SIST EN IEC 61189-2-809:2025

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA

IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA).
This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-809: Prüfung des X/Y-Wärmeausdehnungskoeffizienten (CTE) für dicke Grundwerkstoffe mittels TMA

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-809: Essai du coefficient de dilatation thermique (CTE) X/Y pour matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)

L’IEC 61189-2-809:2024 définit la méthode à suivre en vue de déterminer le coefficient de dilatation thermique (CTE, coefficient of thermal expansion) X/Y des matériaux isolants électriques à l'aide d'un analyseur thermomécanique (TMA, thermomechanical analyser).
La présente méthode est applicable aux matériaux qui sont solides dans toute la plage de températures utilisée, et qui conservent une dureté et une rigidité suffisantes sur la plage de températures, de telle sorte qu'une indentation irréversible de l'éprouvette par la sonde de détection ne se produise pas.

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-809. del: Preskus X/Y CTE s termomehansko analizo (TMA) za tanke podložne materiale

General Information

• Status: Not Published
• Public Enquiry End Date: 31-Oct-2022
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 05-Feb-2025
• Due Date: 12-Apr-2025
• Ref Project: EN IEC 61189-2-809:2025 - Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

Standards Content (Sample)

SLOVENSKI STANDARD
oSIST prEN IEC 61189-2-809:2022
01-oktober-2022
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-809. del: Preskus X/Y CTE s termomehansko analizo (TMA)
za tanke podložne materiale
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick
Base Materials by TMA
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles - Partie 2-809: Essai du coefficient de dilatation
thermique (CTE) X/Y pour matériaux de base épais à l'aide d'un analyseur
thermomécanique (TMA)
Ta slovenski standard je istoveten z: prEN IEC 61189-2-809:2022
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
oSIST prEN IEC 61189-2-809:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

oSIST prEN IEC 61189-2-809:2022

oSIST prEN IEC 61189-2-809:2022

91/1800/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61189-2-809 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2022-08-12 2022-11-04
SUPERSEDES DOCUMENTS:
91/1747/CD, 91/1798/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Masahide Okamoto
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:

Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which
they are aware and to provide supporting documentation.

TITLE:
Test methods for electrical materials, printed board and other interconnection structures and assemblies
- Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA

PROPOSED STABILITY DATE: 2028
NOTE FROM TC/SC OFFICERS:
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.

oSIST prEN IEC 61189-2-809:2022
IEC CDV 61189-2-809  IEC (E) – 2 – 91/1800/CDV
2 CONTENTS
4 FOREWORD . 3
5 1 Scope . 5
6 2 Normative references . 5
7 3 Terms and definitions . 5
8 4 Test Specimens . 5
9 5 Test Apparatus . 6
10 6 Test Procedure . 6
11 7 Calculations. 7
12 8 Report . 7
13 Bibliography . 8
15 Figure1 – Diagram of sample direction . 6
16 Figure2 – Specimen size Versus Temperature . 7
oSIST prEN IEC 61189-2-809:2022
IEC CDV 61189-2-809  IEC (E) – 3 – 91/1800/CDV
21 INTERNATIONAL ELECTROTECHNICAL COMMISSION
22 ____________
24 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND
25 OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES–
27 Part 2-809: X/Y Coefficient of Thermal Expansion Test(CTE) for Thick Base
28 Materials by TMA
32 FOREWORD
33 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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60 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
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62 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
63 rights. IEC shall not be held responsible for identifying any or all such patent rights.
64 International Standard IEC 61189-2-809 has been prepared by IEC technical committee 91:
65 Electronics assembly technology.
66 The text of this International Standard is based on the following documents:
FDIS Re
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