25.160.50 - Brazing and soldering

This document specifies the performance requirements for fluxes in solid, liquid and paste forms
intended for use with soft solders.
NOTE 1 ISO 9454-1 specifies the requirements for labelling and packaging as well as the coding system for the
classification of the fluxes.
NOTE 2 Some of the fluxes intended for inert gas and vapour phase soldering may not pass some of the criteria
in Tables 1 and 2.
Requirements for these fluxes are agreed between the purchaser and the supplier.

The principle of the method specified is to distil a prepared flux solution with sodium hydroxide to expel the ammonia present in the flux, to pass the resulting distillate into a standard sulfuric acid solution, to titrate the excess acid with sodium hydroxide solution and to calculate the ammonia content of the flux. Applies to fluxes of class 3.1.1 only, as defined in ISO 9454-1.

This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper.
The test is applicable to all fluxes of type 1 as defined in ISO 9454-1.

This document specifies the requirements for chemical composition for soft solder alloys containing
two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.

This document specifies a distillation method for the determination of the ammonia content of solid, paste or liquid fluxes. The method is applicable to fluxes of class 311 and 321 only, as defined in ISO 9454‑1.

This document specifies the performance requirements for fluxes in solid, liquid and paste forms intended for use with soft solders. NOTE 1 ISO 9454‑1 specifies the requirements for labelling and packaging as well as the coding system for the classification of the fluxes. NOTE 2 Some of the fluxes intended for inert gas and vapour phase soldering may not pass some of the criteria in Tables 1 and 2. Requirements for these fluxes are agreed between the purchaser and the supplier.

This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.

This document specifies the classification of fluxes used for brazing metals and characterizes these fluxes on the basis of their properties and use, and gives technical delivery conditions and health and safety precautions. This document covers two classes of flux, FH and FL. Class FH is used for the brazing of heavy metals (steels, stainless steels, copper and its alloys, nickel and its alloys, precious metals, molybdenum and tungsten). Class FL is used for the brazing of aluminium and its all...view more

This document specifies two methods for the determination of the acid value of a flux of types 1 and 2
only, as defined in ISO 9454-1.
Method A is a potentiometric titration method and is to be considered as the reference method.
Method B is an alternative, visual end‑point, titration method.

This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454-1.

This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454‑1.
NOTE It is hoped that future developments using improved techniques for obtaining a r...view more

This document specifies two methods for the determination of the acid value of a flux of types 1 and 2 only, as defined in ISO 9454‑1. Method A is a potentiometric titration method and is to be considered as the reference method. Method B is an alternative, visual end‑point, titration method.

This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454‑1. NOTE It is hoped that future developments using improved techniques for obtaining a re...view more

This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology.
The Standard defines acceptance and rejection criteria for high-reliability manufacture of surface-mount and mixed-technology circuit assemblies intended to withstand normal terrestrial conditions and the vibrational g loads and environment imposed by space flight.
The proper t...view more

This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology.
The Standard defines acceptance and rejection criteria for high-reliability manufacture of surface-mount and mixed-technology circuit assemblies intended to withstand normal terrestrial conditions and the vibrational g loads and environment imposed by space flight.
The proper t...view more

This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for "special" electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control
document and is not intended to relate directly to the material's performance in the
manufacturing process.
Special electronic ...view more

This document specifies a qualitative method for assessing the solubility of flux residues in a selected
solvent. The method is applicable to all fluxes of Type 1, as defined in ISO 9454-1.
NOTE This test gives no assurance that post-cleaning residues, which may be present in sufficiently small
amounts to pass the test, will not be detrimental to the soldered assembly in the long term.

This document specifies a qualitative method for determination of the corrosive properties of flux
residues on a copper substrate when subjected to controlled environmental conditions. The test is
applicable to type 1 fluxes, as defined in ISO 9454-1.

This document specifies a method for estimating the tendency of a flux to spatter in use. It is a
qualitative (comparative) method and is only applicable to liquid fluxes, as defined in ISO 9454-1.
The method is not applicable to flux cored solder wire or to solder pastes.