SIST EN 62047-11:2014

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

This part of IEC 62047 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric etc.) microelectro- mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 μm and 1 mm and thickness between 0,1 μm and 1 mm, which are main structural materials used for MEMS, micromachines and others. This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30 % of a material’s melting temperature.

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 11: Prüfverfahren für lineare thermische Ausdehnungskoeffizienten für freistehende Werkstoffe der Mikrosystemtechnik

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 11: Méthode d'essai pour les coefficients de dilatation thermique linéaire des matériaux autonomes pour systèmes microélectromécaniques

La CEI 62047-11:2013 définit la méthode d'essai pour mesurer les coefficients de dilatation thermique linéaire (CLTE) de matériaux de systèmes micro-électromécaniques (MEMS) solides autonomes minces (métalliques, céramiques, polymères, etc.) dont la longueur est comprise entre 0,1 mm et 1 mm, la largeur entre 10 micrometre et 1 mm et l'épaisseur entre 0,1 micrometre et 1 mm, qui sont les matériaux structurels principaux utilisés pour les MEMS, les micromachines et autres. Cette méthode d'essai peut s'appliquer à la mesure des CLTE dans la gamme de températures allant de la température ambiante jusqu'à 30 % de la température de fusion du matériau.

Polprevodniški elementi - Mikroelektromehanski elementi - 11. del: Preskusna metoda za koeficiente linearnega toplotnega raztezanja samostojnih materialov za mikroelektromehanske sisteme (IEC 62047-11:2013)

Ta del standarda IEC 62047 določa preskusno metodo za merjenje koeficientov linearnega toplotnega raztezanja tankih samostojnih trdih (kovinskih, keramičnih, polimernih itd.) materialov za mikroelektromehanske sisteme (MEMS) z dolžino med 0,1 in 1 mm, širino med 10 μm in 1 mm ter debelino med 0,1 μm in 1 mm, ki so glavni konstrukcijski materiali, ki se uporabljajo za MEMS, mikrostroje in drugo. Ta preskusna metoda se uporablja za merjenje koeficientov linearnega toplotnega raztezanja v temperaturnem obsegu od sobne temperature do 30 % temperature taljenja materiala.

General Information

• Status: Published
• Publication Date: 09-Apr-2014
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 25-Mar-2014
• Due Date: 30-May-2014
• Completion Date: 10-Apr-2014
• Ref Project: EN 62047-11:2013 - Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62047-11:2014
01-maj-2014
Polprevodniški elementi - Mikroelektromehanski elementi - 11. del: Preskusna
metoda za koeficiente linearnega toplotnega raztezanja samostojnih materialov za
mikroelektromehanske sisteme (IEC 62047-11:2013)
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for
coefficients of linear thermal expansion of free-standing materials for micro-
electromechanical systems
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 11: Prüfverfahren
für lineare thermische Ausdehnungskoeffizienten für freistehende Werkstoffe der
Mikrosystemtechnik
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 11: Méthode
d'essai pour les coefficients de dilatation thermique linéaire des matériaux autonomes
pour systèmes microélectromécaniques
Ta slovenski standard je istoveten z: EN 62047-11:2013
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-11:2014 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62047-11:2014

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SIST EN 62047-11:2014

EUROPEAN STANDARD
EN 62047-11

NORME EUROPÉENNE
September 2013
EUROPÄISCHE NORM

ICS 31.080.99


English version


Semiconductor devices -
Micro-electromechanical devices -
Part 11: Test method for coefficients of linear thermal expansion
of free-standing materials for micro-electromechanical systems
(IEC 62047-11:2013)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauelemente der Mikrosystemtechnik -
Partie 11: Méthode d'essai pour les Teil 11: Prüfverfahren für lineare
coefficients de dilatation thermique thermische Ausdehnungskoeffizienten für
linéaire des matériaux autonomes pour freistehende Werkstoffe der
systèmes microélectromécaniques Mikrosystemtechnik
(CEI 62047-11:2013) (IEC 62047-11:2013)



This European Standard was approved by CENELEC on 2013-08-21. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

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the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
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Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

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European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-11:2013 E

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SIST EN 62047-11:2014
EN 62047-11:2013 - 2 -
Foreword
The text of document 47F/154/FDIS, future edition 1 of IEC 62047-11, prepared by IEC/TC 47F
"Microelectromechanical systems" of IEC/TC 47 "Semiconductor devices" was submitted to the
IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-11:2013.

The following dates are fixed:
(dop) 2014-05-21
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2016-08-21
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 62047-11:2013 was approved by CENELEC as a European
Standard without any modification.

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SIST EN 62047-11:2014
- 3 - EN 62047-11:2013
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 62047-3 - Semiconductor devices - Micro- EN 62047-3 -
electromechanical devices -
Part 3: Thin film standard test piece for
tensile-testing

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SIST EN 62047-11:2014

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SIST EN 62047-11:2014




IEC 62047-11

®


Edition 1.0 2013-07




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Semiconductor devices – Micro-electromechanical devices –

Part 11: Test method for coefficients of linear thermal expansion of free-standing

materials for micro-electromechanical systems




Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 11: Méthode d'essai pour les coefficients de dilatation thermique linéaire


des matériaux autonomes pour systèmes microélectromécaniques













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX R


ICS 31.080.99 ISBN 978-2-8322-0965-3



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62047-11:2014
– 2 – 62047-11 © IEC:2013
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative References . 5
3 Symbols and designations . 5
4 Test piece . 6
4.1 General . 6
4.2 Shape of test piece . 6
4.3 Test piece thickness . 6
4.4 In-plane type test piece . 7
4.5 Out-of-plane type test piece . 7
5 Testing method and test apparatus . 7
5.1 Measurement principle . 7
5.1.1 General . 7
5.1.2 In-plane method . 8
5.1.3 Out-of-plane method . 8
5.2 Test apparatus . 9
5.2.1 General . 9
5.2.2 In-plane method . 9
5.2.3 Out-of-plane method . 9
5.3 Temperature measurement . 9
5.4 In-plane test piece handling . 9
5.5 Thermal strain measurement . 10
5.6 Heating speed . 10
5.7 Data analysis . 10
5.7.1 General . 10
5.7.2 Terminal-based calculation . 10
5.7.3 Slope calculation by linear least squares method . 10
6 Test report . 10
Annex A (informative) Test piece fabrication . 12
Annex B (informative) Test piece handling example . 13
Annex C (informative) Test piece releasing process . 14
Annex D (informative) Out-of-plane test setup and test piece example . 15
Annex E (informative) Data analysis example in in-plane test method . 16
Annex F (informative) Data analysis example in out-of-plane test method . 17
Bibliography . 19

Figure 1 – Thin film test piece . 6
Figure 2 – CLTE measurement principles. 8
Figure A.1 – Schematic test piece fabrication process . 12
Figure B.1 – Auxiliary jigs and a specimen example . 13
Figure C.1 – Schematic illustration showing the test piece releasing process . 14
Figure D.1 – Example of test setup and test piece . 15
Figure E.1 – Example of CLTE measurement with an aluminium test piece . 16
Figure F.1 – Example of CLTE measurement with a gold test piece . 18

Table 1 – Symbols and designations . 5

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SIST EN 62047-11:2014
62047-11 © IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 11: Test method for coefficients of linear thermal expansion
of free-standing materials for micro-electromechanical systems

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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consensus of opinion on the relevant subjects since each technical committee has representation from all
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-11 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/154/FDIS 47F/161/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.

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SIST EN 62047-11:2014
– 4 – 62047-11 © IEC:2013
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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SIST EN 62047-11:2014
62047-11 © IEC:2013 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 11: Test method for coefficients of linear thermal expansion
of free-standing materials for micro-electromechanical systems




1 Scope
This part of IEC 62047 specifies the test method to measure the linear thermal expansion
coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric etc.) micro-
electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and
width between 10 µm and 1 mm and thickness between 0,1 µm and 1 mm, which are main
structural materials used for MEMS, micromachines and others. This test method is applicable
for the CLTE measurement in the temperature range from room temperature to 30 % of a
material’s melting temperature.
2 Normative References
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 62047-3, Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film
standard test piece for tensile-testing
3 Symbols and designations
Symbols and corresponding designations are given in Table 1.
Table 1 – Symbols and designations
Symbol Unit Designation
g
µm Gauge length
L µm Initial length of a test piece
0
L µm Length of a test piece at temperature T
T
T °C Temperature
t µm Thickness of a test piece
w µm Width of a test piece
Average coefficient of thermal expansion of a test
α 1/°C
av
piece
Average coefficient of thermal expansion of a
α 1/°C
S
substrate
δ µm Thermal deform
...