ASTM F542-07
(Test Method)Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)
SIGNIFICANCE AND USE
Heat generated by a reacting liquid encapsulating compound has the potential to cause damage to heat-sensitive electronic components. Degradation of the encapsulating compound has the potential to also occur at high temperatures. Proper selection of an encapsulating compound includes knowledge of its exothermic temperature to preclude damage to components.
Since the exothermic temperature of a reacting encapsulating compound varies with the volume and geometry of material, it is essential that the volume and geometry be specified in any determination. Select the appropriate volume and geometry. The exothermic temperature is measured in sufficiently precise and reproducible form to allow for application evaluation, quality control, and encapsulating compound characterization.
Exothermic temperature rise of two different volumes of the same material using the same geometry indicates the effect of volume. Materials may be compared by testing equal volumes of each material using the same geometry.
SCOPE
1.1 This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.
1.2 This test method provides a means to measure the peak exothermic temperature of an encapsulating compound.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8.Note 1
There is no equivalent IEC standard.
WITHDRAWN RATIONALE
This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.
Formerly under the jurisdiction of Committee D09 on Electrical and Electronic Insulating Materials, this test method was withdrawn in August 2009. This standard is being withdrawn without replacement due to its limited use by industry.
General Information
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Standards Content (Sample)
NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F542 − 07 AnAmerican National Standard
Standard Test Method for
Exothermic Temperature of Encapsulating Compounds for
1
Electronic and Microelectronic Encapsulation
ThisstandardisissuedunderthefixeddesignationF542;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope* 4. Summary of Test Method
1.1 This test method provides results that are related to the 4.1 Athermocoupleisusedtomeasurethehighesttempera-
maximum temperature reached in a specific volume by a ture at the geometric center of a volume of encapsulating
reacting liquid encapsulating compound, and the time from compound in order to characterize the heat generated by the
initial mixing to the time when this peak exothermic tempera- chemical exothermic reaction.
ture is reached.
5. Significance and Use
1.2 This test method provides a means to measure the peak
exothermic temperature of an encapsulating compound. 5.1 Heat generated by a reacting liquid encapsulating com-
pound has the potential to cause damage to heat-sensitive
1.3 This standard does not purport to address all of the
electronic components. Degradation of the encapsulating com-
safety concerns, if any, associated with its use. It is the
pound has the potential to also occur at high temperatures.
responsibility of the user of this standard to establish appro-
Proper selection of an encapsulating compound includes
priate safety and health practices and determine the applica-
knowledge of its exothermic temperature to preclude damage
bility of regulatory limitations prior to use. For specific hazard
to components.
statements see Section 8.
5.2 Since the exothermic temperature of a reacting encap-
NOTE 1—There is no equivalent IEC standard.
sulating compound varies with the volume and geometry of
2. Referenced Documents material, it is essential that the volume and geometry be
2 specified in any determination. Select the appropriate volume
2.1 ASTM Standards:
and geometry. The exothermic temperature is measured in
D1711Terminology Relating to Electrical Insulation
sufficiently precise and reproducible form to allow for appli-
D5423Specification for Forced-Convection Laboratory Ov-
cation evaluation, quality control, and encapsulating com-
ens for Evaluation of Electrical Insulation
pound characterization.
3. Terminology
5.3 Exothermictemperatureriseoftwodifferentvolumesof
3.1 Definitions: For definitions of terms used in this test the same material using the same geometry indicates the effect
of volume. Materials may be compared by testing equal
method, refer to Terminology D1711.
volumes of each material using the same geometry.
3.2 Definitions of Terms Specific to This Standard:
3.2.1 encapsulating compound, n—a resin system used to
6. Interferences
encase electronic components.
6.1 Under normal electronic system encapsulation, the heat
3.2.1.1 Discussion—These resins are generally used to pro-
sink of the components would reduce the maximum heat
vide protection from the operating environment and mechani-
generated in the encapsulating compound. Since the volume
cal damage.
andgeometryoftheelectronicsystem,plustheheatsinkofthe
components, affect the exothermic temperature of the encap-
1
This test method is under the jurisdiction of ASTM Committee D09 on
sulating compound, it is recommended that actual hardware be
Electrical and Electronic Insulating Materials and is the direct responsibility of
Subcommittee D09.01 on Electrical Insulating Varnishes, Powders and Encapsulat- tested in cases in which temperature-sensitive electronics are
ing Compounds.
utilized.
Current edition approved May 1, 2007. Published June 2007. Originally
approved in 1977. Last previous edition approved in 2002 as F542–02. DOI:
7. Apparatus
10.1520/F0542-07.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
7.1 Specimen Containers for specific test volumes, as fol-
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
lows:
Standards volume information, refer to the standard’s Document Summary page on
the ASTM website. 7.1.1 For 50-mL test, borosilicate glass beaker, Griffin,
*A Summary of Changes section appears at the end of this standard
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
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F542 − 07
7.1.2 For 125-mL test, “No. 202×204” standard canning 11. Procedure
industry 130 mL can, 54.0 mm in diameter by 57.1 mm in
11.1 Select one or more volumes suitable to the end use.
height,
Test three specimens for each volume selected.
7.1.3 For 150-mL test, borosilicat
...
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