ASTM E801-01
(Practice)Standard Practice for Controlling Quality of Radiological Examination of Electronic Devices
Standard Practice for Controlling Quality of Radiological Examination of Electronic Devices
SCOPE
1.1 This practice relates to the radiological examination of electronic devices for internal discontinuities, extraneous material, missing components, crimped or broken wires, and defective solder joints in cavities, in the encapsulating materials, or the boards. Requirements expressed in this practice are intended to control the quality and repeatability of the radiological images and are not intended for controlling the acceptability or quality of the electronic devices imaged.
Note 1—Refer to the following publications for pertinent information on methodology and safety and protection: Guide E 94, and "General Safety Standard for Installation Using Non-Medical X Ray and Sealed Gamma Ray Sources, Energies Up to 10 MeV Equipment Design and Use," Handbook No. 114.
1.2 If a nondestructive testing agency as described in Practice E 543 is used to perform the examination, the testing agency should meet the requirements of Practice E 543.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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Designation: E 801 – 01
Standard Practice for
Controlling Quality of Radiological Examination of
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Electronic Devices
This standard is issued under the fixed designation E 801; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1. Scope 4. Direction of Radiation
1.1 This practice relates to the radiological examination of 4.1 When not otherwise specified, the direction of the
electronic devices for internal discontinuities, extraneous ma- central beam of radiation shall be as perpendicular (65%)as
terial, missing components, crimped or broken wires, and possible to the surface of the film.
defective solder joints in cavities, in the encapsulating materi-
5. Image Quality Indicators (IQI’s)
als, or the boards. Requirements expressed in this practice are
5.1 The quality of all levels of radiological examination
intended to control the quality and repeatability of the radio-
logical images and are not intended for controlling the accept- shall be determined by IQI’s conforming to the following
specifications:
ability or quality of the electronic devices imaged.
5.1.1 The IQI’s shall be fabricated of clear acrylic plastic
NOTE 1—Refer to the following publications for pertinent information
withsteelcovers,leadspheres,goldortungstenwires,andlead
on methodology and safety and protection: Guide E 94, and “General
numbers. The steel covers serve as shims.
Safety Standard for Installation Using Non-Medical X Ray and Sealed
5.1.1.1 The IQI’s shall conform to the requirements of Fig.
Gamma Ray Sources, Energies Up to 10 MeV Equipment Design and
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Use,” Handbook No. 114. 1.
5.1.1.2 The IQI’s shall be permanently identified with the
1.2 If a nondestructive testing agency as described in
appropriate IQI number as shown in Fig. 1. The number may
Practice E 543 is used to perform the examination, the testing
be affixed by engraving, steel stamping, or by mounting a
agency should meet the requirements of Practice E 543.
0.125-in. (3.18-mm) tall lead number on the flat bottom of a
1.3 This standard does not purport to address all of the
0.188-in. (4.78-mm) diameter hole. In any case, the identifica-
safety concerns, if any, associated with its use. It is the
tionshallbelocatedasshowninFig.1andshallbeofsufficient
responsibility of the user of this standard to establish appro-
contrast to be clearly discernible in the radiological image.
priate safety and health practices and determine the applica-
5.1.1.3 Each semiconductor IQI will have a serial number
bility of regulatory limitations prior to use.
permanently etched or engraved in the upper right-hand corner.
2. Referenced Documents Each serial number will be traceable to the calibration image
supplied by the manufacturer. The manufacturer will radio-
2.1 ASTM Standards:
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graph the IQI with lead markers identifying the serial number.
E 94 Guide for Radiographic Examination
See Fig. 2.
E 543 Practice for Agencies Performing Nondestructive
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Testing
6. Application of the Image Quality Indicator (IQI)
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E 1000 Guide for Radioscopy
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6.1 The application of the IQI’s shall be made in such a
E 1255 Practice for Radioscopy
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manner as to simulate as closely as possible the device being
E 1316 Terminology for Nondestructive Examinations
examined. To accomplish this objective, a set of eight IQI’s is
3. Terminology
provided. These provide a range of cover thickness (of steel
shim stock) that is radiologically equivalent to the range of
3.1 Definitions—Refer to Terminology E 1316, Section D.
devices from glass diodes or plastic-encapsulated circuits
(number one) to large power or hybrid circuit devices (number
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This practice is under the jurisdiction of ASTM Committee E07 on Nonde-
eight). Wire size increases with shim stock thickness because
structive Testing and is the direct responsibility of Subcommittee E07.01 on
the higher power devices, which are radiologically compatible
Radiology (X and Gamma) Method.
Current edition approved June 10, 2001. Published August 2001. Originally
with the thicker coverings, normally use larger interconnecting
published as E 801 – 81. Last previous edition E 801 – 91 (1995).
wires than small signal devices which use the thin coverings.
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Available from the National Institute of Standards and Technology, Gaithers-
Particle size is normally independent of device type, so these
burg, MD 20899.
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remain constant.
Annual Book of ASTM Standards, Vol 03.03.
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