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IEC 60749-39:2006

(Main)

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 39: Mesure de la diffusion d'humidité et de l'hydrosolubilité dans les matériaux organiques utilisés dans les composants à semiconducteurs

Détaille les procédures pour la mesure des propriétés caractéristiques de la diffusion d'humidité et de l'hydrosolubilité dans les matériaux organiques utilisés dans l'encapsulation des composants à semiconducteurs. Ces deux propriétés des matériaux sont des paramètres importants pour la performance de fiabilité des semiconducteurs sous boîtier en plastique après exposition à l'humidité et étant soumis à une refusion à température élevée au moment du brasage.

General Information

Status
Published
Publication Date
23-Jul-2006
ICS
01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
31.080.01 - Semiconductor devices in general
Technical Committee
TC 47 - Semiconductor devices
Drafting Committee
WG 2 - TC 47/WG 2
Current Stage
DELPUB - Deleted Publication
Start Date
20-Oct-2020
Completion Date
29-Nov-2021
Ref Project

Relations

Revised
IEC 60749-39:2021 - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Effective Date
05-Sep-2023

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IEC 60749-39:2006 - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor componentsIEC 60749-39:2006 - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
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IEC 60749-39:2006 - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
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NORME CEI
INTERNATIONALE
IEC



60749-39
INTERNATIONAL


Première édition
STANDARD

First edition
2006-07

Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques
et climatiques –
Partie 39:
Mesure de la diffusion d'humidité et de
l'hydrosolubilité dans les matériaux organiques
utilisés dans les composants à semiconducteurs

Semiconductor devices –
Mechanical and climatic test methods –
Part 39:
Measurement of moisture diffusivity and
water solubility in organic materials used
for semiconductor components
Numéro de référence
Reference number
CEI/IEC 60749-39:2006

---------------------- Page: 1 ----------------------
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devient la CEI 60034-1. example, IEC 34-1 is now referred to as IEC 60034-1.
Editions consolidées Consolidated editions
Les versions consolidées de certaines publications de la The IEC is now publishing consolidated versions of its
CEI incorporant les amendements sont disponibles. Par publications. For example, edition numbers 1.0, 1.1
exemple, les numéros d’édition 1.0, 1.1 et 1.2 indiquent and 1.2 refer, respectively, to the base publication,
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---------------------- Page: 2 ----------------------
NORME CEI
INTERNATIONALE
IEC



60749-39
INTERNATIONAL


Première édition
STANDARD

First edition

2006-07


Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques
et climatiques –
Partie 39:
Mesure de la diffusion d'humidité et de
l'hydrosolubilité dans les matériaux org
...

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