ASTM E2627-13
(Practice)Standard Practice for Determining Average Grain Size Using Electron Backscatter Diffraction (EBSD) in Fully Recrystallized Polycrystalline Materials
Standard Practice for Determining Average Grain Size Using Electron Backscatter Diffraction (EBSD) in Fully Recrystallized Polycrystalline Materials
SIGNIFICANCE AND USE
5.1 This practice provides a way to estimate the average grain size of polycrystalline materials. It is based on EBSD measurements of crystallographic orientation which are inherently quantitative in nature. This method has specific advantage over traditional optical grain size measurements in some materials, where it is difficult to find appropriate metallographic preparation procedures to adequately delineate grain boundaries.
SCOPE
1.1 This practice is used to determine grain size from measurements of grain areas from automated electron backscatter diffraction (EBSD) scans of polycrystalline materials.
1.2 The intent of this practice is to standardize operation of an automated EBSD instrument to measure ASTM G directly from crystal orientation. The guidelines and caveats of E112 apply here, but the focus of this standard is on EBSD practice.
1.3 This practice is only applicable to fully recrystallized materials.
1.4 This practice is applicable to any crystalline material which produces EBSD patterns of sufficient quality that a high percentage of the patterns can be reliably indexed using automated indexing software.
1.5 The practice is applicable to any type of grain structure or grain size distribution.
1.6 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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Designation: E2627 − 13
Standard Practice for
Determining Average Grain Size Using Electron Backscatter
Diffraction (EBSD) in Fully Recrystallized Polycrystalline
1
Materials
This standard is issued under the fixed designation E2627; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope E177 Practice for Use of the Terms Precision and Bias in
ASTM Test Methods
1.1 This practice is used to determine grain size from
E691 Practice for Conducting an Interlaboratory Study to
measurements of grain areas from automated electron back-
Determine the Precision of a Test Method
scatter diffraction (EBSD) scans of polycrystalline materials.
E766 Practice for Calibrating the Magnification of a Scan-
1.2 The intent of this practice is to standardize operation of
ning Electron Microscope
an automated EBSD instrument to measure ASTM G directly
E1181 Test Methods for Characterizing Duplex Grain Sizes
from crystal orientation. The guidelines and caveats of E112
E1382 Test Methods for Determining Average Grain Size
apply here, but the focus of this standard is on EBSD practice.
Using Semiautomatic and Automatic Image Analysis
1.3 This practice is only applicable to fully recrystallized
materials.
3. Terminology
1.4 This practice is applicable to any crystalline material
3.1 Definitions:
which produces EBSD patterns of sufficient quality that a high
3.1.1 cleanup—Post processing applied to EBSD scan data
percentage of the patterns can be reliably indexed using
to reassign extraneous points in the scan grid to neighboring
automated indexing software.
points. The extraneous points are assumed to arise from
non-indexed or misindexed EBSD patterns.
1.5 The practice is applicable to any type of grain structure
or grain size distribution.
3.1.2 (crystallographic) orientation—The rotation required
1.6 The values stated in SI units are to be regarded as tobringtheprincipleaxesofacrystalintocoincidencewiththe
standard. No other units of measurement are included in this principle axes assigned to a specimen. For example, in a rolled
standard.
material with cubic crystal symmetry, it is the set of rotations
required to bring the [100], [010] and [001] axes of the crystal
1.7 This standard does not purport to address all of the
into coincidence with the rolling, transverse and normal
safety concerns, if any, associated with its use. It is the
directions of the specimen. Orientations may be described in
responsibility of the user of this standard to establish appro-
terms of various sets of angles, a matrix of direction cosines or
priate safety and health practices and determine the applica-
a rotation vector.
bility of regulatory limitations prior to use.
3.1.3 electron backscatter diffraction (EBSD).—A crystal-
2. Referenced Documents
line specimen is placed in a scanning electron microscope
2
(SEM) at a high tilt angle (~70°). When a stationary electron
2.1 ASTM Standards:
beam is positioned on a grain, the electrons are scattered in a
E7 Terminology Relating to Metallography
small volume (typically 30nm in the tilt direction, 10nm in the
E112 Test Methods for Determining Average Grain Size
transversedirectionand20nmindepthforafieldemissiongun
SEM and approximately an order of magnitude larger in the
1
This practice is under the jurisdiction of ASTM Committee E04 on Metallog-
lateral directions for a tungsten filament SEM). Electrons that
raphy and is the direct responsibility of Subcommittee E04.11 on X-Ray and
satisfyBragg’slawarediffractedbackoutofthespecimen.The
Electron Metallography.
diffracted electrons strike a phosphor screen (or alternatively a
Current edition approved Nov. 1, 2013. Published December 2013. Originally
YAG crystal) placed in the chamber. The colliding electrons
approved in 2010. Last previous edition approved in 2010 as E2627–10. DOI:
10.1520/E2627–13.
fluoresce the phosphor and produce a pattern. The pattern is
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
composed of a set of intersecting bands (Kikuchi lines). These
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
bands are indicative of the arrangement of crystal lattice planes
Standards volume information, refer to the standard’s Document Summary page on
the ASTM website. in the diffracting crystal volume. Assuming the material is of
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1
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E2627 − 13
knowncrystalstructure,theorientationofthecrystalwithinthe electrons such as a ph
...
This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation: E2627 − 10 E2627 − 13
Standard Practice for
Determining Average Grain Size Using Electron Backscatter
Diffraction (EBSD) in Fully Recrystallized Polycrystalline
1
Materials
This standard is issued under the fixed designation E2627; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope
1.1 This practice is used to determine grain size from measurements of grain areas from automated electron backscatter
diffraction (EBSD) scans of polycrystalline materials.
1.2 The intent of this practice is to standardize operation of an automated EBSD instrument to measure ASTM G directly from
crystal orientation. The guidelines and caveats of E112 apply here, but the focus of this standard is on EBSD practice.
1.3 This practice is only applicable to fully recrystallized materials.
1.4 This practice is applicable to any crystalline material which produces EBSD patterns of sufficient quality that a high
percentage of the patterns can be reliably indexed using automated indexing software.
1.5 The practice is applicable to any type of grain structure or grain size distribution.
1.6 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.7 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical
conversions to SI units that are provided for information only and are not considered standard.This standard does not purport to
address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish
appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents
2
2.1 ASTM Standards:
E7 Terminology Relating to Metallography
E112 Test Methods for Determining Average Grain Size
E177 Practice for Use of the Terms Precision and Bias in ASTM Test Methods
E691 Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
E766 Practice for Calibrating the Magnification of a Scanning Electron Microscope
E1181 Test Methods for Characterizing Duplex Grain Sizes
E1382 Test Methods for Determining Average Grain Size Using Semiautomatic and Automatic Image Analysis
3. Terminology
3.1 Definitions:
3.1.1 cleanup—Post processing applied to EBSD scan data to reassign extraneous points in the scan grid to neighboring points.
The extraneous points are assumed to arise from non-indexed or misindexed EBSD patterns.
3.1.2 (crystallographic) orientation—The rotation required to bring the principle axes of a crystal into coincidence with the
principle axes assigned to a specimen. For example, in a rolled material with cubic crystal symmetry, it is the set of rotations
required to bring the [100], [010] and [001] axes of the crystal into coincidence with the rolling, transverse and normal directions
of the specimen. Orientations may be described in terms of various sets of angles, a matrix of direction cosines or a rotation vector.
1
This practice is under the jurisdiction of ASTM Committee E04 on Metallography and is the direct responsibility of Subcommittee E04.11 on X-Ray and Electron
Metallography.
Current edition approved April 1, 2010Nov. 1, 2013. Published May 2010December 2013. DOI10.1520/E2627.Originally approved in 2010. Last previous edition approved
in 2010 as E2627–10. DOI: 10.1520/E2627–13.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1
---------------------- Page: 1 ----------------------
E2627 − 13
3.1.3 electron backscatter diffraction (EBSD).—A crystalline specimen is placed in a scanning electron microscope (SEM) at
a high tilt angle (~70°). When a stationary electron beam is positioned on a grain, the electrons are scattered in a small volume
(typically 30nm in the tilt direction, 10nm in the transverse direction and 20 nm in depth for a field emission gun SEM and
approximately an order of magnitude larger in the lateral directions for a
...
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