ASTM F638-88(2001)

Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)

SCOPE
1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.  
1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.
WITHDRAWN RATIONALE
This specification covers aluminum-1 % magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.
This specification is being withdrawn because no fine-wire with magnesium, at any concentration, is being sold or made in the world.
Formerly under the jurisdiction of Committee F01 on Electronics, this specification was withdrawn in January 2006.

General Information

• Status: Withdrawn
• Publication Date: 31-Dec-2000
• Withdrawal Date: 15-Jan-2006
• ICS: 29.060.10 - Wires
• Technical Committee: F01 - Electronics

Relations

• Replaces: ASTM F638-88(1995)e1 - Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding
• Effective Date: 01-Jan-2001

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F 638 – 88 (Reapproved 2001)
Standard Specification for
Fine Aluminum—1 % Magnesium Wire for Semiconductor
Lead-Bonding
This standard is issued under the fixed designation F 638; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope 3.1.3 Size (diameter) (see Section 5),
3.1.4 Breaking load and elongation (see Section 4),
1.1 This specification covers aluminum-1% magnesium al-
3.1.5 Spooling, packaging, and marking (see Section 11),
loy wire for internal connections in semiconductor devices and
3.1.6 Buyer part number, and
is limited to wires of diameter up to and including 0.002 in.
3.1.7 Special requirements such as for certificate of compli-
(0.051 mm). For diameters larger than 0.0020 in. (0.051 mm),
ance (see Section 10).
the specifications are to be agreed upon between the purchaser
and the supplier.
4. Physical Requirements
1.2 The values stated in inch-pound units are to be regarded
4.1 Elongation and breaking load ranges for the wire shall
as the standard. The values stated in parentheses are for
be specified by the purchaser. The maximum ranges of the
information only.
mechanical properties are listed in Table 1.
2. Referenced Documents 4.2 Mechanical property requirements in ranges smaller
than those listed in Table 1 may be specified upon agreement
2.1 ASTM Standards:
between the purchaser and the supplier.
F 16 Test Methods for Measuring Diameter or Thickness of
Wire and Ribbon for Electronic Devices and Lamps
NOTE 1—Thenatureofaluminum-1 %magnesiumalloyissuchthatthe
F 72 Specification for Gold Wire for Semiconductor Lead mechanical properties of both as-drawn and annealed wires overlap
considerably. It is also possible to vary the properties of the hard wire by
Bonding
changing manufacturing parameters and procedures. For these reasons, no
F 205 Test Method for Measuring Diameter of FineWire by
2 distinction is made in this specification between the two types.
Weighing
F 219 Test Methods of Testing Fine Round and Flat Wire
5. Dimensions, Weights, and Permissible Variations
for Electron Devices and Lamps
5.1 Wire size shall be expressed as wire diameter in decimal
F 584 Practice forVisual Inspection of Semiconductor Lead
fractions of an inch (or millimetres) or as weight per unit
Bonding Wire
length.
2.2 Military Standard:
5.2 Tolerances for various size ranges are specified in Table
MIL-STD-105 Sampling Procedures and Tables for Inspec-
2.
tion by Attributes
5.3 When wire size is expressed in terms of weight, the
following values shall be used:
3. Ordering Information
5.3.1 Density of Aluminum-1 % Magnesium—2.7 g/cm
3.1 Orders for material under this specification shall include
5.3.2 Weight of a 200-mm Length of Wire 0.0254 mm in
the following information:
Diameter—0.274 mg.
3.1.1 Quantity,
3.1.2 Composition (see Section 7),
6. Surface Finish
6.1 The wire surface shall be clean and free of finger oils,
lubricant residues, stains, and particulate matter.
This specification is under the jurisdiction of ASTM Committee F01 on
Electronics and is the direct responsibility of Subcommittee F 01.07 on Intercon-
6.2 Mechanical damage to the wire surface such as nicks,
nection Bonding Carrier Bonding.
scratches, and kinks shall be held to a minimum.
Current edition approved May 27, 1988. Published July 1988. Originally
6.3 The nature and the extent of defects permitted to be
published as F 638 – 82. Last previous edition F 638 – 82.
present on the surface of the wire shall be agreed between the
Annual Book of ASTM Standards, Vol 10.04.
AvailablefromStandardizationDocumentsOrderDesk,Bldg.4SectionD,700
supplier and the purchaser.
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
F 638 – 88 (2001)
TABLE 1 Elongation and Breaking Load, Aluminum-1 %
whose separation is indicated on a micrometer scale) agreed
Magnesium Alloy
upon between the purchaser and the supplier.
NOTE 1—Select the desired nominal breaking load and elongation for
NOTE 2—The procedures of Test Methods F 16 may be applicable in
the wire by specifying a range of mechanical properties that includes the
some instances. Use of Test Methods F 16 for measuring bonding wire
A
desired values.
diameter is under study by Committee F-1.
9.3 Chemical Analysis—Verify that the chemical require-
Breaking Load, g Elongation, %
Nominal Diameter, in.
ments are satisfied by means of spectrographic analysis or
Maximum Maximum
(mm)
min max min max
B C
other means agreed upon between the purchaser and the
Range Range
supplier.
0.0005 (0.013) 1 5 2 0.5 2.0 1.5
0.0007 (0.018) 4 12 2 0.5 2.5 2.0 9.4 Surface Finish— Examine surface finish in accordance
0.0010 (0.025) 12 24 3 0.5 4.0 2.5
with Practice F 584.
0.0012 (0.030) 14 30 3 0.5 4.0 2.5
0.00125 (0.0318) 18 36 3 0.5 4.0 3.0
10. Certification
0.0015 (0.038) 25 60 4 0.5 5.0 3.0
0.0020 (0.051) 45 100 6 1.0 5.0 3.0
10.1 When agreed upon in writing by the purchaser and the
A
Example: Wire of 0.0010-in. (0.025-mm) diameter with a nominal breaking load supplier,acertificationshallbemadethebasisofacceptanceof
of 16 g and a nominal elongation of 2.0 % is desired. Specify a breaking-load
the material. This shall consist of a statement by the
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