SIST EN 61076-4-115:2004

Connectors for electronic equipment -- Part 4-115: Printed board connectors - Backplane connector for InfiniBand equipment

Describes a single-part hybrid connector, with a section for high-speed on a 3 mm grid and a low-speed section with power and ground connections on a 2 mm grid, for printed boards and backplanes in accordance with EN 60917-2-2

Steckverbinder für elektronische Einrichtungen -- Teil 4-115: Steckverbinder für gedruckte Schaltungen - Rückplatten-Steckverbinder für InfiniBand-Geräte

Connecteurs pour équipements électroniques -- Partie 4-115: Connecteurs pour cartes imprimées - Connecteur de fond de panier pour équipement InfiniBand

Décrit un connecteur hybride en une partie, avec une section pour connexions à débits élevés au pas de 3 mm et une section à bas débits avec contacts de puissance et continuité de masse au pas de 2 mm, pour cartes imprimées et fonds de panier selon la EN 60917-2-2

Konektorji za elektronsko opremo - 4-115. del: Konektorji za tiskane plošče - Konektorji za hrbtne plošče za opremo InfiniBand (IEC 61076-4-115:2003)

General Information

• Status: Published
• Publication Date: 31-Oct-2004
• ICS: 31.220.10 - Plug-and-socket devices. Connectors
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Nov-2004
• Due Date: 01-Nov-2004
• Completion Date: 01-Nov-2004
• Ref Project: EN 61076-4-115:2003 - Connectors for electronic equipment - Part 4-115: Printed board connectors - Backplane connector for InfiniBand equipment

Standards Content (Sample)

SLOVENSKI SIST EN 61076-4-115:2004

STANDARD
november 2004
Konektorji za elektronsko opremo - 4-115. del: Konektorji za tiskane plošče -
Konektorji za hrbtne plošče za opremo InfiniBand (IEC 61076-4-115:2003)
Connectors for electronic equipment - Part 4-115: Printed board connectors -
Backplane connectors for InfiniBand equipment (IEC 61076-4-115:2003)
ICS 31.220.10 Referenčna številka
SIST EN 61076-4-115:2004(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 61076-4-115
NORME EUROPÉENNE
EUROPÄISCHE NORM August 2003

ICS 31.220.10


English version


Connectors for electronic equipment
Part 4-115: Printed board connectors –
Backplane connector for InfiniBand equipment
(IEC 61076-4-115:2003)


Connecteurs pour équipements Steckverbinder für elektronische
électroniques Einrichtungen
Partie 4-115: Connecteurs pour cartes Teil 4-115: Steckverbinder für gedruckte
imprimées – Schaltungen –
Connecteur de fond de panier pour Rückplatten-Steckverbinder für
équipement InfiniBand InfiniBand-Geräte
(CEI 61076-4-115:2003) (IEC 61076-4-115:2003)






This European Standard was approved by CENELEC on 2003-05-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 61076-4-115:2003 E

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EN 61076-4-115:2003 - 2 -
Foreword
The text of document 48B/1288/FDIS, future edition 1 of IEC 61076-4-115, prepared by SC 48B,
Connectors, of IEC TC 48, Electromechanical components and mechanical structures for electronic
equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as
EN 61076-4-115 on 2003-05-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2006-05-01
The International Electrotechnical Commission (IEC) and CENELEC draw attention to the fact that it is
claimed that compliance with this document may involve the use of a patent concerning
a) an electrical connector assembly for establishing electrical contact with contacting devices of
external terminals, e.g. with solder points of a circuit board;
b) an electrical connector assembly for establishing electrical contact with external terminals having
contacting devices with contact faces, e.g. with solder points of a circuit board;
c) an electrical connector assembly with an electrical connector having a connecting position and
contacting devices for establishing electrical contact between a first and a second printed circuit
board.
The IEC and CENELEC take no position concerning the evidence, validity and scope of this patent
right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences under
reasonable and non-discriminatory terms and conditions with applicants throughout the world. In this
respect, the statement of the holder of this patent right is registered with the IEC. Information may be
obtained from:
Tyco Electronics Cororation
PO Box 3608
Harrisburg, PA 17105-3608
USA
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights other than those identified above. IEC and CENELEC shall not be held responsible for
identifying any or all such patent rights.
Annexes designated "normative" are part of the body of the standard.
In this standard, annexes A, B and ZA are normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61076-4-115:2003 was approved by CENELEC as a
European Standard without any modification.
__________

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- 3 - EN 61076-4-115:2003
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance

IEC 60352-5 2001 Solderless connections EN 60352-5 2001
Part 5: Press-in connections - General
requirements, test methods and
practical guidance

IEC 60512 Series Connectors for electronic equipment - EN 60512 Series
Tests and measurements
Part 1: General

IEC 60512-1-100 2001 Connectors for electronic equipment - EN 60512-1-100 2001
Tests and measurements
Part 1-100: General - Applicable
publications

IEC 60917-2-2 1994 Modular order for the development of EN 60917-2-2 1996
mechanical structures for electronic
equipment practices
Part 2: Sectional specification -
Interface co-ordination dimensions for
the 25 mm equipment practice --
Section 2: Detail specification -
Dimensions for subracks, chassis,
backplanes, front panels and plug-in
units

IEC 61076-1 1995 Connectors with assessed quality, for EN 61076-1 1995
use in d.c., low frequency analogue and
in digital high-speed data applications
Part 1: Generic specification

IEC 61076-4 1995 Part 4: Sectional specification - Printed EN 61076-4 1996
board connectors


1)
EN 60068-1 includes corrigendum October 1998 + A1:1992 to IEC 60068-1.

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EN 61076-4-115:2003 - 4 -
Publication Year Title EN/HD Year
IEC 61076-4-001 1996 Part 4: Printed board connectors -- EN 61076-4-001 1996
Section 001: Blank detail specification

ISO 1302 2002 Geometrical Product Specifications EN ISO 1302 2002
(GPS) - Indication of surface texture in
technical product documentation

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NORME CEI
INTERNATIONALE IEC
61076-4-115
INTERNATIONAL
Première édition
STANDARD
First edition
2003-02
Connecteurs pour équipements électroniques –
Partie 4-115:
Connecteurs pour cartes imprimées –
Connecteur de fond de panier
pour équipement InfiniBand
Connectors for electronic equipment –
Part 4-115:
Printed board connectors –
Backplane connector
for InfiniBand equipment
 IEC 2003 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
CODE PRIX
XB
Commission Electrotechnique Internationale PRICE CODE
International Electrotechnical Commission
Международная Электротехническая Комиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue

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61076-4-115  IEC:2003 – 3 –
CONTENTS
FOREWORD . 9
1 General data .15
1.1 Recommended method of mounting .15
1.2 Ratings and characteristics .17
1.3 Normative references.19
1.4 Marking .21
1.5 IEC type designation .21
1.6 Ordering information .21
2 Technical data .23
2.1 Definitions .23
2.2 Survey of styles and variants.25
2.3 Information on application .27
3 Dimensional information.35
3.1 General .35
3.2 Isometric view and common features.37
3.3 Mating information .43
3.4 Fixed connector .49
3.5 Plug-in card paddle .51
3.6 Mounting information for fixed connector .55
3.7 Mounting information for paddle-guard .57
3.8 Gauges.61
4 Characteristics.71
4.1 Climatic category .71
4.2 Electrical.71
4.3 Mechanical .77
4.4 High-speed characteristics .81
5 Test schedule .87
5.1 General .87
5.2 Test schedule tables .101
Annex A (normative) Test method for gauge supporting force .125
A.1 Object .125
A.2 Preparation of the specimen .125
A.3 Test equipment .125
A.4 Test method.125
A.5 Details to be specified .129
Annex B (normative) Test method for dust and fibre resistance.131
B.1 Object .131
B.2 Preparation of the specimen .131
B.3 Test equipment .131
B.4 Test method.133

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61076-4-115  IEC:2003 – 5 –
Figure 1 – Press-in/compression method of mounting .15
Figure 2 – Example of a paddle-guard, to be mounted on the plug-in card paddle.27
Figure 3 – Designation of contacts on backplane for press-in/compression mounting .29
Figure 4 – Designation of contacts on component side.31
Figure 5 – Designation of contacts on solder side .31
Figure 6 – Low-speed section – Apertures in paddle-guard control engaging sequence .33
Figure 7 – Co-ordination dimensions.37
Figure 8 – Height dimensions and mounting pitch .39
Figure 9 – Width dimensions and mounting pitch .41
Figure 10 – Depth dimensions .41
Figure 11 – Contact range in relation to bow and insertion depth.43
Figure 12 – Allowed misalignment in height and width directions .45
Figure 13 – Allowed inclination in height and width directions (mated situation) .47
Figure 14 – Overall dimensions of style A and style C fixed connectors .49
Figure 15 – Detailed dimensions of the lead-in slot .49
Figure 16 – Position of the bifurcated contact beams in the mated condition.51
Figure 17 – Overall dimensions of paddle-guard .51
Figure 18 – Detailed dimensions of paddle-guard style I.53
Figure 19 – Footprint on backplane for press-in/compression mounted fixed connector .55
Figure 20 – Detailed dimensions of contact pads for high-speed and
shielding ground planes.57
Figure 21 – Detailed dimensions of contact pads for low-speed – example
for InfiniBand application .59
Figure 22 – Gauges for high-speed contacts in row a.61
Figure 23 – Gauges for high-speed contacts in row b.63
Figure 24 – Holder for test gauges for high-speed section.65
Figure 25 – Sizing gauge for low-speed contacts.67
Figure 26 – Test gauge for low-speed contacts .67
Figure 27 – Holder for test gauges for low-speed section .69
Figure 28 – Derating curve for differential pairs.73
Figure 29 – Derating curve for low-speed contacts.73
Figure 30 – Typical impedance profile, including pads and via-holes (example
for guidance only).81
Figure 31 – Superposition of typical near-end cross-talk curves
(example for guidance only).83
Figure 32 – Layout of plug-in card and backplane for one electromechanical
test specimen.89
Figure 33 – Layout of printed circuit boards for signal integrity validation.91
Figure 34 – Arrangement for measurement of contact resistance .93
Figure 35 – Fixture for dynamic stress tests.93
Figure 36 – Wiring arrangement for voltage proof and polarisation voltage .95

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61076-4-115  IEC:2003 – 7 –
Figure 37 – Arrangement for gauge supporting force test on high-speed contacts .97
Figure 38 – Arrangement for sizing on low-speed contacts .99
Figure 39 – Arrangement for gauge supporting force test on low-speed contacts.99
Figure A.1 – Example of a test arrangement for supporting force verification.127
Table 1 – Number of contacts for fixed connector .17
Table 2 – Number of cavities for paddle guard .17
Table 3 – Survey of fixed connectors .25
Table 4 – Survey of paddle-guards .25
Table 5 – Survey of terminations to the backplane .25
Table 6 – Survey of paddle-guard variants .25
Table 7 – Co-ordination dimensions and common features.39
Table 8 – Climatic category .71
Table 9 – Creepage and clearance distances.71
Table 10 – Rated impulse voltages .71
Table 11 – Rated insulation voltages .71
Table 12 – Maximum contact resistances.75
Table 13 – Minimum insulation resistances .75
Table 14 – Maximum engaging and separating forces .77
Table 15 – Vibration .77
Table 16 – Shock .79
Table 17 – Propagation delay skew.85
Table 18 – Number of specimens for inspection and electromechanical test sequence .87
Table 19 – Group P – Preliminary testing sequence .101
Table 20 – Group A – Dynamic/Climatic testing sequence.103
Table 21 – Group B – Mechanical endurance testing sequence .107
Table 22 – Group C – Moisture testing sequence .111
Table 23 – Group D – Electrical load testing sequence.115
Table 24 – Group E – Mechanical resistivity testing sequence.117
Table 25 – Group F – Dust testing sequence .119
Table 26 – Group G – High-speed performance testing sequence .121

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61076-4-115  IEC:2003 – 9 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
CONNECTORS FOR ELECTRONIC EQUIPMENT –
Part 4-115: Printed board connectors –
Backplane connector
for InfiniBand equipment
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization
for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed that compliance
with this document may involve the use of a patent concerning
a) an electrical connector assembly for establishing electrical contact with contacting devices of external terminals,
e.g. with solder points of a circuit board;
b) an electrical connector assembly for establishing electrical contact with external terminals having contacting devices
with contact faces, e.g. with solder points of a circuit board;
c) an electrical connector assembly with an electrical connector having a connecting position and contacting
devices for establishing electrical contact between a first and a second printed circuit board.
IEC takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences under reasonable and
non-discriminatory terms and conditions with applicants throughout the world. In this respect, the statement of the
holder of this patent right is registered with IEC. Information may be obtained from:
Tyco Electronics Corporation
PO Box 3608
Harrisburg, PA 17105-3608
USA
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights
other than those identified above. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61076-4-115 has been prepared by subcommittee 48B: Connectors,
of IEC technical committee 48: Electromechanical components and mechanical structures for
electronic equipment.
This standard cancels and replaces IEC/PAS 61076-4-115 published in 2001. This first edition
constitutes a technical revision.

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61076-4-115  IEC:2003 – 11 –
The text of this standard is based on the following documents:
FDIS Report on voting
48B/1288/FDIS 48B/1308/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated when a new edition is prepared.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until 2007.
At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.

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61076-4-115  IEC:2003 – 13 –
CONNECTORS FOR ELECTRONIC EQUIPMENT –
Part 4-115: Printed board connectors –
Backplane connector
for InfiniBand equipment
IEC SC 48B – Connectors
Electronic components of assessed quality in accordance Blank detail specification:
with IEC 61076-1:1995
IEC 61076-4-001:1996
Single-part hybrid connector, with
a section for high-speed on a 3 mm
grid and a low-speed section with
power and ground connections on
a 2 mm grid,
for printed boards and backplanes
in accordance with IEC 60917-2-2.
Hybrid connector having one section
containing 2 rows of 12 contact pairs for
differential pair transmission on a 3 mm
pitch
and one section with 1 row of 18
contacts for low-speed and power
connections on a 2 mm pitch.
The fixed connectors are 50 mm high,
pressed-in or surface mount soldered
onto the backplane.
The plug-in card interface is protected
by a paddle-guard.
Performance levels (PL): 1
IEC  684/03
Information on the availability of components qualified to this detail specification is given in the qualified
product list.

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61076-4-115  IEC:2003 – 15 –
1 General data
1.1 Recommended method of mounting
Three methods of mounting to the backplane may be adopted.
a) Press-in/compression connections
The fixed connector is pressed-in onto the backplane, using 18 press-in low-speed
connections and four press-in pins.
The high-speed contacts to the backplane use compression connections. See Figure 1.
18 press-in connections
48 compression
connections
4 press-in
retention pins
IEC  685/03
Figure 1 – Press-in/compression method of mounting
b) Press-in connections only
Under consideration.
c) Surface mount soldered connections
Under consideration.
The plug-in card has an extension in the form of a paddle, with contact pads for compression
connections. The paddle shall be protected by a paddle-guard, which may be removable or
permanently mounted.

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61076-4-115  IEC:2003 – 17 –
Number of contacts and contact cavities
Table 1 – Number of contacts for fixed connector
Styles Number of I/O channels Differential pairs Low-speed contacts
A 4 x I/O channels 4 + 4 18
C 12 x I/O channels 12 + 12 18
Table 2 – Number of cavities for paddle guard
Styles Cavities for differential pair entries Cavities for low-speed entries
I 12 + 12 18
1.2 Ratings and characteristics
High-speed section
Compression connections bifurcated contacts with independently operating beams
Creepage and clearance 0,3 mm min. between contacts mutually and ground
Rated voltage within same pair 100 V r.m.s.
pair to ground 100 V r.m.s.
Current rating 0,25 A per contact pair at 70 °C (all contacts loaded)
Insulation resistance 1 GΩ min.
Diff
...