IEC 60748-23-1:2002
(Main)Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
Applies to high quality hybrid integrated circuits (with films) incorporating special customer quality and reliability requirements. Hybrid integrated circuits may be fully or partly completed. Partly completed devices are those that may be supplied to customers for further processing.
General Information
Overview
IEC 60748-23-1:2002 is an International Electrotechnical Commission (IEC) generic specification for manufacturing line certification of high‑quality hybrid integrated circuits and film structures. The standard applies to hybrid integrated circuits (full or partly completed) that incorporate special customer quality and reliability requirements, and it provides a framework for documenting, qualifying and certifying production lines used to produce these semiconductor devices.
Key topics and requirements
The standard covers a broad set of technical and quality topics relevant to hybrid ICs and film structures, including:
- Definitions and normative references that establish vocabulary and mandatory cross‑references for certification activities.
- Manufacturing line certification process and generic specification scope for high‑quality hybrid integrated circuits (with films).
- Qualification and reliability testing guidance (environmental tests, electrical tests, burn‑in and life‑test procedures) to demonstrate product robustness.
- Mechanical and packaged device tests, inspection and acceptance criteria for parts, assemblies and film structures.
- Test and measurement procedures and sampling rules for production and qualification testing.
- Documentation and traceability requirements (drawn from the publication’s structure and references).
- Quality assessment and continual improvement processes for manufacturing lines, including guidance for supplier/customer interactions and line audits.
- Marking, product identification and delivery conditions for fully and partly completed devices.
The content emphasizes practical certification parameters rather than only product specifications - for example, methods for assessing production line capability and evidence required to confirm compliance with agreed quality and reliability levels.
Applications and practical value
IEC 60748-23-1 is intended to be used to:
- Certify a manufacturing line prior to or during production of high‑quality hybrid ICs and film‑based structures.
- Provide a common baseline for supplier–customer agreements where special reliability and quality needs exist.
- Guide quality engineers and test laboratories in establishing qualification test plans, sampling regimes and acceptance criteria.
- Support product audit, traceability and continual improvement programs for hybrid semiconductor manufacturing.
Using this standard helps reduce ambiguity in contractual quality expectations, improves reproducibility of qualification testing, and streamlines acceptance of partly completed devices supplied for further processing.
Who should use this standard
- Quality and reliability engineers in semiconductor and hybrid‑module manufacturers
- Production managers and process engineers responsible for manufacturing line certification
- Suppliers and customers needing a common certification basis for hybrid ICs and film structures
- Test laboratories and auditors performing qualification, environmental and electrical testing
Related standards
The publication references and aligns with other IEC documentation and catalog listings for electrical components and test methods. Users should consult accompanying IEC normative references and relevant part‑specific IEC standards for detailed test procedures and electrical specifications when implementing certification activities.
Keywords: IEC 60748-23-1, hybrid integrated circuits, manufacturing line certification, film structures, semiconductor quality, qualification testing, reliability testing, burn‑in, inspection, traceability.
Frequently Asked Questions
IEC 60748-23-1:2002 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification". This standard covers: Applies to high quality hybrid integrated circuits (with films) incorporating special customer quality and reliability requirements. Hybrid integrated circuits may be fully or partly completed. Partly completed devices are those that may be supplied to customers for further processing.
Applies to high quality hybrid integrated circuits (with films) incorporating special customer quality and reliability requirements. Hybrid integrated circuits may be fully or partly completed. Partly completed devices are those that may be supplied to customers for further processing.
IEC 60748-23-1:2002 is classified under the following ICS (International Classification for Standards) categories: 31.200 - Integrated circuits. Microelectronics. The ICS classification helps identify the subject area and facilitates finding related standards.
You can purchase IEC 60748-23-1:2002 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of IEC standards.
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INTERNATIONAL IEC
STANDARD
60748-23-1
QC 165000-1
First edition
2002-05
Semiconductor devices –
Integrated circuits –
Part 23-1:
Hybrid integrated circuits and film structures –
Manufacturing line certification –
Generic specification
Dispositifs à semiconducteurs –
Circuits intégrés –
Partie 23-1:
Circuits intégrés hybrides et structures par films –
Certification de la ligne de fabrication –
Spécification générique
© IEC 2002 ⎯ Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale
XC
International Electrotechnical Commission
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記事のタイトル：IEC 60748-23-1：2002-半導体デバイス-集積回路-パート23-1：ハイブリッド集積回路とフィルム構造-製造ライン認証-一般仕様 記事の内容：特定の顧客の品質と信頼性要件を満たす高品質のハイブリッド集積回路（フィルムを含む）に適用されます。ハイブリッド集積回路は完全に完成している場合と部分的に完成している場合があります。部分的に完成したデバイスは、顧客に追加の処理のために供給される場合があります。
The article discusses the manufacturing line certification for hybrid integrated circuits and film structures, according to the IEC 60748-23-1:2002 standard. This standard applies to high-quality hybrid integrated circuits that include films and meet specific customer quality and reliability requirements. These hybrid circuits can be either fully completed or partially completed, with the latter being supplied to customers for further processing.
기사 제목: IEC 60748-23-1:2002 - 반도체 소자 - 집적 회로 - 파트 23-1: 하이브리드 통합 회로 및 필름 구조 - 제조 라인 인증 - 일반 사양 기사 내용: 특별한 고객 품질 및 신뢰성 요구사항을 충족하는 고품질 하이브리드 통합 회로(필름 포함)에 적용됩니다. 하이브리드 통합 회로는 완전히 완성되었거나 일부가 완성된 상태일 수 있습니다. 일부 완성된 기기는 고객에게 추가 처리를 위해 공급될 수 있습니다.
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