SIST EN 60749-30:2005

Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren -- Teil 30: Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor Zuverlässigkeitsprüfungen

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques -- Partie 30: Préconditionnement des composants pour montage en surface non hermétiques avant les essais de fiabilité

Etablit une procédure normalisée de détermination du préconditionnement pour les composants pour montage en surface (CMS) non hermétiques avant les essais de fiabilité. Cette méthode d'essai définit une refusion de préconditionnement pour les CMS à l'état solide non hermétiques représentative d'une opération de refusion de soudure multiple industrielle type. Il convient que les CMS soient soumis à la séquence de préconditionnement appropriée décrite dans ce document avant d'être soumis aux essais de fiabilité sur place spécifiques pour évaluer la fiabilité à long terme.

Polprevodniški elementi – Mehanske in klimatske preskusne metode – 30. del: Predkondicioniranje nehermetičnih elementov za površinsko namestitev pred preskušanjem zanesljivosti (IEC 60749-30:2005)

General Information

• Status: Withdrawn
• Publication Date: 30-Nov-2005
• Withdrawal Date: 05-Nov-2023
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 06-Nov-2023
• Due Date: 29-Nov-2023
• Completion Date: 06-Nov-2023
• Ref Project: EN 60749-30:2005 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Relations

• Replaced By: SIST EN IEC 60749-30:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020)
• Effective Date: 29-Sep-2020
• Amended By: SIST EN 60749-30:2005/A1:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• Effective Date: 28-Jan-2023
• Amended By: SIST EN 60749-30:2005/A1:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• Effective Date: 07-Jun-2022
• Revised: SIST EN IEC 60749-30:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020)
• Effective Date: 16-Apr-2019
• Revised: SIST EN 60749-30:2005/A1:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• Effective Date: 08-Jan-2010

Standards Content (Sample)

SLOVENSKI SIST EN 60749-30:2005

STANDARD
december 2005
Polprevodniški elementi – Mehanske in klimatske preskusne metode – 30.
del: Predkondicioniranje nehermetičnih elementov za površinsko namestitev
pred preskušanjem zanesljivosti (IEC 60749-30:2005)
Semiconductor devices – Mechanical and climatic test methods – Part 30:
Preconditioning of non-hermetic surface mount devices prior to reliability testing
(IEC 60749-30:2005)
ICS 31.080.01 Referenčna številka
SIST EN 60749-30:2005(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60749-30
NORME EUROPÉENNE
EUROPÄISCHE NORM March 2005

ICS 31.080.01


English version


Semiconductor devices -
Mechanical and climatic test methods
Part 30: Preconditioning of non-hermetic surface mount devices
prior to reliability testing
(IEC 60749-30:2005)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques Prüfverfahren
Partie 30: Préconditionnement Teil 30: Behandlung nicht hermetisch
des composants pour montage verkappter oberflächenmontierbarer
en surface non hermétiques Bauelemente vor
avant les essais de fiabilité Zuverlässigkeitsprüfungen
(CEI 60749-30:2005) (IEC 60749-30:2005)




This European Standard was approved by CENELEC on 2005-02-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60749-30:2005 E

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EN 60749-30:2005 - 2 -
Foreword
The text of document 47/1790/FDIS, future edition 1 of IEC 60749-30, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-30 on 2005-02-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-11-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-02-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-30:2005 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 60749-30:2005
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
- 1) 2)
IEC 60749-4 Semiconductor devices - Mechanical and EN 60749-4 2002
climatic test methods
Part 4: Damp heat, steady state, highly
accelerated stress test (HAST)

1) 2)
IEC 60749-5 - Part 5: Steady-state temperature humidity EN 60749-5 2003
bias life test

1) 2)
IEC 60749-11 - Part 11: Rapid change of temperature - EN 60749-11 2002
Two-fluid-bath method

IEC 60749-20 2002 Part 20: Resistance of plastic- EN 60749-20 2003
encapsulated SMDs to the combined
effect of moisture and soldering heat

1) 2)
IEC 60749-24 - Part 24: Accelerated moisture resistance EN 60749-24 2004
- Unbiased HAST

IEC 60749-
...