SIST EN IEC 61189-2-808:2024
(Main)Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-808: Thermischer Widerstand der dielektrischen Schicht durch thermische transiente Methode
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures et assemblages d'interconnexion - Partie 2-808 : Résistance thermique d'un assemblage par la méthode du transitoire thermique
L’IEC 61189-2-808:2024 décrit la méthode du transitoire thermique pour caractériser la résistance thermique d'un assemblage constitué d'une source de chaleur (par exemple, un dispositif de puissance), d'un matériau de fixation (par exemple, une brasure) et d'une couche diélectrique avec électrode. Cette méthode permet de déterminer la résistance thermique des matériaux et des méthodes d'assemblage ainsi que d'optimiser le flux thermique vers un dissipateur thermique.
NOTE: Cette méthode n’est toutefois pas destinée à mesurer et à spécifier la valeur de la résistance thermique d'un matériau diélectrique. Il existe d’autres normes à cet effet. Des exemples sont donnés à l'Annexe A.
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-808. del: Meritev toplotne upornosti sestava z metodo toplotnega prehajanja
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2024
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-808. del: Meritev toplotne upornosti sestava z metodo
toplotnega prehajanja
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient
method
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-808: Thermischer Widerstand der dielektrischen Schicht durch
thermische transiente Methode
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures et assemblages d'interconnexion - Partie 2-808 : Résistance thermique d'un
assemblage par la méthode du transitoire thermique
Ta slovenski standard je istoveten z: EN IEC 61189-2-808:2024
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61189-2-808
NORME EUROPÉENNE
EUROPÄISCHE NORM May 2024
ICS 31.180
English Version
Test methods for electrical materials, printed board and other
interconnection structures and assemblies - Part 2-808: Thermal
resistance of an assembly by thermal transient method
(IEC 61189-2-808:2024)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures et assemblages andere Verbindungsstrukturen und Baugruppen - Teil 2-
d'interconnexion - Partie 2-808 : Résistance thermique d'un 808: Thermischer Widerstand der dielektrischen Schicht
assemblage par la méthode du transitoire thermique durch thermische transiente Methode
(IEC 61189-2-808:2024) (IEC 61189-2-808:2024)
This European Standard was approved by CENELEC on 2024-05-30. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
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Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-808:2024 E
European foreword
The text of document 91/1935/FDIS, future edition 1 of IEC 61189-2-808, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-808:2024.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2025-02-28
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2027-05-30
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-808:2024 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61189-2-808 ®
Edition 1.0 2024-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed board and other interconnection
structures and assemblies –
Part 2-808: Thermal resistance of an assembly by thermal transient method
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures et assemblages d'interconnexion –
Partie 2-808 : Résistance thermique d'un assemblage par la méthode du
transitoire thermique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-8804-7
– 2 – IEC 61189-2-808:2024 © IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Objective . 5
5 Test specimen . 6
6 Test equipment and procedures . 7
6.1 Test method and recommended test parameters . 7
6.2 Test equipment . 7
6.3 Test procedure . 8
7 Test result . 8
8 Report . 9
Annex A (informative) Additional test methods for thermal resistance . 11
Annex B (informative) Thermal resistance of die attach materials . 13
B.1 Test specimen . 13
B.2 Die attach materials . 13
B.3 Test result. 14
Annex C (informative) Uncertainty and repeatability for thermal resistance test . 16
C.1 Test specimen . 16
C.2 Test result. 16
Annex D (informative) Thermostat equipment . 18
Bibliography . 20
Figure 1 – Structure of an assembly . 6
Figure 2 – The fabricated test sample . 6
Figure 3 – Test structure for measuring thermal resistance . 8
Figure 4 – Test result for thermal resistance of an assembly . 9
Figure B.1 –Structure of test sample using die attach material . 13
Figure B.2 –The fabricated test sample using die attach material . 13
Figure B.3 – Test graph for die attach materials . 15
Figure C.1 – Test structure for measuring thermal resistance . 16
Figure C.2 – Test result for thermal resistance of assembly . 16
Figure D.1 – Connection of the thermostat unit to the T3Ster® main system unit . 18
Figure D.2 –Calibration diagram recorded by the T3Ster® thermostat . 19
Table 1 – Test result for thermal resistance of an assembly . 9
Table A.1 – ASTM C1113 . 11
Table A.2 – ASTM E1461 . 11
Table A.3 – ASTM D5470 . 12
Table B.1 – Properties for die attach materials . 14
Table B.2 – Test result for die attach materials . 15
Table C.1 – Test result for thermal resistance of assembly . 17
IEC 61189-2-808:2024 © IEC 2024 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-808: Thermal resistance of an assembly
by thermal transient method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liabi
...
SLOVENSKI STANDARD
oSIST prEN IEC 61189-2-808:2023
01-april-2023
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-808. del: Meritev toplotne upornosti sestava z metodo
toplotnega prehajanja
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient
method
Ta slovenski standard je istoveten z: prEN IEC 61189-2-808:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
oSIST prEN IEC 61189-2-808:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
oSIST prEN IEC 61189-2-808:2023
oSIST prEN IEC 61189-2-808:2023
91/1833/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61189-2-808 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2023-02-10 2023-05-05
SUPERSEDES DOCUMENTS:
91/1767/CD, 91/1830/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Masahide Okamoto
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if
any, in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft
for Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of
• any relevant patent rights of which they are aware and to provide supporting documentation,
• any relevant “in some countries” clauses to be included should this proposal proceed. Recipients are
reminded that the enquiry stage is the final stage for submitting "in some countries" clauses. See
AC/22/2007.
TITLE:
Test methods for electrical materials, printed board and other interconnection structures and
assemblies – Part 2-808: Thermal resistance of an assembly by thermal transient method
PROPOSED STABILITY DATE: 2028
NOTE FROM TC/SC OFFICERS:
download this electronic file, to make a copy and to print out the content for the sole purpose of preparing National
Committee positions. You may not copy or "mirror" the file or printed version of the document, or any part of it,
for any other purpose without permission in writing from IEC.
oSIST prEN IEC 61189-2-808:2023
IEC CDV 61189-2-808 © IEC 2022 -2- 91/1833/CDV
1 CONTENTS
3 1 FOREWORD . 3
4 1 Scope . 5
5 2 Normative references . 5
6 3 Terms and Definitions . 5
7 4 Objective . 5
8 5 Test specimen . 5
9 6 Test equipment and procedures . 6
10 7 Test result . 8
11 8 Report . 9
12 9 Bibliographies. 9
13 Annex A . 10
14 Annex B . 12
15 B.1 Test specimen . 12
16 B.2 Die attach materials . 12
17 B.3 Test result . 13
18 Annex C . 15
19 C.1 Test specimen . 15
20 C.2 Test result . 15
21 Annex D . 17
23 Figure 1 – Structure of an assembly. 6
24 Figure 2 – The fabricated test sample . 6
25 Figure 3 – Test structure for measuring thermal resistance . 7
26 Figure 4 – Test result for thermal resistance of an assembly . 9
27 Figure 5 – Structure of test sample using die attach material . 12
28 Figure 6 – The fabricated test sample using die attach material . 12
29 Figure 7 – Test graph for die attach materials . 14
30 Figure 8 – Test structure for measuring thermal resistance . 15
31 Figure 9 – Test result for thermal resistance of assembly . 15
32 Figure 10 – Connection of the thermostat unit to the T3Ster® Main System Unit . 17
33 Figure 11 – Calibration diagram recorded by the T3Ster-thermostat . 18
35 Table 1 – Test result for thermal resistance of an assembly . 9
36 Table 2 – Properties for die attach materials . 13
37 Table 3 – Test result for die attach materials . 14
38 Table 4 – Test result for thermal resistance of assembly . 16
oSIST prEN IEC 61189-2-808:2023
IEC CDV 61189-2-808 © IEC 2022 -3- 91/1833/CDV
42 INTERNATIONAL ELECTROTECHNICAL COMMISSION
43 ____________
45 Test methods for electrical materials, printed board and other
46 interconnection structures and assemblies – Part 2-808: Thermal
47 resistance of an assembly by thermal transient method
50 1 FOREWORD
51 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
52 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
53 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
54 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
55 Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
56 preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
57 may participate in this preparatory work. International, governmental and non-governmental organizations liaising
58 with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
59 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
60 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
61 consensus of opinion on the relevant subjects since each technical committee has representation from all
62 interested IEC National Committees.
63 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
64 Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
65 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
66 misinterpretation by any end user.
67 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
68 transparently to the maximum extent possible in their national and regional publications. Any divergence between
69 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
70 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
71 assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
72 services carried out by independent certification bodies.
73 6) All users should ensure that they have the latest edition of this publication.
74 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
75 members of its technical committees and IEC National Committees for any personal injury, property damage or
76 other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
77 expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
78 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
79 indispensable for the correct application of this publication.
80 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
81 rights. IEC shall not be held responsible for identifying any or all such patent rights.
82 International Standard IEC 61189-2-808 Ed. 1 has been prepared by IEC technical committee
83 TC91: Electronics assembly technology.
84 The text of this International Standard is based on the following documents:
FDIS Report on voting
XX/XX/FDIS XX/XX/RVD
86 Full information on the voting for the approval of this International Standard can be found in the
87 report on voting indicated in the above table.
88 This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
89 The committee has decided that the contents of this document will remain unchanged until the
90 stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
91 the specific document. At this date, the document will be
oSIST prEN IEC 61189-2-808:2023
IEC CDV 61189-2-808 © IEC 2022 -4- 91/1833/CDV
92 • reconfirmed,
93 • withdrawn,
94 • replaced by a revised edition, or
95 • amended.
97 The National Committees are requested to note that for this document the stability date
98 is 2028.
99 THIS TEXT IS INCLUDED FOR THE INFORMATION OF THE NATIONAL COMMITTEES AND WILL BE DELETED
100 AT THE PUBLICATION STAGE.
oSIST prEN IEC 61189-2-808:2023
IEC CDV 61189-2-808 © IEC 2022 -5- 91/1833/CDV
105 Test methods for electrical materials, printed board and other
106 interconnection structures and assemblies – Part 2-808: Thermal
107 resistance of an assembly by thermal transient method
109 1 Scope
110 This document describes the thermal transient method to characterize the thermal resistance
111 of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g.
112 solder) and a dielectric layer with electrode. It is suitable to determine the thermal resistance
113 of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
115 Note: This method is not intended to measure and specify the value of the thermal resistance
116 of a dielectric material. For that purpose, other standards exist. Examples are given in Annex
117 A.
118 2 Normative references
119 JESD51-14 Transient Dual Interface Test Method
120 3 Terms and Definitions
121 For the purposes of this document, the terms and definitions given in IEC 60194-2 and the
122 following apply.
123 ISO and IEC maintain terminological databases for use in standardization at the following
124 addresses:
125 • IEC Electropedia: available at http://www.electropedia.org/
126 • ISO Online browsing platform: available at http://www.iso.org/obp
127 4 Objective
128 The increasing power consumption of devices such as LED require a close examination of the
129 heat dissipating path within thermal conductive printed circuit boards. Therefore, effective
130 removal of heat to maintain a safe junction temperature is the key to meet the heat flux by using
131 thermal conductive material for printed circuit boards. Thermal resistance is the crucial factor
132 of heat dissipation dielectric materials in printed circuit board. Therefore, with the aim to reduce
133 the thermal resistance in circuit boards, it is proposed to determine the thermal resistance by
134 measuring the thermal transient characteristics of an assembly.
135 5 Test specimen
136 To test the thermal resistance of an assembly, at first a test specimen shall be built, which
137 consists of a heat source (e.g. power device), an attachment material (e.g. solder) and a
138 dielectric layer with metal electrode. See Figure 1 for the structure. In the next step, the thermal
139 resistance of the a
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