ASTM D1867-96

Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

SCOPE
1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.
1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

• Status: Historical
• Publication Date: 09-Sep-2001
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: D09 - Electrical and Electronic Insulating Materials
• Drafting Committee: D09.07 - Electrical Insulating Materials

Relations

• Replaced By: ASTM D1867-01 - Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
• Effective Date: 10-Sep-2001

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
Designation: D 1867 – 96 An American National Standard
Standard Specification for
Copper-Clad Thermosetting Laminates for Printed Wiring
This standard is issued under the fixed designation D 1867; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
TABLE 1 Base Laminate Grades
1. Scope
1.1 This specification covers twelve grades of thermosetting NOTE 1— A cross reference table of grade designations (see Table 2)
appears here for reference purposes only. The ASTM grades shown are
laminate with copper foil bonded to one or both surfaces. These
most closely associated with the NEMA and the military grades listed in
combination forms are intended primarily for use in fabrication
this table. There is no requirement, stated or implied, in this ASTM
of printed (etched) wiring or circuit boards.
specification that the ASTM grade must meet the specification require-
1.2 The values stated in inch-pound units are to be regarded
ments of the NEMA or the military standards listed.
as the standard. The values given in parentheses are for
ASTM Grade Type
information only.
XXXP Paper base, phenolic resin
1.3 This standard does not purport to address all of the
XXXPC Paper base, phenolic resin
safety concerns, if any, associated with its use. It is the
FR-2 Paper base, phenolic resin, flammability rated
FR-3 Paper base, epoxy resin, flammability rated
responsibility of the user of this standard to establish appro-
FR-4 Glass woven fabric base, epoxy resin, general purpose, flam-
priate safety and health practices and determine the applica-
mability rated
bility of regulatory limitations prior to use.
FR-5 Glass woven fabric base, epoxy resin, temperature resistant,
flammability rated
FR-6 Random glass fiber base, polyester resin, flammability rated
2. Referenced Documents
G-10 Glass woven fabric base, epoxy resin, general purpose
2.1 ASTM Standards:
G-11 Glass woven fabric base, epoxy resin, temperature resistant
CEM-1 Glass woven cloth surfaces, cellulose paper core, epoxy
D 709 Specification for Laminated Thermosetting Materi-
resin, flammability rated
als
CEM-3 Glass woven cloth surfaces, non-woven glass core, flamma-
D 3636 Practice for Sampling and Judging Quality of Solid
bility rated
CFR-1 Glass polyester non-woven fabric base, epoxy resin, flamma-
Electrical Insulating Materials
bility rated
D 5109 Test Methods for Copper-Clad Thermosetting
Laminates for Printed Wiring Boards
2.2 Other Standards:
of 99.50 % (silver considered as equal to copper). The thick-
MIL-P-13949 Plastic Sheet, Laminated, Metal Clad (for
ness tolerances of the copper foil shall conform to the
Printed Wiring Boards)
requirements of Table 3.
NEMA Publication Number LI-1
3.3 Thickness Tolerance Classes—Copper-clad laminates
3. Classification
are available in two classes of thickness tolerance. Class I
represents those tolerances of standard manufacturing practice.
3.1 Base Laminate Grades—Where applicable, the dielec-
tric material forming the base of the copper-clad laminate of Class II represents a closer tolerance product than Class I. Any
the types listed in Table 1 and Table 2 shall conform to the specified class shall conform to the requirements shown in
property requirements of that specific grade shown in Specifi- Table 4.
cation D 709.
3.2 Copper Foil Surfaces—The surfaces shall be copper
TABLE 2 Grade Cross References
foil, either rolled or electrodeposited, having a minimum purity
ASTM Grade NEMA LI-1 Grade MIL-P-13949 Grade
XXXP XXXP PP
XXXPC XXXPC PP
This specification is under the jurisdiction of the ASTM Committee D-9 on
FR-2 FR-2 .
Electrical and Electronic Insulating Materials and is the direct responsibility of
FR-3 FR-3 PX
Subcommittee D09.07 on Flexible and Rigid Insulating Materials.
FR-4 FR-4 GF
Current edition approved March 10, 1996. Published May 1996. Originally
FR-5 FR-5 GH
published as D 1867 – 61 T. Last previous edition D 1867 – 94.
FR-6 FR-6 .
Annual Book of ASTM Standards, Vol 10.01.
G-10 G-10 GE
Annual Book of ASTM Standards, Vol 10.02.
G-11 G-11 GB
Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700
CEM-1 CEM-1 .
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.
CEM-3 CEM-3 .
Available from National Electrical Manufacturers Association, 2101 L St.,
CFR-1 . CF
N.W., Washington, DC 20037.
Copyright © ASTM, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959, United States.
D 1867
A
TABLE 3 Copper Foil Thickness
thickness; and the thickness tolerance class (see 3.3).
Nominal
Thickness Tolerance, in.
Nominal Weight,
Thickness, 5. Detailed Requirements
oz/ft
Plus Minus
in.
5.1 The laminate shall meet the requirements shown in
⁄2 0.0007 0.00007 0.00007
Table 5.
1 0.0014 0.0004 0.0002
2 0.0028 0.0007 0.0003
6. Warp or Twist
3 0.0042 0.0004 0.0004
4 0.0056 0.0006 0.0006
6.1 The warp or twist of copper-clad laminate shall meet the
5 0.0070 0.0007 0.0007
requirements of Table 6. The maximum values shown in Table
A 2 2
Conversion factor: 0.001 in. 5 0.0254 mm; 1 oz/ft 5 0.305 kg/m .
6 are percentage values applicable only to sheet sizes as
manufactured and to sheets cut such that neither length nor
A
TABLE 4 Thickness Tolerance of Copper-Clad Sheet, 6 in.
width is less than 18 in. (457 mm). The values shown are
Class I Class II
percentages based upon 36-in. (914-mm) dimension sheets.
Grades Grades
7. Blistering
FR-4
Nominal
FR-4, FR-5 XXXP
FR-5
Overall
7.1 No blistering shall occur due to exposure of specimens
XXXP, XXXPC CEM-1, CEM-3 XXXPC
G-10
Laminate
FR-2, FR-3 FR-6, G-10, FR-2
of the material to air at the temperatures and times shown in
G-11
Thickness,
G-11 FR-3
B
CFR-1 Table 7. This requirement applies to copper-clad specimens
in.
and to laminate from which all of the copper has been etched.
1 oz, 2 Sides 2, All Weights All All
1 oz,
3, 4,5oz1or2 1or2 Weights 1 Weights 1
1 Side
Sides Sides or 2 Sides or 2 Sides
8. Workmanship and Surface Requirements
⁄32 0.004 0.0045 0.0065 0.003 0.004
8.1 Grades XXXP, XXXPC, FR-2 and FR-6 Only:
⁄64 0.005 0.0055 0.0075 0.0035 0.005
8.1.1 Copper surfaces shall be free from defects which may
⁄16 0.0055 0.006 0.0075 0.004 0.005
⁄32 0.007 0.0075 0.009 0.005 0.007
affect serviceability of the laminate. Such defects in copper
⁄8 0.0085 0.009 0.012 0.006 0.009
surfaces include blisters, wrinkles, cracks, dents, and scratches.
⁄32 0.0095 0.010 0.015 0.007 0.010
3 8.1.2 The copper shall not contain any pin holes having
⁄16 0.010 0.011 0.019 0.008 0.012
⁄32 0.011 0.012 0.021 0.009 0.012 average diameter greater than 0.015 in. (0.381 mm).
⁄4 0.012 0.012 0.022 0.009 0.012
8.1.3 Pin holes in the copper exceeding average diameter
CFR-1
0.005 in. (0.127 mm) shall not be present in concentration
C
0.0085 NA NA NA NA 0.0015 2
exceeding one per ft .
0.015 NA NA NA NA 0.002
8.1.4 The number of inclusions in copper which are larger
0.020 NA NA NA NA 0.002
0.030 NA NA NA NA 0.003
than 0.020 in. (0.508 mm) in length shall be limited in a single
2 2
A
Conversion factor: 0.001 in. 5 0.0254 mm; 1 oz 5 28.349 g.
ft of laminate and in any single sheet of approximately 0.5 m
B
CFR-1 laminate thickness as listed is without copper foil in accordance with
size. The limits are:
MIL-P-13949. Tolerance values for CFR-1 apply to the dielectric layer only.
C
8.1.4.1 5 in any one ft , and
Not applicable.
8.1.4.2 10 in any one 0.5 m size sheet.
8.1.5 The unclad laminate surface shall have a semi-gloss or
3.3.1 For sheets of laminate equal to or greater than 18 by
dull finish.
18 in. (approximately 2.3 ft ) at least 90 % of all thickness test
8.2 Grades FR-3, FR-4, FR-5, CEM-1, CEM-3, G-10, G-11,
measurements made upon any sheet of laminate shall be within
and CFR-1:
the limits specified in Table 4. For metric size sheets this 90 %
8.2.1 Copper surfaces shall be free from defects which may
requirement shall apply to sheet sizes of 0.5 by 0.5 m or 0.25
affect serviceability. Such defects include blisters, wrinkles,
m area.
and cracks. The copper surfaces shall be free from other defects
3.3.2 The deviation of any single thickness test measure-
as required in 8.2.2.
ment value (see Practice D 3636) from the nominal overall
8.2.2 Pits are small holes occurring as imperfections that do
thickness listed in Table 4 shall not exceed 125 % of the
not penetrate entirely through the copper foil. Dents are
tolerance listed in Table 4.
depressions in the copper foil that do not significantly decrease
3.3.3 Any overall laminate thickness not listed in Table 4
the thickness of the copper foil. Pits and dents are limited by a
shall meet the tolerance requirements of the next highest
point count system in which the maximum total allowable
nominal thickness listed in Table 4.
2 2
point count for pits and dents is 35 per ft (377/m ). Pits and
3.3.4 For cut panels (for example, laminate sheets cut to
2 2
dents carry various point counts depending upon the longest
area less than 2.3 ft or less than 0.25 m ) at least 98 % of all
dimension of the pit or dent.Table 8 and Table 9 provides point
thickness test measurements shall be within the specified
count values for various dimensions.
overall laminate thickness tolerance values of Table 4.
8.2.3 Pinholes are small holes occurring as imperfections
4. Ordering Information
that penetrate entirely through the copper foil. A pinhole
4.1 Orders for copper-clad laminates shall specify the grade having an area equivalent to a 0.005-in. (0.127-mm) diameter
of laminate base (see 3.1); the type of copper foil (either rolled circle is a defect. A maximum of one such pinhole is allowable
2 2
or electrodeposited); the nominal weight of the copper foil (see in a 5-ft (0.46-m ) area of laminate. Pinholes of smaller area
3.2); one- or two-side cladding; nominal overall laminate are also defects and the aggregate sum of the areas of all
D 1867
A
TABLE 5 Detailed Requirements: Copper-Clad Laminates for Printed Wiring
XXXP XXXPC FR-2 FR-3 FR-4 FR
...