Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts

SCOPE
1.1 This guide covers the use of overtesting in order to reduce the required number of parts that must be tested to meet a given quality acceptance standard. Overtesting is testing a sample number of parts at a stress higher than their specification stress in order to reduce the amount of necessary data taking. This guide discusses when and how overtesting may be applied to forming probabilistic estimates for the survival of electronic piece parts subjected to radiation stress. Some knowledge of the probability distribution governing the stress-to-failure of the parts is necessary though exact knowledge may be replaced by over-conservative estimates of this distribution.

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Publication Date
09-Dec-1999
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ASTM F1263-99 - Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts
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NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F 1263 – 99
Standard Guide for
Analysis of Overtest Data in Radiation Testing of Electronic
Parts
This standard is issued under the fixed designation F 1263; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope probability, P, will be rejected with confidence, C. In order to
infer a true confidence, it would require a Bayes Theorem
1.1 This guide covers the use of overtesting in order to
calculation. In many cases, the distinction between confidence
reduce the required number of parts that must be tested to meet
and rejection confidence is of little practical importance.
a given quality acceptance standard. Overtesting is testing a
However, in other cases (typically when a large number of lots
sample number of parts at a stress higher than their specifica-
are rejected) the distinction between these two kinds of
tion stress in order to reduce the amount of necessary data
confidence can be significant. The formulas given in this guide
taking. This guide discusses when and how overtesting may be
apply whether one is dealing with confidence or rejection
applied to forming probabilistic estimates for the survival of
confidence.
electronic piece parts subjected to radiation stress. Some
knowledge of the probability distribution governing the stress-
4. Summary of Guide
to-failure of the parts is necessary though exact knowledge
4.1 This guide is intended to primarily apply to sampling by
may be replaced by over-conservative estimates of this distri-
attribute plans typified by Lot Tolerance Percent Defective
bution.
(LTPD) tables given in MIL-PRF 38535 and MIL-PRF 19500,
2. Referenced Documents and contains the following:
4.1.1 An equation for estimating the effectiveness of over-
2.1 Military Standards:
testing in terms of increased probability of survival,
MIL-PRF 19500 Semiconductor Devices, General Specifi-
4.1.2 An equation for the required amount of overtesting
cations for
given a necessary survival probability, and
MIL-PRF 38535 Integrated Circuits (Microcircuit Manu-
4.1.3 Cautions and limitations on the method.
facturing)
5. Significance and Use
3. Terminology
5.1 Overtesting should be done when (a) testing by vari-
3.1 Description of Term:
ables is impractical because of time and cost considerations or
3.1.1 confidence—the probability, C, that at least a fraction,
because the probability distribution of stress to failure cannot
P, of the electronic parts from a test lot will survive in actual
be estimated with sufficient accuracy, and (b) an unrealistically
service; since radiation testing of electronic parts is generally
large number of parts would have to be tested at the specifi-
destructive, this probability must be calculated from tests on
cation stress for the necessary confidence and survival prob-
selected specimens from the lot.
ability.
3.1.2 rejection confidence—the probability, R, that a lot will
be rejected based on destructive tests of selected specimens if
6. Interferences
more than a specified fraction P of the parts in the lot will fail
6.1 Probability Distributions—In overtesting, a knowledge
in actual service.
of the probability distribution governing stress to failure is
3.1.3 Discussion of Preceding Terms—Strictly speaking,
required, though it need not be specified with the same
most lot acceptance tests (be they testing by attributes or
accuracy necessary for testing by variables. For bipolar tran-
variables) do not guarantee survivability, but rather that infe-
sistors exposed to neutron radiation, the failure mechanism is
rior lots, where the survival probability of the parts is less than
usually gain degradation and the stress to failure is known to
follow a lognormal distribution. For bipolar transistors ex
This guide is under the jurisdiction ofASTM Committee F-1 on Electronicsand posed to total dose the use of the lognormal distribution is also
is the direct responsibility of Subcommittee F01.11 on Quality and Hardness
Assurance.
Current edition approved Dec. 10, 1999. Published February 2000. Originally
published as F 1263 – 89. Last previous edition F 1263 – 94. Messenger, G. C., Steele, E. L., “Statistical Modeling of Semiconductor
AvailablefromStandardizationDocumentsOrderDesk,Bldg.4SectionD,700 Devices for the TREE Environment,’’ Transactions on Nuclear Science NS-15,
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS. 1968, p. 4691.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
F 1263
TABLE 1 Survival Probability at Specification Level VersusR and Survival Probability at Overtest Level
Specification Level Probability for:
Overtest Level R 5 0.5 R 5 1.0 R 5 1.5 R 5 2.0 R 5 3.0 R 5 5.0
Probability
0.50 0.691462 0.841345 0.933193 0.977250 0.998650 1.000000
0.80 0.910140 0.967235 0.990400 0.997756 0.999939 1.000000
0.90 0.962588 0.988742 0.997295 0.999484 0.999991 1.000000
0.95 0.984016 0.995913 0.999169 0.999866 0.999998 1.000000
¯
fairly good. For more complex electronics and other kinds of P 5 F@F 1 ln ~3!/ 0.5# 5 F@0.84 1 2.20# 5 0.999,
S
radiation stress, the lognormal distribution is widely used in
where we used the following facts governing the normal
estimating the failure probabilities of electronic piece parts,
distribution:
and therefore this standard governs the use of a lognor
...

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