SIST EN 62047-13:2012

Semiconductor devices - Microelectromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures

IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und Scherprüfverfahren zur Messung der Haftfestigkeit bei MEMS-Strukturen

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 13: Méthodes d'essais de types courbure et cisaillement de mesure de la résistance d'adhérence pour les structures MEMS

La CEI 62047-13:2012 spécifie la méthode d'essai d'adhérence entre des éléments microminiaturisés et un substrat au moyen d'éprouvettes de forme en colonnes. La présente norme internationale peut être appliquée à la mesure de la résistance d'adhérence des microstructures, préparées sur un substrat, dont la largeur et l'épaisseur sont de 1 μm à 1 mm, respectivement. La présente norme spécifie la méthode d'essai d'adhérence pour les éléments microminiaturisés, en vue d'une sélection optimale des matériaux et des conditions de traitement pour les dispositifs MEMS. La présente norme ne présente pas de restrictions particulières relatives au matériau des éprouvettes d'essai, à la taille de ces dernières, ni à la performance du dispositif de mesure, étant donné que les matériaux et la taille des composants des dispositifs MEMS comportent une large gamme et que les machines d'essais pour les matériaux microminiaturisés n'ont pas été généralisées.

Polprevodniški elementi - Mikroelektromehanski elementi - 13. del: Preskusne metode "upogibaj in reži" za merjenje adhezivne trdnosti struktur MEMS

Ta del standarda IEC 62047 določa adhezivno preskusno metodo med mikroelementi in podlago z uporabo stolpičaste oblike vzorcev. Ta mednarodni standard je mogoče uporabiti za merjenje adhezivne trdnosti mikrostruktur, pripravljenih na podlagi ter širokih 1 μm in debelih 1 mm. Mikroelementi naprav MEMS so sestavljeni iz laminiranih filmov s finim vzorcem na podlagi, ki so izdelani z nalaganjem, površinsko obdelavo in/ali premazovanjem s fotolitografijo. Naprave MEMS vključujejo veliko število vmesnikov med različnimi materiali, pri katerih med izdelavo ali med delovanjem občasno pride do razslojitve. Kombinacija materialov pri spoju določa adhezivno trdnost; poleg tega imajo okvare in preostala obremenitev v bližini vmesnika, ki se spreminjajo s pogoji obdelave, velik vpliv na adhezivno trdnost. Ta standard določa adhezivno preskusno metodo za mikroelemente, da se materiali in pogoji obdelave za naprave MEMS izberejo optimalno. Ta standard ne omejuje izrecno materiala preskusnih vzorcev, velikosti preskusnih vzorcev in delovanja merilne naprave, ker se materiali in velikost sestavnih delov naprave MEMS zelo razlikujejo, pri čemer preskusna naprava za mikromateriale še ni posplošena.

General Information

• Status: Published
• Publication Date: 22-Apr-2012
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 11-Apr-2012
• Due Date: 16-Jun-2012
• Completion Date: 23-Apr-2012
• Ref Project: EN 62047-13:2012 - Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62047-13:2012
01-junij-2012
Polprevodniški elementi - Mikroelektromehanski elementi - 13. del: Preskusne
metode "upogibaj in reži" za merjenje adhezivne trdnosti struktur MEMS
Semiconductor devices - Microelectromechanical devices - Part 13: Bend- and shear-
type test methods of measuring adhesive strength for MEMS structures
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und
Scherprüfverfahren zur Messung der Haftfestigkeit bei MEMS-Strukturen
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 13:
Méthodes d'essais de types courbure et cisaillement de mesure de la résistance
d'adhérence pour les structures MEMS
Ta slovenski standard je istoveten z: EN 62047-13:2012
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-13:2012 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62047-13:2012

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SIST EN 62047-13:2012

EUROPEAN STANDARD
EN 62047-13

NORME EUROPÉENNE
April 2012
EUROPÄISCHE NORM

ICS 31.080.99


English version


Semiconductor devices -
Micro-electromechanical devices -
Part 13: Bend- and shear- type test methods of measuring adhesive
strength for MEMS structures
(IEC 62047-13:2012)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauelemente der Mikrosystemtechnik -
Partie 13: Méthodes d'essais de types Teil 13: Biege- und Scherprüfverfahren
courbure et cisaillement de mesure de la zur Messung der Haftfestigkeit bei MEMS-
résistance d'adhérence pour les structures Strukturen
MEMS (IEC 62047-13:2012)
(CEI 62047-13:2012)





This European Standard was approved by CENELEC on 2012-04-03. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

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the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-13:2012 E

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SIST EN 62047-13:2012
EN 62047-13:2012 - 2 -
Foreword
The text of document 47F/109/FDIS, future edition 1 of IEC 62047-13, prepared by SC 47F, "Micro-
electromechanical systems", of IEC TC 47, "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN 62047-13:2012.

The following dates are fixed:
(dop) 2013-01-03
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2015-04-03

standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.

Endorsement notice
The text of the International Standard IEC 62047-13:2012 was approved by CENELEC as a European
Standard without any modification.

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SIST EN 62047-13:2012
- 3 - EN 62047-13:2012

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 62047-2 2006 Semiconductor devices - Micro- EN 62047-2 2006
electromechanical devices -
Part 2: Tensile testing methods of thin film
materials

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SIST EN 62047-13:2012

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SIST EN 62047-13:2012



IEC 62047-13

®


Edition 1.0 2012-02




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Semiconductor devices – Micro-electromechanical devices –

Part 13: Bend - and shear - type test methods of measuring adhesive strength

for MEMS structures




Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 13: Méthodes d'essais de types courbure et cisaillement de mesure de la


résistance d'adhérence pour les structures MEMS














INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX P


ICS 31.080.99 ISBN 978-2-88912-937-9



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62047-13:2012
– 2 – 62047-13  IEC:2012
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test method . 6
4.1 General . 6
4.2 Data analysis . 7
5 Test equipment . 8
5.1 General . 8
5.2 Actuator . 8
5.3 Force measurement sensor . 8
5.4 Alignment system . 8
5.5 Recorder . 8
6 Test pieces . 9
6.1 Design of test pieces . 9
6.2 Preparation of test pieces . 9
7 Test conditions . 9
7.1 Method for gripping . 9
7.2 Speed of testing . 9
7.3 Alignment of test piece . 9
7.4 Test environment. 10
8 Test report. 10
Annex A (informative) Technical background . 11
Bibliography . 14

Figure 1 – Columnar test pieces . 6
Figure 2 – Adhesive strength test method . 7
Figure 3 – Alignment between columnar test piece and loading tool . 10
Figure A.1 – Example of the RRT results (see [1]) . 11
Figure A.2 – Effects of aspect ratio of columnar test piece on the stress condition in
bend type test (see [2]) . 12
Figure A.3 – Effects of knife edge angle of loading tool and aspect ratio of columnar
test piece on the stress condition in bend test . 13

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SIST EN 62047-13:2012
62047-13  IEC:2012 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 13: Bend - and shear - type test methods
of measuring adhesive strength for MEMS structures


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
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services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-13 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/109/FDIS 47F/119/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 62047-13:2012
– 4 – 62047-13  IEC:2012
A list of all parts of IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 62047-13:2012
62047-13  IEC:2012 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 13: Bend - and shear - type test methods
of measuring adhesive strength for MEMS structures



1 Scope
This part of IEC 62047 specifies the adhesive testing method between micro-sized elements
and a substrate using the columnar shape of the specimens. This international standard can
be applied to adhesive strength measurement of microstructures, prepared on a substrate,
with width and thickness of 1 µm to 1 mm, respectively.
Micro-sized elements of MEMS devices are made up of laminated fine pattern films on a
substrate, which are fabricated by deposition, plating, and/or coating with photolithography.
MEMS devices include a large number of interfaces between dissimilar materials, at which
delamination occasionally occurs during fabrication or in operation. Combination of the
materials at the junction determines the adhesive strength; moreover, defects and residual
stress in the vicinity of the interface, which are changing by processing condition, strongly
affect the adhesive strength. This standard specifies the adhesive testing method for micro-
sized-elements in order to optimally select materials and processing conditions for MEMS
devices.
This standard does not particularly restrict test piece material, test piece size and
performance of the measuring device, since the materials and size of MEMS device
components range widely and testing machine for micro-sized materials has not been
generalized.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 62047-2:2006, Semiconductor devices – Micro-electromechanical devices – Part 2:
Tensile testing method of thin film materials
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
adhesive bend strength
nominal strength at failure on adhesive joint area by bending mode
3.2
adhesive shear strength
nominal strength at failure on adhesive joint area by shear mode

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SIST EN 62047-13:2012
– 6 – 62047-13  IEC:2012
33
1 1
44
SS
3
3
DD
44
ll
cc
2
2
TT

IEC  192/12

Key
Configurations or specimen Dimensions of specimen
1 Top view D diameter of columnar test piece
2 Side view l length
...