Printed board design, manufacture and assembly - Terms and definitions

IEC 60194:2015 defines the terminology used in the field of printed circuit boards and printed circuit board assembly products. The main changes with respect to the previous edition are the following:
- Some two hundred terms and definitions have been updated, where applicable, and
- another two hundred new terms and definitions have been added.

Conception, fabrication et assemblage des cartes imprimées - Termes et définitions

L'IEC 60194:2015 définit la terminologie utilisée dans le domaine des cartes de circuits imprimés et des produits d'assemblage de cartes de circuits imprimés. Les principaux changements par rapport à l'édition précédente sont les suivantes:
- Quelque deux cents termes et définitions ont été mis à jour, le cas échéant, et
- deux cents nouveaux termes et définitions ont été ajoutés.

General Information

Status
Published
Publication Date
14-Apr-2015
Current Stage
DELPUB - Deleted Publication
Completion Date
09-Feb-2021
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IEC 60194
Edition 6.0 2015-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Printed board design, manufacture and assembly – Terms and definitions
Conception, fabrication et assemblage des cartes imprimées – Termes et
définitions
IEC 60194:2015-04(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 60194
Edition 6.0 2015-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Printed board design, manufacture and assembly – Terms and definitions
Conception, fabrication et assemblage des cartes imprimées – Termes et
définitions
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-2592-9

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 60194:2015 © IEC 2015
CONTENTS

FOREWORD ........................................................................................................................... 6

INTRODUCTION ..................................................................................................................... 8

1 Scope .............................................................................................................................. 9

2 Normative references ...................................................................................................... 9

3 Terms and definitions ...................................................................................................... 9

4 A ..................................................................................................................................... 9

5 B ................................................................................................................................... 23

6 C ................................................................................................................................... 41

7 D ................................................................................................................................... 71

8 E ................................................................................................................................... 83

9 F ................................................................................................................................... 93

10 G ................................................................................................................................. 106

11 H ................................................................................................................................. 109

12 I ................................................................................................................................... 117

13 J .................................................................................................................................. 122

14 K ................................................................................................................................. 123

15 L .................................................................................................................................. 125

16 M ................................................................................................................................. 134

17 N ................................................................................................................................. 145

18 O ................................................................................................................................. 149

19 P ................................................................................................................................. 154

20 Q ................................................................................................................................. 175

21 R ................................................................................................................................. 176

22 S ................................................................................................................................. 188

23 T ................................................................................................................................. 213

24 U ................................................................................................................................. 225

25 V ................................................................................................................................. 228

26 W ................................................................................................................................ 232

27 X ................................................................................................................................. 237

28 Y ................................................................................................................................. 237

29 Z ................................................................................................................................. 238

Annex A (informative) Principles and use of the classifiction code ..................................... 239

A.1 General ............................................................................................................... 239

A.2 Background......................................................................................................... 239

A.3 List of codes ....................................................................................................... 240

Annex B (informative) Abbreviations .................................................................................. 243

B.1 – A – ................................................................................................................... 243

B.2 – B – ................................................................................................................... 243

B.3 – C – ................................................................................................................... 244

B.4 – D – ................................................................................................................... 246

B.5 – E – ................................................................................................................... 247

B.6 – F – ................................................................................................................... 248

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IEC 60194:2015 © IEC 2015 – 3 –

B.7 – G – .................................................................................................................. 248

B.8 – H – ................................................................................................................... 248

B.9 – I – .................................................................................................................... 249

B.10 – J – ................................................................................................................... 249

B.11 – K – ................................................................................................................... 249

B.12 – L – ................................................................................................................... 249

B.13 – M – .................................................................................................................. 250

B.14 – N – ................................................................................................................... 251

B.15 – O – .................................................................................................................. 252

B.16 – P – ................................................................................................................... 252

B.17 – Q – .................................................................................................................. 253

B.18 – R – ................................................................................................................... 253

B.19 – S – ................................................................................................................... 254

B.20 – T – ................................................................................................................... 255

B.21 – U – ................................................................................................................... 256

B.22 – V – ................................................................................................................... 256

B.23 – W – .................................................................................................................. 256

B.24 – Z – ................................................................................................................... 256

Bibliography ........................................................................................................................ 257

Figure 1 – Access hole ......................................................................................................... 11

Figure 2 – Alignment mark .................................................................................................... 14

Figure 3 – Lands with anchoring spurs .................................................................................. 17

Figure 4 – Annular ring (annular width) ................................................................................. 18

Figure 5 – Area array ............................................................................................................ 19

Figure 6 – Simplified flow chart of printed board design/fabrication sequence ....................... 20

Figure 7 – Aspect ratio (hole) ................................................................................................ 21

Figure 8 – Asymmetric stripline ............................................................................................. 22

Figure 9 – Axial lead ............................................................................................................. 23

Figure 10 – Back bonding ..................................................................................................... 24

Figure 11 – Back-bared land ................................................................................................. 24

Figure 12 – Ball grid array (BGA) .......................................................................................... 26

Figure 13 – Barrel crack ........................................................................................................ 27

Figure 14 – Example of feature location using baseline dimensions ...................................... 28

Figure 15 – Bathtub curve ..................................................................................................... 29

Figure 16 – Beam-lead device .............................................................................................. 30

Figure 17 – Bifurcated solder terminal................................................................................... 31

Figure 18 – Buried via and blind via ...................................................................................... 33

Figure 19 – Bow .................................................................................................................... 36

Figure 20 – Breakaway ......................................................................................................... 37

Figure 21 – Bumped die ........................................................................................................ 39

Figure 22 – But plating joint (wrap plating) ............................................................................ 41

Figure 23 – Button plating ..................................................................................................... 41

Figure 24 – Castellation ........................................................................................................ 44

Figure 25 – Centre to centre spacing (pitch) ......................................................................... 44

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– 4 – IEC 60194:2015 © IEC 2015

Figure 26 – Typical characteristic curve ................................................................................ 46

Figure 27 – Chip on board (COB) .......................................................................................... 49

Figure 28 – Clearance hole ................................................................................................... 51

Figure 29 – Clinched-wire through connection....................................................................... 51

Figure 30 – Comb pattern ..................................................................................................... 53

Figure 31 – Conductor base spacing ..................................................................................... 58

Figure 32 – Conductor spacing ............................................................................................. 59

Figure 33 – Contact angle (soldering) ................................................................................... 61

Figure 34 – Crosshatching .................................................................................................... 68

Figure 35 – Cup solder terminal ............................................................................................ 69

Figure 36 – Dewetting ........................................................................................................... 76

Figure 37 – Example of an embedded component ................................................................. 87

Figure 38 – Embedded passive component (device) ............................................................. 88

Figure 39 – Etch factor ......................................................................................................... 90

Figure 40 – Etchback ............................................................................................................ 90

Figure 41 – Etching indicator ................................................................................................ 91

Figure 42 – Fillet (adhesive) ................................................................................................. 96

Figure 43 – Flag ................................................................................................................... 99

Figure 44 – Flare ................................................................................................................ 100

Figure 45 – Flip chip ........................................................................................................... 102

Figure 46 – Ground plane clearance ................................................................................... 109

Figure 47 – Heel fillet .......................................................................................................... 111

Figure 48 – Histogram ........................................................................................................ 112

Figure 49 – Hole, knee ........................................................................................................ 113

Figure 50 – Hole breakout ................................................................................................... 113

Figure 51 – Hole void .......................................................................................................... 114

Figure 52 – Hook ................................................................................................................ 115

Figure 53 – Hook solder terminal ........................................................................................ 115

Figure 54 – Layer-to-layer spacing ...................................................................................... 128

Figure 55 – Leaded surface-mount component – Gull wing shaped lead ............................. 129

Figure 56 – Magnification power parameters ....................................................................... 135

Figure 57 – Meniscus .......................................................................................................... 137

Figure 58 – Microstrip ......................................................................................................... 139

Figure 59 – Mirrored pattern ............................................................................................... 141

Figure 60 – Nail heading ..................................................................................................... 145

Figure 61 – Negative etchback ............................................................................................ 145

Figure 62 – Nonfunctional interfacial connection ................................................................. 147

Figure 63 – Nonwetting ....................................................................................................... 148

Figure 64 – Normal distribution ........................................................................................... 148

Figure 65 – Open point ....................................................................................................... 151

Figure 66 – Outgrowth, overhang and undercut................................................................... 152

Figure 67 – Outgrowth, overhang and undercut................................................................... 153

Figure 68 – Overlap (drill) ................................................................................................... 153

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IEC 60194:2015 © IEC 2015 – 5 –

Figure 69 – Passive array ................................................................................................... 157

Figure 70 – Perforated (pierced) solder terminal ................................................................. 159

Figure 71 – Pin grid array ................................................................................................... 162

Figure 72 – Plated through-hole (PTH) ................................................................................ 164

Figure 73 – Primary flare .................................................................................................... 170

Figure 74 – Primary taper ................................................................................................... 170

Figure 75 – Resin recession ............................................................................................... 181

Figure 76 – Printed board viewing orientations.................................................................... 185

Figure 77 – Shadowing ....................................................................................................... 192

Figure 78 – Tape automated bonding .................................................................................. 214

Figure 79 – Tombstoned component ................................................................................... 221

Figure 80 – Turret solder terminal ....................................................................................... 225

Figure 81 – Via planarization .............................................................................................. 230

Figure 82 – Wrap plating ..................................................................................................... 237

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– 6 – IEC 60194:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY –
TERMS AND DEFINITIONS
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

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governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

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misinterpretation by any end user.

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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60194 has been prepared by subcommittee 91: Electronics

assembly technology.

This sixth edition cancels and replaces the fifth edition, published in 2006 and constitutes a

technical revision.

The main changes with respect to the previous edition are the following: Some two hundred

terms and definitions have been updated, where applicable, and another two hundred new

terms and definitions have been added.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1236/FDIS 91/1253/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.
---------------------- Page: 8 ----------------------
IEC 60194:2015 © IEC 2015 – 7 –
Thi
...

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