ASTM F1527-02

Standard Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon (Withdrawn 2003)

SCOPE
This standard was transferred to SEMI (www.semi.org) May 2003
1.1 This guide covers the application of Certified Reference Materials (CRMs) for resistivity measurements on silicon wafers. Specifically, this guide covers the use of these CRMs for preparing resistivity reference wafers and for ensuring the quality of the instrumentation used for preparing them.
1.2 This guide has not been evaluated for application to electronic materials other than silicon.
1.3 The guide covers the selection of materials for resistivity reference wafers, procedures for preparing and calibrating resistivity reference wafers, and use of resistivity reference wafers in qualifying, calibrating, and controlling various types of resistivity instrumentation.
1.4 The guide provides criteria for selection of instruments for determining the resistivity of silicon resistivity reference materials, procedures for maintaining such instruments in statistical quality control, and training requirements for operators engaged in making and using resistivity reference wafers.
1.5 Appendixes are included that cover ( 1) suggested control charting procedures for organizations that do not already have such procedures in place, and (2) errors in resistivity determination that result from uncertainties in wafer diameter, wafer thickness, and probe-tip spacing.
1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

• Status: Withdrawn
• Publication Date: 09-Jul-2002
• Withdrawal Date: 12-Aug-2003
• ICS: 29.045 - Semiconducting materials
• Technical Committee: F01 - Electronics

Relations

• Replaces: ASTM F1527-00 - Standard Guide for Application of Silicon Standard Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon
• Effective Date: 10-Jul-2002

Standards Content (Sample)

NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
Designation: F 1527 – 02
Standard Guide for
Application of Certified Reference Materials and Reference
Wafers for Calibration and Control of Instruments for
1
Measuring Resistivity of Silicon
This standard is issued under the fixed designation F 1527; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope F 43 Test Methods for Resistivity of Semiconductor Mate-
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rials
1.1 This guide covers the application of Certified Reference
F 81 Test Method for Measuring Radial Resistivity Varia-
Materials (CRMs) for resistivity measurements on silicon
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tion on Silicon Wafers
wafers. Specifically, this guide covers the use of these CRMs
F 84 Test Method for Measuring Resistivity of Silicon
for preparing resistivity reference wafers and for ensuring the
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Wafers With an In-Line Four-Point Probe
quality of the instrumentation used for preparing them.
F 525 Test Method for Measuring Resistivity of Silicon
1.2 This guide has not been evaluated for application to
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Wafers Using a Spreading Resistance Probe
electronic materials other than silicon.
F 533 Test Method for Thickness and Thickness Variation
1.3 The guide covers the selection of materials for resistiv-
3
of Silicon Slices
ity reference wafers, procedures for preparing and calibrating
F 672 Test Method for Measuring Resistivity Profile Per-
resistivity reference wafers, and use of resistivity reference
pendicular to the Surface of a Silicon Wafer Using a
wafers in qualifying, calibrating, and controlling various types
3
Spreading Resistance Probe
of resistivity instrumentation.
F 673 Test Method for Measuring Resistivity of Semicon-
1.4 The guide provides criteria for selection of instruments
ductor Slices or Sheet Resistance of Semiconductor Films
for determining the resistivity of silicon resistivity reference
3
with a Noncontact Eddy-Current Gage
materials, procedures for maintaining such instruments in
F 723 Practice for Conversion Between Resistivity and
statistical quality control, and training requirements for opera-
Dopant Density for Boron-Doped, Phosphorus-Doped, and
tors engaged in making and using resistivity reference wafers.
3
Arsenic-Doped Silicon
1.5 Appendixes are included that cover (1) suggested con-
3
F 1241 Terminology of Silicon Technology
trol charting procedures for organizations that do not already
F 1392 Test Method for Determining Net Carrier Density
have such procedures in place, and (2) errors in resistivity
Profiles in Silicon Wafers by Capacitance-Voltage Mea-
determination that result from uncertainties in wafer diameter,
3
surements with a Mercury Probe
wafer thickness, and probe-tip spacing.
F 1393 Test Method for Determining Net Carrier Density in
1.6 This standard does not purport to address all of the
Silicon Wafers by Miller Feedback Profiler Measurements
safety concerns, if any, associated with its use. It is the
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with a Mercury Probe
responsibility of the user of this standard to establish appro-
F 1529 Test Method for Sheet Resistance Uniformity Evalu-
priate safety and health practices and determine the applica-
ation by In-Line Four-Point Probe with the Dual-
bility of regulatory limitations prior to use.
3
Configuration Procedure
2. Referenced Documents F 1530 Test Method for Measuring Flatness, Thickness, and
Thickness Variation on Silicon Wafers by Automated
2.1 ASTM Standards:
3
Noncontact Scanning
D 5127 Guide for Ultra Pure Water Used in the Electronics
2
F 1618 Practice for Determining Uniformity of Thin Films
and Semiconductor Industry
3
on Silicon Wafers
F 2074 Guide for Measuring Diameter of Silicon and Other
3
Semiconductor Wafers
1
This guide is under the jurisdiction of ASTM Committee F01 on Electronics
2.2 ISO Standards:
and is the direct responsibility of Subcommittee F01.06 on Silicon Materials and
Guide 30:1981 Terms and Definitions Used in Connection
Process Control.
Current edition approved July 10, 2002. Published September 2002. Originally
published as F 1527–94. Last previous edition F 1527–00.
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Annual Book of ASTM Standards, Vol 11.01. Annual Book of ASTM Standards, Vol 10.05.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
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NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
F 1527 – 02
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with Reference Materials 3.2.3 probe pin, of a four-point probe—one of the four
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ISO 8402 Quality—Vocabulary needles supporting the probe tips; mounted in a be
...