kSIST prEN IEC 61188-6-3:2024
(Main)Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
Leiterplatten und Flachbaugruppen – Konstruktion und Anwendung – Teil 6-3: Anschlussflächengestaltung – Beschreibung von Anschlussflächen für Komponenten der Steckmontage (THT)
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-3: Conception de la zone de report - Description de la zone de report pour les composants à trous traversants (THT)
Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Zasnova in uporaba - 6-3. del: Razmestitev priključkov - Opis razmestitve priključkov skozi luknje komponent
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
oSIST prEN IEC 61188-6-3:2023
01-oktober-2023
Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Zasnova in uporaba - 6-3. del:
Razmestitev priključkov - Opis razmestitve priključkov skozi luknje komponent
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern
design - Description of land pattern for through hole components (THT)
Ta slovenski standard je istoveten z: prEN IEC 61188-6-3:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
oSIST prEN IEC 61188-6-3:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
oSIST prEN IEC 61188-6-3:2023
oSIST prEN IEC 61188-6-3:2023
91/1878/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61188-6-3 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2023-08-25 2023-11-17
SUPERSEDES DOCUMENTS:
91/1700/CD, 91/1748/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Osamu IKEDA
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In So me Countries”
clauses to be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for
submitting ISC clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).
TITLE:
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design -
Description of land pattern for through hole components (THT)
PROPOSED STABILITY DATE: 2025
NOTE FROM TC/SC OFFICERS:
The revised CDV draft was approved.at the TC91 WG12 meeting in June 2023.
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.
oSIST prEN IEC 61188-6-3:2023
IEC CDV 61188-6-3 © IEC 2023 2 91/1878/CDV
2 CONTENTS
4 FOREWORD . 4
5 INTRODUCTION . 6
6 1 Scope . 7
7 2 Normative references . 7
8 3 Terms and definitions . 7
9 4 Description of a through hole Component . 8
10 4.1 Component body . 8
11 4.2 Component leads . 8
12 5 Padstack . 9
13 5.1 Description . 9
14 5.2 Pad types . 9
15 5.2.1 Solder mask pads . 10
16 5.2.2 Outer layer pads . 10
17 5.2.3 Thermal pads . 10
18 5.2.4 Anti pads . 10
19 5.3 Pad shapes . 10
20 5.4 Holes . 10
21 5.4.1 Considerations for plated through hole dimensioning . 10
22 5.5 Annular ring . 11
23 6 Requirements on lands for solder joints . 11
24 6.1 General . 11
25 6.2 Land/Pad dimensioning for leaded terminals . 13
26 6.3 Land Shape for typical terminal shapes . 13
27 Annex A (Informative) . 14
28 A.1 Consideration of creating holes . 14
29 A.1.1 General . 14
30 A.1.2 Punched . 14
31 A.1.3 Drilled . 15
32 A.1.4 Milled . 15
33 A.1.5 Lasered . 15
34 A.1.6 preformed / printed . 16
35 A.2 Determination of THT component assembly . 16
36 A.2.1 General . 16
37 A.2.2 Manual assembly . 16
38 A.2.3 Automated assembly . 17
39 A.2.4 Press fit component assembly . 17
40 A.3 Determination of the soldering process . 17
41 A.3.1 General . 17
42 A.3.2 Manual soldering. 17
43 A.3.3 Reflow soldering . 17
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IEC CDV 61188-6-3 © IEC 2023 3 91/1878/CDV
44 A.3.4 Wave soldering . 17
45 A.3.5 Other soldering process . 17
46 Bibliography . 17
48 Figure 1 – Leaded component . 8
49 Figure 2 – Round lead Figure 3 – Square lead . 9
50 Figure 4 – Rectangle lead . 9
51 Figure 5 – Padstack . 10
52 Figure 7 – Basic design flow diagram for land pattern for THT . 13
53 Figure A.1 – Circuit board manufacturing and assembly . 14
54 Figure A.2 – Figure oblong Pin . 15
55 Figure A.3 – Protrusion of component terminal . 16
57 Table 1 – Layer function and pad types . 9
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oSIST prEN IEC 61188-6-3:2023
IEC CDV 61188-6-3 © IEC 2023 4 91/1878/CDV
60 INTERNATIONAL ELECTROTECHNICAL COMMISSION
61 ____________
63 CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES
65 - DESIGN AND USE -
67 Part 6-3: Land pattern design - Description of land pattern for through hole
68 components (THT)
72 FOREWORD
73 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national
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103 International Standard IEC 61188-6-3 has been prepared by IEC technical committee 91: Electronics
104 assembly technology.
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oSIST prEN IEC 61188-6-3:2023
IEC CDV 61188-6-3 © IEC 2023 5 91/1878/CDV
107 The text of this International Standard is based on the following documents:
FDIS Report on voting
XX/XX/FDIS XX/XX/RVD
109 Full information on the voting for the approval of this International Standard can be found in the report
110 on voting indicated in the above table.
111 This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
112 The committee has decided that the contents of this document will remain unchanged until the stability
113 date indicated on the IEC website under "http://webstore.iec.ch" in the data related to the specific
114 document. At this date, the document will be
115 • reconfirmed,
116 • withdrawn,
117 • replaced by a revised edition, or
118 • amended.
120 The National Committees are requested to note that for this document the stability date is 20XX.
121 THIS TEXT IS INCLUDED FOR THE INFORMATION OF THE NATIONAL COMMITTEES AND WI
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