ASTM F1527-00

Standard Guide for Application of Silicon Standard Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon

SCOPE
1.1 This guide covers the application of Standard Reference Materials (SRMs ) for resistivity measurements on silicon wafers. Specifically, this guide covers the use of these SRMs for preparing resistivity reference wafers and for ensuring the quality of the instrumentation used for preparing them.
1.2 This guide has not been evaluated for application to electronic materials other than silicon.
1.3 The guide covers the selection of materials for resistivity reference wafers, procedures for preparing and calibrating resistivity reference wafers, and use of resistivity reference wafers in qualifying, calibrating, and controlling various types of resistivity instrumentation.
1.4 The guide provides criteria for selection of instruments for determining the resistivity of silicon resistivity reference materials, procedures for maintaining such instruments in statistical quality control, and training requirements for operators engaged in making and using resistivity reference wafers.
1.5 Appendixes are included that cover (1) suggested control charting procedures for organizations that do not already have such procedures in place, and (2) errors in resistivity determination that result from uncertainties in wafer diameter, wafer thickness, and probe-tip spacing.
1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

• Status: Historical
• Publication Date: 09-Jun-2000
• ICS: 29.045 - Semiconducting materials
• Technical Committee: F01 - Electronics

Relations

• Replaced By: ASTM F1527-02 - Standard Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon (Withdrawn 2003)
• Effective Date: 10-Jul-2002

Standards Content (Sample)

Designation: F 1527 – 00
Standard Guide for
Application of Silicon Standard Reference Materials and
Reference Wafers for Calibration and Control of Instruments
1
for Measuring Resistivity of Silicon
This standard is issued under the fixed designation F 1527; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope F 43 Test Methods for Resistivity of Semiconductor Mate-
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rials
1.1 This guide covers the application of Standard Reference
2
F 81 Test Method for Measuring Radial Resistivity Varia-
Materials (SRMs ) for resistivity measurements on silicon
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tion on Silicon Wafers
wafers. Specifically, this guide covers the use of these SRMs
F 84 Test Method for Measuring Resistivity of Silicon
for preparing resistivity reference wafers and for ensuring the
4
Wafers With an In-Line Four-Point Probe
quality of the instrumentation used for preparing them.
F 525 Test Method for Measuring Resistivity of Silicon
1.2 This guide has not been evaluated for application to
4
Wafers Using a Spreading Resistance Probe
electronic materials other than silicon.
F 533 Test Method for Thickness and Thickness Variation
1.3 The guide covers the selection of materials for resistiv-
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of Silicon Slices
ity reference wafers, procedures for preparing and calibrating
F 613 Test Method for Measuring Diameter of Semicon-
resistivity reference wafers, and use of resistivity reference
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ductor Wafers
wafers in qualifying, calibrating, and controlling various types
F 672 Test Method for Measuring Resistivity Profile Per-
of resistivity instrumentation.
pendicular to the Surface of a Silicon Wafer Using a
1.4 The guide provides criteria for selection of instruments
4
Spreading Resistance Probe
for determining the resistivity of silicon resistivity reference
F 673 Test Method for Measuring Resistivity of Semicon-
materials, procedures for maintaining such instruments in
ductor Slices or Sheet Resistance of Semiconductor Films
statistical quality control, and training requirements for opera-
4
with a Noncontact Eddy-Current Gage
tors engaged in making and using resistivity reference wafers.
F 723 Practice for Conversion Between Resistivity and
1.5 Appendixes are included that cover ( 1) suggested
Dopant Density for Boron-Doped, Phosphorus-Doped, and
control charting procedures for organizations that do not
4
Arsenic-Doped Silicon
already have such procedures in place, and (2) errors in
4
F 1241 Terminology of Silicon Technology
resistivity determination that result from uncertainties in wafer
F 1392 Test Method for Determining Net Carrier Density
diameter, wafer thickness, and probe-tip spacing.
Profiles in Silicon Wafers by Capacitance-Voltage Mea-
1.6 This standard does not purport to address all of the
4
surements with a Mercury Probe
safety concerns, if any, associated with its use. It is the
F 1393 Test Method for Determining Net Carrier Density in
responsibility of the user of this standard to establish appro-
Silicon Wafers by Miller Feedback Profiler Measurements
priate safety and health practices and determine the applica-
4
with a Mercury Probe
bility of regulatory limitations prior to use.
F 1529 Test Method for Sheet Resistance Uniformity Evalu-
2. Referenced Documents
ation by In-Line Four-Point Probe with the Dual-
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Configuration Procedure
2.1 ASTM Standards:
F 1530 Test Method for Measuring Flatness, Thickness, and
D 5127 Guide for Ultra Pure Water Used in the Electronics
3
Thickness Variation on Silicon Wafers by Automated
and Semiconductor Industry
4
Noncontact Scanning
2.2 ISO Standards:
Guide 30:1981 Terms and Definitions Used in Connection
1 5
This guide is under the jurisdiction of ASTM Committee F-1 on Electronics and with Reference Materials
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is the direct responsibility of Subcommittee F01.06 on Silicon Materials and Process
ISO 8402 Quality—Vocabulary
Control.
Current edition approved June 10, 2000. Published August 2000. Originally
published as F 1527–94. Last previous edition F 1527–94.
2 4
SRMt is a registered trademark of the U.S. National Institute of Standards and Annual Book of ASTM Standards, Vol 10.05.
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Technology and the U.S. Government. ISO Central Secretariat, C. P. 56, CH-1211 Genève 20, Switzerland; available
3
Annual Book of ASTM Standards, Vol 11.01. in the U.S. from American National Standards Institute, 11 West 42nd Street, 13th
Floor, New York, NY 10036.
Copyright © ASTM, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959, United States.
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F 1527
ISO 10012-1 Quality Assurance Requirements for Measur- 3.2.5 probe-tip spacing, of a four-point probe—the distance
ing Equipment—Part 1: Management of Measuring between adjacent probe tips.
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Equipment
3.3 Other terms related to semiconductor techno
...