SIST EN IEC 61189-2-808:2024
(Main)Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-808: Thermischer Widerstand der dielektrischen Schicht durch thermische transiente Methode
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures et assemblages d'interconnexion - Partie 2-808 : Résistance thermique d'un assemblage par la méthode du transitoire thermique
L’IEC 61189-2-808:2024 décrit la méthode du transitoire thermique pour caractériser la résistance thermique d'un assemblage constitué d'une source de chaleur (par exemple, un dispositif de puissance), d'un matériau de fixation (par exemple, une brasure) et d'une couche diélectrique avec électrode. Cette méthode permet de déterminer la résistance thermique des matériaux et des méthodes d'assemblage ainsi que d'optimiser le flux thermique vers un dissipateur thermique.
NOTE: Cette méthode n’est toutefois pas destinée à mesurer et à spécifier la valeur de la résistance thermique d'un matériau diélectrique. Il existe d’autres normes à cet effet. Des exemples sont donnés à l'Annexe A.
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-808. del: Meritev toplotne upornosti sestava z metodo toplotnega prehajanja
Standard IEC 61189-2-808:2024 opisuje metodo toplotnega prehajanja za karakterizacijo toplotne upornosti sestava, ki vključuje vir toplote (npr. električna naprava), material za pritrjevanje (npr. spajka) in dielektrično plast z elektrodo. Ta metoda je primerna za določevanje toplotne upornosti materialov in načinov pritrjevanja ter optimiziranje toplotnega toka do toplotnega ponora.
OPOMBA: Metoda ni namenjena za merjenje in določanje vrednosti toplotne upornosti dielektričnega materiala. Za ta namen obstajajo drugi standardi. Primeri so podani v dodatku A.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2024
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-808. del: Meritev toplotne upornosti sestava z metodo
toplotnega prehajanja
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient
method
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-808: Thermischer Widerstand der dielektrischen Schicht durch
thermische transiente Methode
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures et assemblages d'interconnexion - Partie 2-808 : Résistance thermique d'un
assemblage par la méthode du transitoire thermique
Ta slovenski standard je istoveten z: EN IEC 61189-2-808:2024
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61189-2-808
NORME EUROPÉENNE
EUROPÄISCHE NORM May 2024
ICS 31.180
English Version
Test methods for electrical materials, printed board and other
interconnection structures and assemblies - Part 2-808: Thermal
resistance of an assembly by thermal transient method
(IEC 61189-2-808:2024)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures et assemblages andere Verbindungsstrukturen und Baugruppen - Teil 2-
d'interconnexion - Partie 2-808 : Résistance thermique d'un 808: Thermischer Widerstand der dielektrischen Schicht
assemblage par la méthode du transitoire thermique durch thermische transiente Methode
(IEC 61189-2-808:2024) (IEC 61189-2-808:2024)
This European Standard was approved by CENELEC on 2024-05-30. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
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Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-808:2024 E
European foreword
The text of document 91/1935/FDIS, future edition 1 of IEC 61189-2-808, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-808:2024.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2025-02-28
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2027-05-30
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-808:2024 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61189-2-808 ®
Edition 1.0 2024-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed board and other interconnection
structures and assemblies –
Part 2-808: Thermal resistance of an assembly by thermal transient method
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures et assemblages d'interconnexion –
Partie 2-808 : Résistance thermique d'un assemblage par la méthode du
transitoire thermique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-8804-7
– 2 – IEC 61189-2-808:2024 © IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Objective . 5
5 Test specimen . 6
6 Test equipment and procedures . 7
6.1 Test method and recommended test parameters . 7
6.2 Test equipment . 7
6.3 Test procedure . 8
7 Test result . 8
8 Report . 9
Annex A (informative) Additional test methods for thermal resistance . 11
Annex B (informative) Thermal resistance of die attach materials . 13
B.1 Test specimen . 13
B.2 Die attach materials . 13
B.3 Test result. 14
Annex C (informative) Uncertainty and repeatability for thermal resistance test . 16
C.1 Test specimen . 16
C.2 Test result. 16
Annex D (informative) Thermostat equipment . 18
Bibliography . 20
Figure 1 – Structure of an assembly . 6
Figure 2 – The fabricated test sample . 6
Figure 3 – Test structure for measuring thermal resistance . 8
Figure 4 – Test result for thermal resistance of an assembly . 9
Figure B.1 –Structure of test sample using die attach material . 13
Figure B.2 –The fabricated test sample using die attach material . 13
Figure B.3 – Test graph for die attach materials . 15
Figure C.1 – Test structure for measuring thermal resistance . 16
Figure C.2 – Test result for thermal resistance of assembly . 16
Figure D.1 – Connection of the thermostat unit to the T3Ster® main system unit . 18
Figure D.2 –Calibration diagram recorded by the T3Ster® thermostat . 19
Table 1 – Test result for thermal resistance of an assembly . 9
Table A.1 – ASTM C1113 . 11
Table A.2 – ASTM E1461 . 11
Table A.3 – ASTM D5470 . 12
Table B.1 – Properties for die attach materials . 14
Table B.2 – Test result for die attach materials . 15
Table C.1 – Test result for thermal resistance of assembly . 17
IEC 61189-2-808:2024 © IEC 2024 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-808: Thermal resistance of an assembly
by thermal transient method
FOREWORD
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