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ASTM F1512-94(2011)

(Practice)

Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)

Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)

SIGNIFICANCE AND USE
This practice supplements Practice E1001 by indicating specific equipment choices and test arrangements appropriate for evaluating sputtering target bonds.
The bond between sputtering target and its supporting backing plate is a critical reliability element in a sputter deposition system. A bond must have high thermal conductivity to provide adequate target cooling during sputtering. The target-backing plate joint must also have strength enough to withstand the shear stresses caused by differential thermal expansion between target and backing plate.
Flaws in a bond, for example, voids in the joining material, degrade bond performance. An inadequate bond may fail in service, potentially causing catastrophic separation of the target from the backing plate. Assurance of sound bonds is an important concern among users of sputtering equipment.
Ultrasonic testing is accepted as an efficient method for evaluating target bonds, but differences in technique inhibit intercomparison of results from one laboratory to another. This practice is intended to promote uniformity in use so that specifications for bond integrity may be universally applied.
The C-span display of ultrasonic test data is a direct method for visually demonstrating bond character. Practice E1001 upon which this practice is modeled, however, does not address C-scan display. Instructions specific to the C-scan display mode are indicated in this practice. In other respects this practice is a section by section commentary on Practice E1001.
SCOPE
1.1 This practice describes a method for ultrasonic mapping of the soundness of a bond joining a sputtering target to its supporting backing plate. The results of the examination may be used in predicting the target-backing plate assembly's suitability for use. Accept/reject standards are not specified; these are subject to agreement between target supplier and user, depending upon the application requirements.
1.2 This standard is intended to be used with Practice E1001.
1.3 The method reveals unbonded areas 0.125 in. (3 mm) in diameter and larger. The technique permits, for example, unambiguous quantitative measurement of the voided area in solder bonds.
1.3.1 This technique may also show regions in which bond integrity is marginally degraded by imperfect adhesion, for example, areas in which oxide inclusion has inhibited the development of full bond strength. Evaluation of indications of degraded bond areas may vary in rigor from purely subjective to semiquantitative. Target supplier and user must agree upon the means used to display and grade partially bonded areas.
1.4 This practice is applicable to assemblies having planar bonds in which the design provides at least one flat plane parallel to the bond that may be used as the entry/exit surface for ultrasonic excitation.
1.5 Only the immersion pulse-echo method is covered.
1.6 Evaluation by this method is intended to be nondestructive. For target assemblies that would be degraded by immersion in demineralized water, for example, for porous target materials, the test should be considered a destructive one.
1.7 This practice is applicable to bonding methods that use a filler material to join the target and backing plate. These include solder, epoxy, and braze bonds.
1.8 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
1.9 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
WITHDRAWN RATIONALE
This practice describes a method for ultrasonic mapping of the soundness of a bond joining a sputtering target to its supporting back...

General Information

Status
Withdrawn
Publication Date
31-May-2011
Withdrawal Date
08-Jan-2020
ICS
19.100 - Non-destructive testing
Technical Committee
F01 - Electronics
Drafting Committee
F01.17 - Sputter Metallization
Current Stage
Ref Project

Relations

Referred By
ASTM F3192-16 - Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization
Effective Date
01-Jun-2011
Referred By
ASTM F3166-16 - Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization
Effective Date
01-Jun-2011

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ASTM F1512-94(2011) - Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)ASTM F1512-94(2011) - Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)
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ASTM F1512-94(2011) - Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)
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NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F1512 − 94 (Reapproved 2011)
Standard Practice for
Ultrasonic C-Scan Bond Evaluation of Sputtering
1
Target-Backing Plate Assemblies
This standard is issued under the fixed designation F1512; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope conversions to SI units that are provided for information only
and are not considered standard.
1.1 This practice describes a method for ultrasonic mapping
1.9 This standard does not purport to address all of the
of the soundness of a bond joining a sputtering target to its
safety concerns, if any, associated with its use. It is the
supporting backing plate. The results of the examination may
responsibility of the user of this standard to establish appro-
be used in predicting the target-backing plate assembly’s
priate safety and health practices and determine the applica-
suitability for use. Accept/reject standards are not specified;
bility of regulatory limitations prior to use.
thesearesubjecttoagreementbetweentargetsupplieranduser,
depending upon the application requirements.
2. Referenced Documents
1.2 This standard is intended to be used with Practice
2
2.1 ASTM Standards:
E1001.
E127 Practice for Fabricating and Checking Aluminum Al-
1.3 The method reveals unbonded areas 0.125 in. (3 mm) in
loy Ultrasonic Standard Reference Blocks
diameter and larger. The technique permits, for example,
E428 Practice for Fabrication and Control of Metal, Other
unambiguous quantitative measurement of the voided area in
than Aluminum, Reference Blocks Used in Ultrasonic
solder bonds.
Testing
1.3.1 This technique may also show regions in which bond
E1001 Practice for Detection and Evaluation of Discontinui-
integrity is marginally degraded by imperfect adhesion, for
ties by the Immersed Pulse-Echo Ultrasonic Method
example, areas in which oxide inclusion has inhibited the
Using Longitudinal Waves
development of full bond strength. Evaluation of indications of
E1316 Terminology for Nondestructive Examinations
degraded bond areas may vary in rigor from purely subjective
2.2 American Society for Nondestructive Testing Standard:
to semiquantitative. Target supplier and user must agree upon
ASNT Recommended Practice SNT-TC-1A for Personnel
the means used to display and grade partially bonded areas.
3
Qualification and Certification in Nondestructive Testing
1.4 This practice is applicable to assemblies having planar
bonds in which the design provides at least one flat plane
3. Terminology
parallel to the bond that may be used as the entry/exit surface
3.1 Definitions:
for ultrasonic excitation.
3.1.1 For definitions of terms used in this practice see
1.5 Only the immersion pulse-echo method is covered.
Practice E1001 and Terminology E1316.
1.6 Evaluation by this method is intended to be nondestruc-
4. Summary of Practice
tive. For target assemblies that would be degraded by immer-
sion in demineralized water, for example, for porous target
4.1 This practice describes a preferred means of applying
materials, the test should be considered a destructive one. PracticeE1001toobtainatwodimensionalmapoftheflawsin
asputteringtarget-backingplatebond.Thetarget-backingplate
1.7 This practice is applicable to bonding methods that use
assembly is immersed in demineralized water, used as a
a filler material to join the target and backing plate. These
couplant, and the target-backing plate joint is scanned ultra-
include solder, epoxy, and braze bonds.
sonically.
1.8 The values stated in inch-pound units are to be regarded
as standard. The values given in parentheses are mathematical
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
1
This practice is under the jurisdiction ofASTM Committee F01 on Electronics contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
and is the direct responsibility of Subcommittee F01.17 on Sputter Metallization. Standards volume information, refer to the standard’s Document Summary page on
Current edition approved June 1, 2011. Published June 2011. Originally the ASTM website.
3
approved in 1994. Last previous edition approved in 2003 as F1512–94 (2003). AvailablefromAmericanSocietyforNondestructiveTesting(ASNT),P.O.Box
DOI: 10.1520/F1512-94R11. 28518, 1711 Arlingate Ln., Columbus, OH 43228-0518, http://www.asnt.org.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1

---------------------- Page: 1 ----------------------
F1512 − 94 (2011)
5. Significance and Use data acquisition system may be used in which the gated
reflectedsignalissample
...

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5.1 Liquid penetrant testing methods indicate the presence, location, and to a limited extent, the nature and magnitude of the detected discontinuities. Each of the various penetrant methods has been designed for specific uses such as critical service items, volume of parts, portability, or localized areas of examination. The method selected will depend accordingly on the design and service requirements of the parts or materials being tested.
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1.1 This practice2 covers procedures for penetrant examination of materials. Penetrant testing is a nondestructive testing method for detecting discontinuities that are open to the surface such as cracks, seams, laps, cold shuts, shrinkage, laminations, through leaks, or lack of fusion and is applicable to in-process, final, and maintenance examinations. It can be effectively used in the examination of nonporous, metallic materials, ferrous and nonferrous metals, and of nonmetallic materials such as nonporous glazed or fully densified ceramics, as well as certain nonporous plastics, and glass.  
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1.2.1 By which a liquid penetrant examination process recommended or required by individual organizations can be reviewed to ascertain its applicability and completeness.  
1.2.2 For use in the preparation of process specifications and procedures dealing with the liquid penetrant testing of parts and materials. Agreement by the customer requesting penetrant testing is strongly recommended. All areas of this practice may be open to agreement between the cognizant engineering organization and the supplier, or specific direction from the cognizant engineering organization.  
1.2.3 For use in the organization of facilities and personnel concerned with liquid penetrant testing.  
1.3 This practice does not indicate or suggest criteria for evaluation of the indications obtained by penetrant testing. It should be pointed out, however, that after indications have been found, they must be interpreted or classified and then evaluated. For this purpose there must be a separate code, standard, or a specific agreement to define the type, size, location, and direction of indications considered acceptable, and those considered unacceptable.  
1.4 Units—The values stated in either SI units or inch-pound units are to be regarded separately as standard. The values stated in each system may not be exact equivalents; therefore, each system shall be used independently of the other. Combining values from the two systems may result in non-conformance with the standard.  
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6.1 This guide provides procedures for the application of contact straight-beam examination for the detection and quantitative evaluation of discontinuities in materials.  
6.2 Although not all requirements of this guide can be applied universally to all examinations, situations, and materials, it does provide basis for establishing contractual criteria between the users, and may be used as a general guide for preparing detailed specifications for a particular application.  
6.3 This guide is directed towards the evaluation of discontinuities detectable with the beam normal to the entry surface. If discontinuities or other orientations are of concern, alternate scanning techniques are required.
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1.1 This guide covers procedures for the contact ultrasonic examination of bulk materials or parts by transmitting pulsed ultrasonic waves into the material and observing the indications of reflected waves. This guide covers only examinations in which one search unit is used as both transmitter and receiver (pulse-echo). This guide includes general requirements and procedures that may be used for detecting discontinuities, locating depth and distance from a point of reference and for making a relative or approximate evaluation of the size of discontinuities as compared to a reference standard.  
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Standard Practice for Digital Imaging and Communication in Nondestructive Evaluation (DICONDE) for Eddy Current (EC) Test Methods

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5.1 Personnel that are responsible for the creation, transfer, and storage of eddy current NDE test results will use this standard. This practice defines a set of information modules that, along with Practice E2339 and the DICOM standard, provide a standard means to organize eddy current test parameters and results. The eddy current examination results may be displayed or analyzed on any device that conforms to the standard. Personnel wishing to view any eddy current examination data stored according to Practice E2339 may use this document to help them decode and display the data contained in the DICONDE compliant inspection record.
SCOPE
1.1 This practice covers the interoperability of eddy current imaging and data acquisition equipment by specifying the image data transfer and archival storage in commonly accepted terms. This document is intended to be used in conjunction with Practice E2339 on Digital Imaging and Communication in Nondestructive Evaluation (DICONDE). Practice E2339 defines an industrial adaptation of NEMA PS3 / ISO 12052, an international standard for image data acquisition, review, storage, and archival storage. The goal of Practice E2339, commonly referred to as DICONDE, is to provide a standard that facilitates the display and analysis of NDE results on any system conforming to the DICONDE standard. Toward that end, Practice E2339 provides a data dictionary and a set of information modules that are applicable to all NDE modalities. This practice supplements Practice E2339 by providing information object definitions, information modules, and a data dictionary that are specific to eddy current test methods.  
1.2 This practice has been developed to overcome the issues that arise when analyzing or archiving data from eddy current test equipment using proprietary data transfer and storage methods. As digital technologies evolve, data must remain decipherable through the use of open, industry-wide methods for data transfer and archival storage. This practice defines a method where all the eddy current technique parameters and inspection data are communicated and stored in a standard manner regardless of changes in digital technology.  
1.3 This practice does not specify:  
1.3.1 A testing or validation procedure to assess an implementation's conformance to the standard,  
1.3.2 The implementation details of any features of the standard on a device claiming conformance, or  
1.3.3 The overall set of features and functions to be expected from a system implemented by integrating a group of devices each claiming DICONDE conformance.  
1.4 Units—Although this practice contains no values that require units, it does describe methods to store and communicate data that do require units to be properly interpreted. The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.  
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.6 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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ASTM
ASTM E3388-23(Practice)
Standard Practice for Determining Image Unsharpness and Basic Spatial Resolution in Radiography and Radioscopy for High Energy Applications

SIGNIFICANCE AND USE
5.1 The gauge is intended to provide a means for measuring image or detector unsharpness and basic spatial image or detector resolution as independently as practicable from the imaging system and contrast sensitivity limitations. When the duplex plate gauge is positioned directly on the film or the digital detector instead on the test object, then the determined image unsharpness UIm corresponds to the inherent film or detector unsharpness (Udetector) and the determined basic spatial image resolution SRbimage corresponds to the basic spatial detector resolution SRbdetector. SRbimage provides a value which depends on the combined effect of detector unsharpness and geometric unsharpness.  
5.2 Basis of Application:  
5.2.1 The following items are subject to contractual agreement between the parties using or referencing this standard.
5.2.1.1 Personnel Qualification—Personnel performing examinations to this practice shall be qualified in accordance with NAS410, EN 4179, ANSI/ASNT CP 189, ISO 9712, or SNT-TC-1A and certified by the employer or certifying agency as applicable. Other equivalent qualification documents may be used when specified on the contract or purchase order. The applicable revision shall be the latest unless otherwise specified in the contractual agreement between parties.
5.2.1.2 If specified in the contractual agreement, NDT agencies shall be qualified and evaluated as described in Specification E543. The applicable edition of Specification E543 shall be specified in the contract.
SCOPE
1.1 This practice covers the design and basic use of a gauge used to determine the image unsharpness and the basic spatial resolution of film radiographs or of digital images taken with CR imaging plates, digital detector arrays (DDA), or radioscopic systems (for example, with X-ray image intensifiers) for applications with Se-75, Ir-192, Co-60 and high energy sources with tube potentials ≥ 300 kV. The IQI may be used at lower tube potentials too, if the expected unsharpness is > 200 µm (SRbimage or SRbdetector > 100 µm). For the measurement of lower unsharpness values, the usage of the gauge described in Practice E2002 is recommended.  
1.2 This practice is applicable to radiographic and radioscopic imaging systems utilizing X-ray and gamma ray radiation sources.  
1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.  
1.4 The gauge described can be used effectively if the duplex wire IQI of Practice E2002 does not provide sufficient contrast resolution.  
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.6 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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ASTM
ASTM E2446-23(Practice)
Standard Practice for Manufacturing Characterization of Computed Radiography Systems

SIGNIFICANCE AND USE
4.1 There are several factors affecting the quality of a CR image including the basic spatial resolution of the IP system, geometrical unsharpness, scatter and contrast sensitivity. There are several additional factors (for example, software and scanning parameters) that affect the accurate reading of images on exposed IPs using an optical scanner.  
4.2 This practice is to be used to establish a characterization of CR system by performance levels on the basis of a normalized SNR, interpolated basic spatial detector resolution and EPS. The CR system performance levels in this practice do not refer to any particular manufacturers’ imaging plates. A CR system performance level results from the use of a particular imaging plate together with the exposure conditions, standardized phantom, the scanner type, and software and the scanning parameters. This characterization system provides a means to compare differing CR technologies, as is common practice with film systems, which guides the user to the appropriate configuration, IP, and technique for the application at hand. The performance level selected may not match the imaging performance of a corresponding film class because of the difference in the spatial resolution and scatter sensitivity. Therefore, the user should always use IQIs for proof of contrast sensitivity and basic spatial resolution.  
4.3 The measured performance parameters are presented in a characterization chart. This enables users to select specific CR systems by the different characterization data to find the best system for his specific application.  
4.4 The quality factors can be determined most accurately by the tests described in this practice. Some of the system tests require special tools, which may not be available in user laboratories. Simpler tests are described for quality assurance and long term stability tests in Practice E2445.  
4.5 Manufacturers of industrial CR systems or certification agencies will use this practice. Users of i...
SCOPE
1.1 This practice covers the manufacturing characterization of computed radiography (CR) systems, consisting of a particular phosphor imaging plate (IP), scanner, software, scanner operational parameters, and an image display monitor, in combination with specified metal screens for industrial radiography.  
1.2 The practice defines system tests to be used to characterize the systems of different suppliers and make them comparable for users.  
1.3 This practice is intended for use by manufacturers of CR systems or certification agencies to provide quantitative results of CR system characteristics for nondestructive testing (NDT) user or purchaser consumption. Some of these tests require specialized test phantoms to ensure consistency of results among suppliers or manufacturers. These tests are not intended for users to complete, nor are they intended for long term stability tracking and lifetime measurements. However, they may be used for this purpose, if so desired. Practice E2445 describes tests which are intended for users to observe the CR performance and test the long term stability.  
1.4 The CR system performance is described by the basic spatial resolution, contrast, signal and noise parameters, and the equivalent penetrameter sensitivity (EPS). Some of these parameters are used to compare with DDA characterization and film characterization data (see Practice E2597 and Test Method E1815).
Note 1: For film system characterization, the signal is represented by the optical density of 2 (above fog and base) and the noise as granularity. The signal-to-noise ratio is normalized by the aperture (similar to the basic spatial resolution) of the system and is part of characterization. This normalization is given by the scanning circular aperture of 100 µm of the micro-photometer, which is defined in Test Method E1815 for film system characterization.  
1.5 The measurement of CR systems in this practice is restricted ...

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