SIST EN 61189-2:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen -- Teil 2: Prüfverfahren für Materialien für Verbindungsstrukturen

Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles -- Partie 2: Méthodes d'essai des matériaux pour structures d'interconnexion

Preskusne metode za električne materiale, tiskane plošče, povezovalne strukture in sestave - 2. del: Preskusne metode za materiale povezovalnih struktur (IEC 61189-2:2006)

General Information

• Status: Published
• Publication Date: 30-Nov-2006
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Dec-2006
• Due Date: 01-Dec-2006
• Completion Date: 01-Dec-2006
• Ref Project: EN 61189-2:2006 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Relations

• Replaces: SIST EN 61189-2:2002 + A1:2002 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures
• Effective Date: 01-Nov-2009
• Replaces: SIST EN 61189-2:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures
• Effective Date: 01-Dec-2006

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EUROPEAN STANDARD
EN 61189-2
NORME EUROPÉENNE
September 2006
EUROPÄISCHE NORM
ICS 31.180 Supersedes EN 61189-2:1997 + A1:2000

English version
Test methods for electrical materials, printed boards
and other interconnection structures and assemblies
Part 2: Test methods for materials
for interconnection structures
(IEC 61189-2:2006)
Méthodes d'essais pour les matériaux Prüfverfahren für Elektromaterialien,
électriques, les cartes imprimées Leiterplatten und andere
et autres structures d'interconnexion Verbindungsstrukturen
et ensembles und Baugruppen
Partie 2: Méthodes d'essai des matériaux Teil 2: Prüfverfahren für Materialien
pour structures d'interconnexion für Verbindungsstrukturen
(CEI 61189-2:2006) (IEC 61189-2:2006)

This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61189-2:2006 E
Foreword
The text of document 91/564/FDIS, future edition 2 of IEC 61189-2, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61189-2 on 2006-09-01.
This European Standard supersedes EN 61189-2:1997 + A1:2000.
The significant technical changes with respect to EN 61189-2:1997 + A1:2000 concern the addition of
several new tests in the following categories:
- C: Chemical test methods
- D: Dimensional test methods
- E: Electrical test methods
- M: Mechanical test methods
- N: Environmental test methods
- X: Miscellaneous test methods
This standard forms part of a series and should be used in conjunction with other parts in the same
series, under the main title Test methods for electrical materials, interconnection structures and
assemblies:
Part 1: General test methods and methodology
Part 2: Test methods for materials for interconnection structures
Part 3: Test methods for interconnection structures (printed boards)
Part 4: Test methods for electronic components assembling characteristics
Part 5: Test methods for printed board assemblies
Part 6: Test methods for materials used in electronic assemblies
It should also be read in conjunction with EN 60068, Environmental testing.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2007-06-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2009-09-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61189-2:2006 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 61189-2:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1)
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance
2)
IEC 60068-2-2 1974 Environmental testing EN 60068-2-2 1993
Part 2: Tests - Tests B: Dry heat

IEC 60068-2-78 2001 Environmental testing EN 60068-2-78 2001
Part 2-78: Tests - Test Cab: Damp heat,
steady state
IEC 60093 1980 Methods of test for volume resistivity and HD 429 S1 1983
surface resistivity of solid electrical insulating
materials
IEC 60243-1 1998 Electrical strength of insulating materials - EN 60243-1 1998
Test methods
Part 1: Tests at power frequencies

IEC 61189-3 1997 Test methods for electrical materials, printed EN 61189-3 1997
boards and other interconnection structures
and assemblies
Part 3: Test methods for interconnection
structures (printed boards)
ISO 3274 1996 Geometrical Product Specifications (GPS) - EN ISO 3274 1997
Surface texture: Profile method - Nominal
characteristics of contact (stylus) instruments

ISO 9001 2000 Quality management systems - EN ISO 9001 2000
Requirements
ANSI/UL-94 1993 Standard for tests for flammability of plastic - -
materials for parts in devices and aplliances

1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1.
2)
EN 60068-2-2 includes Supplement A:1976 to IEC 60068-2-2.

INTERNATIONAL IEC
STANDARD 61189-2
Second edition
2006-05
Test methods for electrical materials, printed
boards and other interconnection structures
and assemblies –
Part 2:
Test methods for materials
for interconnection structures

 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale XF
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 61189-2  IEC:2006(E)
CONTENTS
FOREWORD.6
INTRODUCTION.8

1 Scope.9
2 Normative references.9
3 Accuracy, precision and resolution .9
3.1 Accuracy .10
3.2 Precision .10
3.3 Resolution .11
3.4 Report .11
3.5 Student’s "t" distribution.11
3.6 Suggested uncertainty limits .12
4 Catalogue of approved test methods .13
5 P: Preparation/conditioning test methods .13
5.1 Test 2P01: Dry heat (under consideration) .13
5.2 Test 2P02: Solder float stress (under consideration) .13
6 V: Visual test methods .13
7 D: Dimensional test methods .13
7.1 Test 2D01: Thickness of base materials and rigid boards .13
8 C: Chemical test methods .15
8.1 Test 2C01: Resistance to sodium hydroxide of base materials.15
8.2 Test 2C02: Gel time of epoxy based prepreg materials.16
8.3 Test 2C03: Resin content of prepreg materials by treated weight.17
8.4 Test 2C04: Volatile content of prepreg materials .19
8.5 Test 2C05: Blistering during heat shock .21
8.6 Test 2C06: Flammability, vertical burning test for rigid materials .23
8.7 Test 2C07: Flammability; horizontal burning test for rigid materials.26
8.8 Test 2C08: Flammability, flex material .29
8.9 Test 2C09: Melting viscosity of prepreg materials.33
8.10 Test 2C10: Resin content of prepreg materials by sublimation.35
8.11 Test 2C11: UV blocking characteristics of laminates .37
8.12 Test 2C12: Total halogen content in base materials .38
9 M: Mechanical test methods.42
9.1 Test 2M01: Test method for bow and twist .42
9.2 Test 2M02: Bow/twist after etching and heating.43
9.3 Test 2M03: Cure factor of base materials by differential scanning calorimetry
(DSC) or thermomechanical analysis (TMA) .45
9.4 Test 2M04: Twist after heating (under consideration) .46
9.5 Test 2M05: Pull-off strength.46
9.6 Test 2M06: Peel strength after exposure to solvent vapour.48
9.7 Test 2M07: Peel strength after immersion in solvent .50
9.8 Test 2M08: Flexural strength (under consideration).51
9.9 Test 2M09: Resin flow of prepreg material .51
9.10 Test 2M10: Glass transition temperature of base materials by differential
scanning calorimetry (DSC) .53

61189-2  IEC:2006(E) – 3 –
9.11 Test 2M11: Glass transition temperature of base materials by
thermomechanical analysis (TMA) .55
9.12 Test 2M12: Surface waviness .58
9.13 Test 2M13: Peel strength as received .59
9.14 Test 2M14: Peel strength after heat shock .60
9.15 Test 2M15: Peel strength after dry heat.63
9.16 Test 2M16: Peel strength after simulated plating .64
9.17 Test 2M17: Peel strength at high temperature .66
9.18 Test 2M18: Surface quality (under consideration).68
9.19 Test 2M19: Punching (under consideration) .68
9.20 Test 2M20: Flexural strength .68
9.21 Test 2M21: Rolling fatigue of flexible base materials .69
9.22 Test 2M22: Weight of foil after lamination .71
9.23 Test method 2M23: Rectangularity of cut panels .73
9.24 Test 2M24: Coefficient of thermal expansion (under consideration) .74
9.25 Test 2M25: Time to delamination by thermomechanical analysis (TMA).74
9.26 Test 2M26: Scaled flow test for prepreg materials .75
9.27 Test 2M27: The resin flow properties of coverlay films, bonding films and
adhesive cast films used in the fabrication of flexible printed boards .78
10 Electrical test methods.
...