ASTM F542-98

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

SCOPE
1.1 This test method covers a means for measuring the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.  
1.2 This test method measures the potential heat output of an encapsulating compound under conditions that provide no significant heat sink.  
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 6.

General Information

• Status: Historical
• Publication Date: 09-Oct-1998
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: D09 - Electrical and Electronic Insulating Materials
• Drafting Committee: D09.01 - Electrical Insulating Products

Relations

• Replaced By: ASTM F542-02 - Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
• Effective Date: 10-Sep-2002

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or
withdrawn. Contact ASTM International (www.astm.org) for the latest information.
Designation: F 542 – 98 An American National Standard
AMERICAN SOCIETY FOR TESTING AND MATERIALS
100 Barr Harbor Dr., West Conshohocken, PA 19428
Reprinted from the Annual Book of ASTM Standards. Copyright ASTM
Standard Test Method for
Exothermic Temperature of Encapsulating Compounds for
1
Electronic and Microelectronic Encapsulation
This standard is issued under the fixed designation F 542; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope 5. Significance and Use
1.1 This test method provides results that are related to the 5.1 Heat generated by a reacting liquid encapsulating com-
maximum temperature reached in a specific volume by a pound may cause damage to heat-sensitive electronic compo-
reacting liquid encapsulating compound, and the time from nents. Degradation of the encapsulating compound may also
initial mixing to the time when this peak exothermic tempera- occur at high temperatures. Proper selection of an encapsulate
ture is reached. must include knowledge of its exothermic temperature to
1.2 This test method provides a means to measure the peak preclude damage to components.
exothermic temperature of an encapsulating compound. 5.2 Since the exothermic temperature of a reacting encap-
1.3 This standard does not purport to address all of the sulating compound varies with the volume and geometry of
safety concerns, if any, associated with its use. It is the material, it is essential that the volume and geometry be
responsibility of the user of this standard to establish appro- specified in any determination. By selection of an appropriate
priate safety and health practices and determine the applica- volume and geometry, the exothermic temperature may be
bility of regulatory limitations prior to use. For specific hazard measured in sufficiently precise and reproducible form for
statements see Section 8. application evaluation, quality control, and encapsulating com-
pound characterization.
2. Referenced Documents
5.3 Materials may be compared by testing equal volumes of
2.1 ASTM Standards:
each material using the same geometry. Two different volumes
2
D 1711 Terminology Relating to Electrical Insulation of the same material in similar geometries may be tested to
D 5423 Specification for Forced-Convection Laboratory
determine the effect of volume on the exothermic temperature.
3
Ovens for Evaluation of Electrical Insulation
6. Interferences
3. Terminology
6.1 Under normal electronic system encapsulation, the heat
3.1 Definitions: For definitions of terms used in this test sink of the components would reduce the maximum heat
method, refer to Terminology D 1711.
generated in the encapsulating compound. Since the volume
3.2 Definition of Term Specific to This Standard: and geometry of the electronic system, plus the heat sink of the
3.2.1 encapsulating compound, n—a resin system used to
components, affect the exothermic temperature of the encap-
encase electronic components.
sulating compound, it is recommended that actual hardware be
3.2.1.1 Discussion—These resins are generally used to pro- tested in cases in which temperature-sensitive electronics are
vide protection from the operating environment and mechani-
utilized.
cal damage.
7. Apparatus
4. Summary of Test Method
7.1 Specimen Containers for specific test volumes, as fol-
4.1 A thermocouple is used to measure the highest tempera- lows:
ture at the geometric center of a volume of encapsulating
7.1.1 For 50-mL test, borosilicate glass beaker, Griffin,
compound in order to characterize the heat generated by the 7.1.2 For 125-mL test, “No. 202 3 204” standard canning
chemical exothermic reaction.
industry 130 mL can, 54.0 mm in diameter by 57.1 mm in
height,
1 7.1.3 For 150-mL test, borosilicate glass beaker, Griffin,
This test method is under the jurisdiction of ASTM Committee D-9 on
low-form,
Electrical and Electronic Insulating Materials, and is the direct responsibility of
Subcommittee D 09.01 on Electrical Insulating Varnishes, Powders, and Encapsu-
7.1.4 For 200-mL test, “No. 202 3 314” standard canning
lating Compounds.
industry 225 mL can, 54.0 mm in diameter by 98.4 mm in
Current edition approved Oct. 10, 1998. Published March 1999. Originally
height, or
published as F 542 – 77 T. Last previous edition F 542 – 97.
2
Annual Book of ASTM Standards, Vol 10.01. 7.1.5 For 300-mL test, “No. 211 3 400” standard canning
3
Annual Book of ASTM Standards, Vol 10.02.
1

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NOTICE:¬This¬standard¬has¬either¬been¬superseded¬and¬replaced¬by¬a¬new¬version¬or
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