SIST EN 62137-1-3:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test

The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Oberflächenmontage-Technik - Verfahren zur Prüfung auf Umgebungseinflüsse und zur Prüfung der Haltbarkeit von Oberflächen-Lötverbindungen - Teil 1-3: Zyklische Fallprüfung

Technologie de montage en surface - Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface -- Partie 1-3: Essai de chute cyclique

La méthode d'essai décrite dans la CEI 62137-1-3:2008 s'applique aux joints de soudure situés entre les extrémités des composants pour montage en surface (CMS) et les plages d'accueil des cartes à circuits imprimées (PWBs). Le présent essai à pour but d'évaluer la résistance des joints de soudure des composants à sorties multiples de plus grande taille et d'autres composants dans des appareils (par exemple des appareils mobiles portatifs) au cas où l'appareil chuterait. Les propriétés des joints de soudure (par exemple, alliage de soudure, substrat, dispositif assemblé ou conception, etc.) sont évaluées pour aider à améliorer la résistance des joints de soudure.

Tehnologija površinske montaže - Okoljski preskusi in preskusne metode za določanje zanesljivosti spajkanih spojev, izdelanih s površinsko montažo - 1-3. del: Ciklični preskus s padanjem (IEC 62137-1-3:2008)

General Information

• Status: Published
• Publication Date: 10-May-2009
• ICS: 19.040 - Environmental testing
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 14-Apr-2009
• Due Date: 19-Jun-2009
• Completion Date: 11-May-2009
• Ref Project: EN 62137-1-3:2009 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62137-1-3:2009
01-junij-2009
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GRORþDQMH]DQHVOMLYRVWLVSDMNDQLKVSRMHYL]GHODQLKVSRYUãLQVNRPRQWDåR
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Surface mounting technology - Environmental and endurance test methods for surface
mount solder joint -- Part 1-3: Cyclic drop test
Technologie de montage en surface - Méthodes d'essais d'environnement et
d'endurance des joints brasés montés en surface -- Partie 1-3: Essai de chute cyclique
Ta slovenski standard je istoveten z: EN 62137-1-3:2009
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 62137-1-3:2009 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62137-1-3:2009

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SIST EN 62137-1-3:2009

EUROPEAN STANDARD
EN 62137-1-3

NORME EUROPÉENNE
February 2009
EUROPÄISCHE NORM

ICS 31.190


English version


Surface mounting technology -
Environmental and endurance test methods
for surface mount solder joint -
Part 1-3: Cyclic drop test
(IEC 62137-1-3:2008)


Technologie de montage en surface -  Oberflächenmontage-Technik -
Méthodes d'essais d'environnement Verfahren zur Prüfung
et d'endurance des joints brasés auf Umgebungseinflüsse
montés en surface - und zur Prüfung der Haltbarkeit
Partie 1-3: Essai de chute cyclique von Oberflächen-Lötverbindungen -
(CEI 62137-1-3:2008) Teil 1-3: Zyklische Fallprüfung
(IEC 62137-1-3:2008)




This European Standard was approved by CENELEC on 2009-02-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: avenue Marnix 17, B - 1000 Brussels


© 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62137-1-3:2009 E

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SIST EN 62137-1-3:2009
EN 62137-1-3:2009 - 2 -
Foreword
The text of document 91/802/FDIS, future edition 1 of IEC 62137-1-3, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 62137-1-3 on 2009-02-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2009-11-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2012-02-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62137-1-3:2008 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
1)
IEC 60068-2-27 NOTE  Harmonized as EN 60068-2-27:200X (not modified).
IEC 60068-2-31 NOTE  Harmonized as EN 60068-2-31:2008 (not modified).
__________


1)
To be ratified.

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SIST EN 62137-1-3:2009
- 3 - EN 62137-1-3:2009
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

2) 3)
IEC 60068-1 - Environmental testing - EN 60068-1 1994
Part 1: General and guidance


2) 3)
IEC 60194 - Printed board design, manufacture and EN 60194 2006
assembly - Terms and definitions


IEC 61188-5 Series Printed boards and printed board EN 61188-5 Series
assemblies - Design and use -
Part 5: Attachment (land/joint) considerations


2) 3)
IEC 61190-1-2 - Attachment materials for electronic EN 61190-1-2 2007
assembly -
Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics
assembly


2) 3)
IEC 61192-1 - Workmanship requirements for soldered EN 61192-1 2003
electronic assemblies -
Part 1: General


2) 3)
IEC 61249-2-7 - Materials for printed boards and other EN 61249-2-7 2002
interconnecting structures - + corr. September 2005
Part 2-7: Reinforced base materials, clad and
unclad - Epoxide woven E-glass laminated
sheet of defined flammability (vertical burning
test), copper-clad


2) 3)
IEC 61760-1 - Surface mounting technology - EN 61760-1 2006
Part 1: Standard method for the specification
of surface mounting components (SMDs)




2)
Undated reference.
3)
Valid edition at date of issue.

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SIST EN 62137-1-3:2009

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SIST EN 62137-1-3:2009
IEC 62137-1-3
Edition 1.0 2008-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Surface mounting technology – Environmental and endurance test methods for
surface mount solder joint –
Part 1-3: Cyclic drop test

Technologie de montage en surface – Méthodes d’essais d’environnement et
d’endurance des joints brasés montés en surface –
Partie 1-3: Essai de chute cyclique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
T
CODE PRIX
ICS 31.190 ISBN 2-8318-1018-1
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62137-1-3:2009
– 2 – 62137-1-3 © IEC:2008
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .5
3 Terms and definitions .5
4 General remarks.6
5 Test equipment and materials.7
5.1 Reflow soldering oven .7
5.2 Drop impact test equipment.7
5.3 Test substrate .7
5.4 Solder alloy .7
5.5 Solder paste.7
5.6 Specimen components .7
5.7 Strain gauge.8
6 Mounting method.8
7 Test method and procedure, and judgment conditions .8
7.1 Test procedure .8
7.2 Judgment conditions .9
8 Items to be included in the test report.9
9 Items to be given in the product specification .9
Annex A (normative) Drop impact test equipment.11
Annex B (normative) Test method and procedure.13
Annex C (informative) An example of test equipment and procedure.16
Annex D (informative) An example of strain gauge attachment procedure .18
Bibliography.23

Figure 1 – Area for evaluation in the cyclic drop test.6
Figure 2 – Typical reflow soldering profile.8
Figure A.1 – Conceptual illustration of a substrate securing jig (reference) .12
Figure B.1 – Strain gauge attachment example and guide mark .13
Figure B.2 – Strain and other waveforms (example).14
Figure B.3 – Examples of crack (fracture) modes.14
Figure B.4 – Correlation between the number of failures and the maximum strain.15
Figure C.1 – Example of drop impact test equipment and connections for testing .16
Figure D.1 – Items to use.19
Figure D.2 – Strain gauge attachment procedures .21
Figure D.3 – Gauge factor compensation .21
Figure D.4 – Example of attaching strain gauge and guide mark dimensions .22

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SIST EN 62137-1-3:2009
62137-1-3 © IEC:2008 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS
FOR SURFACE MOUNT SOLDER JOINT –

Part 1-3: Cyclic drop test


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62137-1-3 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/802/FDIS 91/825/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 62137-1-3:2009
– 4 – 62137-1-3 © IEC:2008
A list of all parts of the IEC 62137 series, under the general title Surface mounting technology
– Environmental and endurance test methods for surface mount solder joint, can be found on
the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 62137-1-3:2009
62137-1-3 © IEC:2008 – 5 –
SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS
FOR SURFACE MOUNT SOLDER JOINT –

Part 1-3: Cyclic drop test



1 Scope
The test method described in this part of IEC 62137 applies to solder joints between terminals
of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).
This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal
components and other components in devices (e.g. handheld mobile devices) in the event
that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate,
mounted device or design, etc.) are evaluated to assist in improving the strength of the solder
joints.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance
IEC 60194, Printed boards design, manufacture and assembly – Terms and definitions
IEC 61249-2-7, Materials for printed boards and other interconnecting structures – Part 2-7:
Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet of
defined flammability (vertical burning test), copper-clad
IEC 61188-5 (all parts 5), Printed boards and printed board assemblies – Design and use –
Part 5: Attachment (land-joint) considerations
IEC 61190-1-2, Attachment materials for electronic assembly – Part 1-2: Requirements for
soldering pastes for high-quality interconnects in electronics assembly
IEC 61192-1, Workmanship requirements for soldered electronic assemblies – Part 1: General
IEC 61760-1, Surface mounting technology – Part 1: Standard method for the specification of
surface mounting components (SMDs)
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60068-1 and
IEC 60194, as well as the following definitions, apply.
3.1
drop impact strength
strength of the test substrate held by a jig that is dropped from a specified height, as
represented by the number of cyclic drops that finally cause fracture at the intermetallic, the

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SIST EN 62137-1-3:2009
– 6 – 62137-1-3 © IEC:2008
surface plating, or within the joint between a surface mounting device (SMD) termination and
a printed wiring board (PWB) copper land termination
3.2
strain
substrate surface strain
value indication measured by the strain gauge attached to the surface of the test substrate
NOTE It is a numeric dimensionless quantity representing the degree of stretching observed when the test
substrate is distorted.
3.3
maximum strain
maximum strain in the tensile side (+) on the measured strain waveform
3.4
momentary interruption detector
device that detects extremely short electrical discontinuity (momentary interruptions) in a
daisy-chain circuit
4 General remarks
The mechanical properties of the joint between a terminal to a land on a printed wiring board
using lead-free solder are not the same for the joint using tin-lead solder due to the difference
in composing elements of the solders. Thus it becomes important to test the mechanical
properties of solder joints using different solder alloys.
This test is to evaluate the durability of joints that are formed by reflow soldering between
SMD pins/electrodes and substrate lands in relation to drop heights. To evaluate the drop
impact that the specimen joint receives, the strain can be used as an indicator of the impact,
and it can quantitatively be measured using a strain gauge.
NOTE This drop impact test is not intended to be targeted at components themselves. Refer to IEC 60068-2-27
and IEC 60068-2-31 for test methods of the components.
Figure 1 is a conceptual illustration of the joint strength evaluation area of this test.

SMD component



Plated layers

Evaluation area
Solder

Intermetallic compound
layers



Substrate land
Substrate




IEC  2095/08
Figure 1 – Area for evaluation in the cyclic drop test

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SIST EN 62137-1-3:2009
62137-1-3 © IEC:2008 – 7 –
5 Test equipment and materials
5.1 Reflow soldering oven
Unless otherwise specified, the reflow soldering oven shall be able to realize the temperature
profile given in Figure 2.
5.2 Drop impact test equipment
This test equipment shall consist of a tester with a substrate securing jig and a measuring
instrument. Unless otherwise specified, the following specifications apply.
a) Tester: Use a tester that fulfills the requirements specified in Clause A.2.
b) Substrate securing jig: Use a substrate securing jig that fulfills the requirements specified
in A.2.2.
c) Measuring instrument: Use a measurement instrument that fulfills the requirements
specified in A.2.3.
5.3 Test substrate
Unless otherwise prescribed by the relevant specification, the test shall be conducted on a
specimen (device) mounted by its normal means on the following substrate:
a) Material: The substrate shall be a general double-sided board that is, as specified in
IEC 61249-2-7.
b) Thickness: The substrate thickness shall be either 1,0 mm or as specified in
IEC 61249-2-7.
c) Size: The substrate shall be of a size that allows testing u
...