SIST EN IEC 61189-2-809:2025

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA

IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA).
This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-809: Prüfung des X/Y-Wärmeausdehnungskoeffizienten (CTE) für dicke Grundwerkstoffe mittels TMA

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-809: Essai du coefficient de dilatation thermique (CTE) X/Y pour matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)

L’IEC 61189-2-809:2024 définit la méthode à suivre en vue de déterminer le coefficient de dilatation thermique (CTE, coefficient of thermal expansion) X/Y des matériaux isolants électriques à l'aide d'un analyseur thermomécanique (TMA, thermomechanical analyser).
La présente méthode est applicable aux matériaux qui sont solides dans toute la plage de températures utilisée, et qui conservent une dureté et une rigidité suffisantes sur la plage de températures, de telle sorte qu'une indentation irréversible de l'éprouvette par la sonde de détection ne se produise pas.

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-809. del: Preskus X/Y CTE s termomehansko analizo (TMA) za tanke podložne materiale

Ta del standarda IEC 61189 opredeljuje metodo za določanje koeficienta toplotnega raztezka vzdolž osi X/Y električnih izolacijskih materialov s termomehansko analizo (TMA).
Ta metoda se uporablja za materiale, ki ostanejo v trdnem stanju ter ohranijo zadostno trdoto in togost pri vseh uporabljenih temperaturah, da ne prihaja do nepopravljivih zarez v preskušancu zaradi zaznavne sonde.

General Information

• Status: Published
• Public Enquiry End Date: 31-Oct-2022
• Publication Date: 18-Feb-2025
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 05-Feb-2025
• Due Date: 12-Apr-2025
• Completion Date: 19-Feb-2025
• Ref Project: EN IEC 61189-2-809:2025 - Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

Overview

SIST EN IEC 61189-2-809:2025 is a European harmonized standard under the IEC 61189 series that specifies the test method for determining the X/Y coefficient of thermal expansion (CTE) of thick base electrical insulating materials. The test method employs a thermomechanical analyzer (TMA) to measure dimensional changes under temperature variations. This standard is essential for assessing the thermal expansion characteristics of solid insulating materials used in electrical circuit boards and interconnection structures, particularly thick base materials that maintain rigidity throughout the test temperature range.

Developed by CLC and approved by CENELEC, this standard ensures consistent, reliable measurement procedures that prevent specimen indentation from the sensing probe during testing. SIST EN IEC 61189-2-809:2025 addresses key aspects such as specimen preparation, apparatus requirements, test procedures, and data reporting-making it indispensable for manufacturers and quality assurance laboratories involved in electronics assembly and printed circuit board manufacturing.

Key Topics

• Scope: Defines the method to determine the X and Y directional CTE of thick, solid electrical insulating materials using thermomechanical analysis.
• Specimen Requirements: Specimens must be 0.5 mm to 7.5 mm thick, 5-12 mm long, and 5-10 mm wide, prepared with surfaces polished and cleaned to remove debris, and dried under controlled conditions.
• Directional Analysis: Tests are conducted in both the warp (Y) and weft (X) fabric directions of woven glass fiber materials, reflecting anisotropic thermal expansion behavior.
• Testing Equipment: Thermomechanical analyzer (TMA) with dimensional resolution to 0.001 mm, coupled with controlled environment ovens and desiccators to manage specimen conditioning.
• Test Procedure: Includes soaking specimens in isopropyl alcohol, drying, cooling, and carefully mounting on the TMA stage. Measurements are made with precise alignment of specimen orientation.
• Calculations and Reporting: Specifies how to calculate the CTE coefficients from TMA data and the format for test reports to ensure traceability and reproducibility.

Applications

SIST EN IEC 61189-2-809:2025 is critical for industries focusing on:

• Printed Circuit Board Manufacturing: Characterizing dielectric substrate materials to prevent thermal mismatch and mechanical stresses during board fabrication and operational cycling.
• Electrical Insulating Material Development: Assessing thermal stability and expansion characteristics to improve material formulations for electronic assemblies.
• Quality Control and Assurance: Ensuring compliance with thermal expansion specifications that affect reliability and performance of electrical interconnection structures.
• Electronics Assembly Technology: Optimizing design parameters of multilayer circuit boards and other interconnection assemblies under thermal stress.
• Materials Research and Testing Laboratories: Providing a standardized approach to evaluate and compare thick base insulating materials under realistic temperature ranges.

Understanding the thermal expansion properties using this standard helps engineers and manufacturers mitigate risks related to mechanical failures, warping, or delamination caused by thermal cycling in electronic components.

Related Standards

• EN IEC 61189 Series: This document is part of the broader IEC 61189 suite covering test methods for electrical materials, circuit boards, and assemblies.
• IEC 60194-1 and IEC 60194-2: Provide common vocabulary and terminology related to printed boards and electronics assembly technologies pertinent to the understanding of terms in EN IEC 61189-2-809.
• ISO/IEC Directives Part 1 & 2: Outline the protocols for drafting international standards, ensuring consistent methodology and terminology.
• Additional Thermal Testing Methods: For complementary insights, users may refer to related thermal and mechanical property standards relevant to electrical insulating materials used in printed circuit boards.

By integrating SIST EN IEC 61189-2-809:2025 in product development and quality testing, stakeholders can ensure international conformity, improve product reliability, and support innovation in insulating materials and electronic assemblies.

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Keywords: EN IEC 61189-2-809, coefficient of thermal expansion, CTE test, thermomechanical analyzer, TMA, thick base electrical materials, insulating materials testing, printed circuit boards, electronics assembly standard, electrical interconnection testing, thermal expansion measurement, CENELEC standard.

Standards Content (Sample)

SLOVENSKI STANDARD
01-marec-2025
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-809. del: Preskus X/Y CTE s termomehansko analizo (TMA)
za tanke podložne materiale
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick
Base Materials by TMA
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-809: Prüfung des X/Y-Wärmeausdehnungskoeffizienten (CTE)
für dicke Grundwerkstoffe mittels TMA
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles - Partie 2-809: Essai du coefficient de dilatation
thermique (CTE) X/Y pour matériaux de base épais à l'aide d'un analyseur
thermomécanique (TMA)
Ta slovenski standard je istoveten z: EN IEC 61189-2-809:2025
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61189-2-809

NORME EUROPÉENNE
EUROPÄISCHE NORM January 2025
ICS 31.180
English Version
Test methods for electrical materials, circuit boards and other
interconnection structures and assemblies - Part 2-809: X/Y
coefficient of thermal expansion (CTE) test for thick base
materials by TMA
(IEC 61189-2-809:2024)
Méthodes d'essai pour les matériaux électriques, les Prüfverfahren für Elektromaterialien, Leiterplatten und
circuits imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-809: Essai du coefficient de dilatation 809: Prüfung des X/Y-Wärmeausdehnungskoeffizienten
thermique (CTE) X/Y pour matériaux de base épais à l'aide (CTE) für dicke Grundwerkstoffe mittels TMA
d'un analyseur thermomécanique (TMA) (IEC 61189-2-809:2024)
(IEC 61189-2-809:2024)
This European Standard was approved by CENELEC on 2025-01-13. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2025 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-809:2025 E

European foreword
The text of document 91/1983/FDIS, future edition 1 of IEC 61189-2-809, prepared by TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-809:2025.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2026-01-31
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2028-01-31
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-809:2024 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-1 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61189-2-809 ®
Edition 1.0 2024-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, circuit boards and other interconnection

structures and assemblies –
Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base

materials by TMA
Méthodes d'essai pour les matériaux électriques, les circuits imprimées et

autres structures d'interconnexion et ensembles –

Partie 2-809: Essai du coefficient de dilatation thermique (CTE) X/Y pour

matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180  ISBN 978-2-8327-0054-9

– 2 – IEC 61189-2-809:2024-© IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test specimens . 5
5 Test apparatus . 6
6 Test procedure . 6
7 Calculations . 7
8 Report . 8
Bibliography . 9

Figure 1 – Diagram of sample direction . 6
Figure 2 – Specimen size versus temperature . 8

IEC 61189-2-809:2024-© IEC 2024 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, CIRCUIT BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-809: X/Y coefficient of thermal expansion (CTE) test
for thick base materials by TMA

FOREWORD
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