SIST EN 60747-16-10:2005

Semiconductor devices -- Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits

Specifies the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, manufacture and supply of monolithic microwave integrated circuits in compliance with the general requirements of the IECQ-CECC System for electronic components of assessed quality.

Halbleiterbauelemente -- Teil 16-10: Prüfplan für die Technikanerkennung (Technology Approval Schedule - TAS) für monolithische integrierte Mikrowellenschaltkreise

Dispositifs à semiconducteurs -- Partie 16-10: Format-cadre pour agrément de technologie (TAS) pour circuits intégrés monolithiques hyperfréquences

Specifies the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, manufacture and supply of monolithic microwave integrated circuits in compliance with the general requirements of the IECQ-CECC System for electronic components of assessed quality.

Polprevodniški elementi – 16-10. del: Program odobravanja tehnologije za monolitna mikrovalovna integrirana vezja (IEC 60747-16-10:2004)

General Information

• Status: Published
• Publication Date: 30-Nov-2005
• ICS: 31.080.01 - Semiconductor devices in general
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Dec-2005
• Due Date: 01-Dec-2005
• Completion Date: 01-Dec-2005
• Ref Project: EN 60747-16-10:2004 - Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits

Standards Content (Sample)

SLOVENSKI SIST EN 60747-16-10:2005
STANDARD
december 2005
Polprevodniški elementi – 16-10. del: Program odobravanja tehnologije za
monolitna mikrovalovna integrirana vezja (IEC 60747-16-10:2004)
Semiconductor devices – Part 16-10: Technology Approval Schedule (TAS) for
monolithic microwave integrated circuits (IEC 60747-16-10:2004)
ICS 31.080.01; 31.200 Referenčna številka
SIST EN 60747-16-10:2005(en)

© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60747-16-10
NORME EUROPÉENNE
EUROPÄISCHE NORM September 2004
ICS 31.200
English version
Semiconductor devices
Part 16-10: Technology Approval Schedule (TAS)
for monolithic microwave integrated circuits
(IEC 60747-16-10:2004)
Dispositifs à semiconducteurs Halbleiterbauelemente
Partie 16-10: Format-cadre Teil 16-10: Prüfplan für die
pour agrément de technologie (TAS) Technikanerkennung
pour circuits intégrés monolithiques (Technology Approval Schedule - TAS)
hyperfréquences für monolithische integrierte
(CEI 60747-16-10:2004) Mikrowellenschaltkreise
(IEC 60747-16-10:2004)

This European Standard was approved by CENELEC on 2004-09-01. CENELEC members are bound to

comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European

Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and

notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech

Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,

Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60747-16-10:2004 E
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EN 60747-16-10:2004 - 2 -
Foreword

The text of document 47E/257/FDIS, future edition 1 of IEC 60747-16-10, prepared by SC 47E,

Discrete semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the

IEC-CENELEC parallel vote and was approved by CENELEC as EN 60747-16-10 on 2004-09-01.

The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2007-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice

The text of the International Standard IEC 60747-16-10:2004 was approved by CENELEC as a

European Standard without any modification.
__________
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- 3 - EN 60747-16-10:2004
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated

references, only the edition cited applies. For undated references, the latest edition of the referenced

document (including any amendments) applies.

NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
Publication Year Title EN/HD Year
IEC 60027 Series Letter symbols to be used in HD 245.4 S1 1997
electrical technology and
HD 60027 Series
IEC 60050 Series International Electrotechnical - -
Vocabulary (IEV)
IEC 60068 Series Environmental testing EN 60068 Series
IEC 60191-2 - Mechanical standardization of - -
semiconductor devices
Part 2: Dimensions
IEC 60617 database Graphical symbols for diagrams - -
IEC 60747-1 - Semiconductor devices - Discrete - -
devices
Part 1: General
IEC 60747-16-1 - Part 16-1: Microwave integrated EN 60747-16-1 2002
circuits - Amplifiers
IEC 60747-16-2 - Part 16-2: Microwave integrated - -
circuits - Frequency prescalers
1) 2)
IEC 60747-16-3 - Part 16-3: Microwave integrated EN 60747-16-3 2002
circuits - Frequency converters
1) 2)
IEC 60747-16-4 - Part 16-4: Microwave integrated EN 60747-16-4 2004
circuits - Switches
IEC 60748-1 - Semiconductor devices - Integrated - -
circuits
Part 1:General
ISO 1000 - SI units and recommendations for - -
the use of their multiples and of
certain other units
Undated reference.
Valid edition at date of issue.
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INTERNATIONAL IEC
STANDARD 60747-16-10
QC 210021
First edition
2004-07
Semiconductor devices –
Part 16-10:
Technology Approval Schedule (TAS)
for monolithic microwave integrated circuits
© IEC 2004 ⎯ Copyright - all rights reserved

No part of this publication may be reproduced or utilized in any form or by any means, electronic or

mechanical, including photocopying and microfilm, without permission in writing from the publisher.

International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland

Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch

PRICE CODE
Commission Electrotechnique Internationale XA
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
For price, see current catalogue
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– 2 – 60747-16-10 © IEC:2004(E)
CONTENTS

FOREWORD...........................................................................................................................4

Foreword to this particular Technology Approval Schedule (TAS) ...........................................7

Organizations responsible for preparing the present TAS........................................................7

Preface...................................................................................................................................7

INTRODUCTION.....................................................................................................................8

1 General ............................................................................................................................9

1.1 Scope......................................................................................................................9

1.2 Normative documents..............................................................................................9

1.3 Units, symbols and terminology .............................................................................10

1.4 Standard and preferred values ..............................................................................10

1.5 Definitions .............................................................................................................10

2 Definition of the component technology ..........................................................................12

2.1 Scope....................................................................................................................12

2.2 Description of activities and flow charts.................................................................13

2.3 Technical abstract .................................................................................................13

2.4 Requirements for control of subcontractors ...........................................................16

3 Component design of MMICs..........................................................................................18

3.1 Scope....................................................................................................................18

3.2 Description of activities and flow charts.................................................................18

3.3 Interfaces ..............................................................................................................19

3.4 Validations and control of the processes ...............................................................21

4 Mask manufacture ..........................................................................................................23

4.1 Scope....................................................................................................................23

4.2 Description of activities and flow charts.................................................................23

4.3 Validation and control of the processes .................................................................23

4.4 Subcontractors, vendors and internal suppliers .....................................................23

5 Wafer fabrication of MMICs ............................................................................................23

5.1 Scope....................................................................................................................23

5.2 Description of activities and flow charts.................................................................24

5.3 Equipment.............................................................................................................26

5.4 Materials ...............................................................................................................26

5.5 Re-work ................................................................................................................26

5.6 Validation methods and control of the processes ...................................................27

5.7 Interrelationship ....................................................................................................28

6 Wafer probing of MMICs .................................................................................................30

6.1 Scope....................................................................................................................30

6.2 Description of activities and flow charts.................................................................30

6.3 Equipment.............................................................................................................30

6.4 Test procedures ....................................................................................................30

6.5 Interrelationship ....................................................................................................30

7 Back-side process for bare chip delivery ........................................................................32

7.1 Scope....................................................................................................................32

7.2 Description of activity and flow charts....................................................................32

7.3 Equipment.............................................................................................................33

7.4 Materials ...............................................................................................................33

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60747-16-10 © IEC:2004(E) – 3 –

7.5 Validation methods and control of the processes ...................................................33

7.6 Interrelationship ....................................................................................................33

7.7 Validity of release..................................................................................................34

8 Assembly of MMICs........................................................................................................36

8.1 Scope....................................................................................................................36

8.2 Description of activities and flow charts.................................................................36

8.3 Materials, inspection and handling.........................................................................37

8.4 Equipment.............................................................................................................37

8.5 Re-work ................................................................................................................37

8.6 Validation and control of the processes .................................................................37

8.7 Interrelationships...................................................................................................38

9 Testing of MMICs ...........................................................................................................40

9.1 Scope....................................................................................................................40

9.2 Description of activities and flow charts.................................................................40

9.3 Equipment.............................................................................................................40

9.4 Test procedures ....................................................................................................41

9.5 Interfaces ..............................................................................................................42

9.6 Validation and control of the processes .................................................................43

9.7 Process boundary verification................................................................................46

9.8 Product verification................................................................................................50

10 Process characterization ................................................................................................50

10.1 Identification of process characteristics .................................................................50

10.2 Description of activities .........................................................................................51

10.3 Characterization procedures..................................................................................52

11 Packaging and shipping..................................................................................................53

11.1 Description of activities and flow charts.................................................................53

11.2 Interfaces ..............................................................................................................54

11.3 Validity of release..................................................................................................54

12 Withdrawal of Technology Approval................................................................................56

Figure 1 – Example flow chart of design/manufacture/test.....................................................16

Figure 2 – Example flow chart of a design.............................................................................21

Figure 3 – Technology flow chart of the process ...................................................................29

Figure 4 – Example flow chart for a wafer probing. ...............................................................30

Figure 5 – Example flow chart for a back-side process for bare chip delivery ........................34

Figure 6 – Example flow chart for an assembly .....................................................................38

Figure 7 – Example flow char for a testing ............................................................................44

Figure 8 – Typical flow chart for packaging and shipping ......................................................54

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– 4 – 60747-16-10 © IEC:2004(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-10: Technology Approval Schedule (TAS)
for monolithic microwave integrated circuits
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any

equipment declared to be in conformity with an IEC Publication.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60747-16-10 has been prepared by subcommittee 47E: Discrete

semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/257/FDIS 47E/262/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

The QC number that appears on the front cover of this publication is the specification number

in the IEC Quality Assessment System for Electronic Components (IECQ-CECC).
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60747-16-10 © IEC:2004(E) – 5 –

This publication has been partially drafted in accordance with the ISO/IEC Directives, Part 2

(2001). It also follows the requirements given in IEC QC 210000:1995, Technology Approval

Schedules – Requirements under the IEC Quality Assessment System for Electronic
Components (IECQ-CECC).

The committee has decided that the contents of this publication will remain unchanged until

the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in

the data related to the specific publication. At this date, the publication will be

• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
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– 6 – 60747-16-10 © IEC:2004(E)
International Electrotechnical Commission QC 210021
Quality Assessment System for Electronic Components (IECQ-CECC)
Responsible NAI: Name Specification available as shown in
Address QC 001004 Specifications List or from any
Tel: National Authorized Institution (NAI)
Fax:
TECHNOLOGY APPROVAL SCHEDULE
(Monolithic microwave integrated circuits)
Issue
QC 210021
2004-07
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60747-16-10 © IEC:2004(E) – 7 –
Foreword to this particular Technology Approval Schedule (TAS)

The IEC Quality Assessment System for Electronic Components (lECQ) is composed of those

member countries of the International Electrotechnical Commission (lEC) that wish to take

part in a harmonized system for electronic components of assessed quality.

The object of the System is to facilitate international trade by the harmonization of

specifications and quality assessment procedures for electronic components and by the

granting of an internationally recognized mark or certificate of conformity. The components

produced under the System are acceptable in all member countries without further testing.

This TAS has been prepared for use by those countries taking part in the System who wish to

issue national harmonized specifications for Technology Approval of manufacturers of

monolithic microwave integrated circuits. It should be read in conjunction with the current

regulations of the IECQ-CECC System.

At the date of printing of this schedule the member countries of IECQ-CECC are China,

Denmark, France, Germany, India, Italy, Japan, Republic of Korea, Netherlands, Norway,

Russian Federation, Switzerland, Thailand, Ukraine, United Kingdom, USA and Yugoslavia.

Copies of this schedule can be obtained from their National Authorized Institutions, National

Standards Organizations or, in case of difficulty, from the Central Office of IEC in Geneva,

Switzerland (fax [phone]) as described in the Specifications List QC 001004 on

www.iecq-cecc.org.
Organizations responsible for preparing the present TAS
IEC subcommittee 47E: Discrete semiconductor devices
Preface
This schedule was prepared by SC47E/WG2.

It is based, wherever possible, on the publications of the International Electrotechnical

Commission (lEC) and the International Organization for Standardization (ISO) and in

particular on:

IEC 60747-16-1: Semiconductor devices – Part 16-1: Microwave integrated circuits –

Amplifiers,

IEC 60747-16-2: Semiconductor devices – Part 16-2: Microwave integrated circuits –

Frequency prescalers,

IEC 60747-16-3: Semiconductor devices – Part 16-3: Microwave integrated circuits –

Frequency converters,

IEC 60747-16-4: Semiconductor devices – Part 16-4: Microwave integrated circuits –

Switches.
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– 8 – 60747-16-10 © IEC:2004(E)
INTRODUCTION

The requirements for Technology Approval for manufacturers of electronic and electro-

mechanical components are given in QC 001002-3, Clause 6. The procedures for approval

defined in that clause require the manufacturer to have available an appropriate Technology

Approval Schedule (TAS).

This schedule defines how the principles and requirements of QC 001002-3, Clause 6 are

applied to monolithic microwave integrated circuits.
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60747-16-10 © IEC:2004(E) – 9 –
SEMICONDUCTOR DEVICES –
Part 16-10: Technology Approval Schedule (TAS)
for monolithic microwave integrated circuits
1 General
1.1 Scope

This TAS specifies the terms, definitions, symbols, quality system, test, assessment and

verification methods and other requirements relevant to the design, manufacture and supply

of monolithic microwave integrated circuits in compliance with the general requirements of the

IECQ-CECC System for electronic components of assessed quality.
1.2 Normative documents

The following referenced documents are indispensable for the application of this document.

For dated references, only the edition cited applies. For undated references, the latest edition

of the referenced document (including any amendments) applies.
IEC 60027 (all parts): Letter symbols to be used in electrical technology
IEC 60050: International Electrotechnical Vocabulary
IEC 60068 (all parts): Environmental testing

IEC 60191-2: Mechanical standardisation of semiconductor devices – Part 2: Dimensions

IEC 60617-DB (all parts): Graphical symbols for diagrams

IEC 60747-1: Semiconductor devices – Discrete devices and integrated circuits – Part 1:

General

IEC 60747-16-1: Semiconductor devices – Part 16-1: Microwave integrated circuits –

Amplifiers

IEC 60747-16-2: Semiconductor devices – Part 16-2: Microwave integrated circuits –

Frequency prescalers

IEC 60747-16-3: Semiconductor devices – Part 16-3: Microwave integrated circuits –

Frequency converters

IEC 60747-16-4: Semiconductor devices – Part 16-4: Microwave integrated circuits –

Switches
IEC 60748-1: Semiconductor devices – Integrated circuits – Part 1: General

ISO 1000: SI units and recommendations for the use of their multiples and certain other units

———————
“DB” refers to the IEC on-line database.
2 To be published.
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– 10 – 60747-16-10 © IEC:2004(E)
1.3 Units, symbols and terminology

Units, graphical symbols, letter symbols and terminology shall, whenever possible, be taken

from the following documents:
IEC 60027: Letter symbols to be used in electrical technology
IEC 60050: International electrotechnical vocabulary
IEC 60617-DB: Graphical symbols for diagrams

ISO 1000: SI units and recommendations for the use of their multiples and certain other units

Any other units, symbols and terminology specific to the scope of this TAS shall be taken from

the relevant IEC or ISO documents listed under Normative documents.
1.4 Standard and preferred values

Technology Approval allows the customization of the component or process to suit each

customer. The conventional concept of preferred values may thus have limited application.

However, when internationally recognized preferred values apply these should be used, e.g.

voltage, temperature and dimensions. Reference shall be made to the appropriate IEC or ISO

publications, i.e.:
– voltage IEC 60747-1
– temperature IEC 60747-1
– dimensions IEC 60191-2.
1.5 Definitions
For the purposes of this document, the following definitions apply.
1.5.1 General terms for monolithic microwave integrated circuits
1.5.1.1
microelectronics
(IEC 60748-1, definition 4.1.5)
1.5.1.2
microcircuit
(IEC 60748-1, definition 4.2.2)
1.5.1.3
integrated circuit
(IEC 60748-1, definition 4.2.3)
1.5.1.4
integrated microcircuit

microcircuit in which a number of circuit elements are inseparably associated and electrically

interconnected such that for the purpose of specification and testing and commerce and

maintenance, it is considered indivisible

NOTE 1 For this definition, a circuit element does not have an envelope or external connection and is not

specified or sold as a separate item.

NOTE 2 Where no misunderstanding is possible, the term "integrated microcircuit" may be abbreviated to

"integrated circuit".

NOTE 3 Further qualifying terms may be used to describe the technique used in the manufacture of a specific

integrated microcircuit. Examples to the use of qualifying terms: semiconductor monolithic integrated circuit;

semiconductor multi-chip integrated circuit; thin film integrated circuit; thick film integrated circuit; hybrid integrated

circuit.
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60747-16-10 © IEC:2004(E) – 11 –
1.5.1.5
micro-assembly

microcircuit consisting of various components and/or integrated microcircuits which are

constructed separately and which can be tested before being assembled and packaged

NOTE 1 For this definition, a component has external connections and possibly an envelope as well and it also

can be specified and sold as a separate item.

NOTE 2 Further qualifying terms may be used to describe the form of the components and/or the assembly

techniques used in the construction of a specific micro-assembly. Examples of use of qualifying terms:

semiconductor multi-chip micro-assembly; discrete component micro-assembly.
1.5.2 List of abbreviations
– ASIC: Application Specific Integrated Circuit
– BDS: Blank Detail Specification
– BICMOS: Bipolar and Complementary Metal Oxide Silicon
– CAD: Computer Aided Design
– CAE: Computer Aided Engineering
– CECC: CENELEC Electronic Components Committee
– CMB: Contract Management Branch
– Cpk: Index of critical process
...