)
Recommended sample thickness should be in the range from 0.3 – 1.0mm. It is recommended
that the maximum sample thickness not exceed 1.0mm, because the time to achieve moisture
saturation at temperatures below 60 °C will be excessively long for slow diffusing compounds.
5 Procedure
5.1 Sample preparation
5.1.1 Prepare samples by using proper processing parameters as recommended by the material
supplier.
5.1.2 Process and cure the samples using recommended processing conditions per the manufacturer’s
specification.
5.1.3 To obtain the appropriate sample thickness as given by relations (1) or (2), samples may be
sectioned and finely polished from larger bulk specimens. Care must be taken to maintain near-
parallel sided flatness for samples prepared in this manner.
The prepared samples should be inspected for voids, both internal and surface. The ideal
samples should be nearly void free.
Test Method A120
JEDEC Standard No. 22-A120
Page 3
5 Procedure (cont’d)
5.2 Absorption measurements below 100 °C.
5.2.1 Measure the linear dimensions of the prepared sample to the nearest ±0.02mm. Record the
sample thickness, h, and calculate the
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