SIST EN 60749-30:2005/A1:2011

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30: Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor Zuverlässigkeitsprüfungen

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques -- Partie 30: Préconditionnement des composants pour montage en surface non hermétiques avant les essais de fiabilité

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 30. del: Predkondicioniranje nehermetičnih elementov za površinsko namestitev pred preskušanjem zanesljivosti

Ta del IEC 60749 vzpostavlja standardni postopek za ugotavljanje prekondicioniranja nehermetičnih elementov za površinsko namestitev (SMD) pred preskušanjem zanesljivosti. Preskusna metoda opredeljuje tok prekondicioniranja za nehermetične SMD v trdnem stanju, značilen za tipično industrijsko pretočno spajkanje z več spajkami. Ti SMD morajo biti obdelani z ustreznim zaporedjem prekondicioniranja, opisanim v tem standardu, preden se interno preskuša njihova zanesljivost (nadzor usposobljenosti in/ali zanesljivosti), da se ovrednoti dolgoročna zanesljivost (na katero vpliva stres na spajko).

General Information

• Status: Withdrawn
• Publication Date: 13-Sep-2011
• Withdrawal Date: 05-Nov-2023
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 06-Nov-2023
• Due Date: 29-Nov-2023
• Completion Date: 06-Nov-2023
• Ref Project: EN 60749-30:2005/A1:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Relations

• Replaced By: SIST EN IEC 60749-30:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020)
• Effective Date: 29-Sep-2020
• Amends: SIST EN 60749-30:2005 - Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• Effective Date: 28-Jan-2023
• Amends: SIST EN 60749-30:2005 - Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• Effective Date: 07-Jun-2022
• Revised: SIST EN 60749-30:2005 - Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• Effective Date: 08-Jan-2010

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60749-30:2005/A1:2011
01-oktober-2011
3ROSUHYRGQLãNLHOHPHQWL0HKDQVNHLQNOLPDWVNHSUHVNXVQHPHWRGHGHO
3UHGNRQGLFLRQLUDQMHQHKHUPHWLþQLKHOHPHQWRY]DSRYUãLQVNRQDPHVWLWHYSUHG
SUHVNXãDQMHP]DQHVOMLYRVWL
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning
of non-hermetic surface mount devices prior to reliability testing
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30:
Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor
Zuverlässigkeitsprüfungen
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques -- Partie
30: Préconditionnement des composants pour montage en surface non hermétiques
avant les essais de fiabilité
Ta slovenski standard je istoveten z: EN 60749-30:2005/A1:2011
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-30:2005/A1:2011 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-30:2005/A1:2011

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SIST EN 60749-30:2005/A1:2011

EUROPEAN STANDARD
EN 60749-30/A1

NORME EUROPÉENNE
July 2011
EUROPÄISCHE NORM

ICS 31.080.01


English version


Semiconductor devices -
Mechanical and climatic test methods -
Part 30: Preconditioning of non-hermetic surface mount devices prior to
reliability testing
(IEC 60749-30:2005/A1:2011)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques et Mechanische und klimatische
climatiques - Prüfverfahren -
Partie 30: Préconditionnement des Teil 30: Behandlung nicht hermetisch
composants pour montage en surface non verkappter oberflächenmontierbarer
hermétiques avant les essais de fiabilité Bauelemente vor
(CEI 60749-30:2005/A1:2011) Zuverlässigkeitsprüfungen
(IEC 60749-30:2005/A1:2011)




This amendment A1 modifies the European Standard EN 60749-30:2005; it was approved by CENELEC on
2011-06-29. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this amendment the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This amendment exists in three official versions (English, French, German). A version in any other language
made by translation under the responsibility of a CENELEC member into its own language and notified to the
Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-30:2005/A1:2011 E

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SIST EN 60749-30:2005/A1:2011
EN 60749-30:2005/A1:2011 - 2 -
Foreword
The text of document 47/2019/CDV, future amendment 1 to IEC 60749-30:2005, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as amendment A1 to EN 60749-30:2005 on 2011-06-29.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the amendment has to be
implemented at national level by publication of
(dop) 2012-03-29
an identical national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2014-06-29
with the amendment have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of amendment 1:2011 to the International Standard IEC 60749-30:2005 was approved by
CENELEC as an amendment to the European Standard without any modification.
__________

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SIST EN 60749-30:2005/A1:2011
- 3 - EN 60749-30:2005/A1:2011
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The f
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