ASTM E2244-11

Standard Test Method for In-Plane Length Measurements of Thin, Reflecting Films Using an Optical Interferometer

SIGNIFICANCE AND USE
In-plane length measurements are used in calculations of parameters, such as residual strain and Young’modulus.
In-plane deflection measurements are required for specific test structures. Parameters, including residual strain, are calculated given these in-plane deflection measurements.
SCOPE
1.1 This test method covers a procedure for measuring in-plane lengths (including deflections) of patterned thin films. It applies only to films, such as found in microelectromechanical systems (MEMS) materials, which can be imaged using an optical interferometer.
1.2 There are other ways to determine in-plane lengths. Using the design dimensions typically provides more precise in-plane length values than using measurements taken with an optical interferometer. (Interferometric measurements are typically more precise than measurements taken with an optical microscope.) This test method is intended for use when interferometric measurements are preferred over using the design dimensions (for example, when measuring in-plane deflections and when measuring lengths in an unproven fabrication process).
1.3 This test method uses a non-contact optical interferometer with the capability of obtaining topographical 3-D data sets. It is performed in the laboratory.
1.4 The maximum in-plane length measured is determined by the maximum field of view of the interferometer at the lowest magnification. The minimum deflection measured is determined by the interferometers pixel-to-pixel spacing at the highest magnification.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

• Status: Historical
• Publication Date: 31-Oct-2011
• ICS: 37.040.20 - Photographic paper, films and plates. Cartridges
• Technical Committee: E08 - Fatigue and Fracture
• Drafting Committee: E08.05 - Cyclic Deformation and Fatigue Crack Formation

Relations

• Replaces: ASTM E2244-05 - Standard Test Method for In-Plane Length Measurements of Thin, Reflecting Films Using an Optical Interferometer
• Effective Date: 01-Nov-2011
• Replaced By: ASTM E2244-11e1 - Standard Test Method for In-Plane Length Measurements of Thin, Reflecting Films Using an Optical Interferometer
• Effective Date: 01-Nov-2011
• Referred By: ASTM E2246-11(2018) - Standard Test Method for Strain Gradient Measurements of Thin, Reflecting Films Using an Optical Interferometer (Withdrawn 2023)
• Effective Date: 01-Nov-2011
• Referred By: ASTM E2245-11(2018) - Standard Test Method for Residual Strain Measurements of Thin, Reflecting Films Using an Optical Interferometer (Withdrawn 2023)
• Effective Date: 01-Nov-2011
• Referred By: ASTM E2444-11(2018) - Standard Terminology Relating to Measurements Taken on Thin, Reflecting Films
• Effective Date: 01-Nov-2011

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation:E2244 −11
StandardTest Method for
In-Plane Length Measurements of Thin, Reflecting Films
1
Using an Optical Interferometer
This standard is issued under the fixed designation E2244; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 2. Referenced Documents
2
2.1 ASTM Standards:
1.1 This test method covers a procedure for measuring
E2245Test Method for Residual Strain Measurements of
in-plane lengths (including deflections) of patterned thin films.
Thin, Reflecting Films Using an Optical Interferometer
It applies only to films, such as found in microelectromechani-
E2246Test Method for Strain Gradient Measurements of
cal systems (MEMS) materials, which can be imaged using an
Thin, Reflecting Films Using an Optical Interferometer
optical interferometer, also called an interferometric micro-
E2444Terminology Relating to Measurements Taken on
scope.
Thin, Reflecting Films
1.2 There are other ways to determine in-plane lengths.
E2530Practice for Calibrating the Z-Magnification of an
Using the design dimensions typically provides more precise
Atomic Force Microscope at Subnanometer Displacement
in-plane length values than using measurements taken with an
Levels Using Si(111) Monatomic Steps
optical interferometric microscope. (Interferometric measure- 3
2.2 SEMI Standard:
mentsaretypicallymoreprecisethanmeasurementstakenwith
MS2Test Method for Step Height Measurements of Thin
an optical microscope.) This test method is intended for use
Films
when interferometric measurements are preferred over using
3. Terminology
the design dimensions (for example, when measuring in-plane
deflections and when measuring lengths in an unproven fabri-
3.1 Definitions:
cation process).
3.1.1 The following terms can be found in Terminology
E2444.
1.3 This test method uses a non-contact optical interfero-
3.1.2 2-D data trace, n—a two-dimensional group of points
metricmicroscopewiththecapabilityofobtainingtopographi-
that is extracted from a topographical 3-D data set and that is
cal 3-D data sets. It is performed in the laboratory.
parallel to the xz-or yz-plane of the interferometric micro-
1.4 The maximum in-plane length measured is determined
scope.
by the maximum field of view of the interferometric micro-
3.1.3 3-D data set, n—a three-dimensional group of points
scope at the lowest magnification. The minimum deflection
with a topographical z-value for each (x, y) pixel location
measured is determined by the interferometric microscope’s
within the interferometric microscope’s field of view.
pixel-to-pixel spacing at the highest magnification.
3.1.4 anchor, n—in a surface-micromachining process, the
1.5 This standard does not purport to address all of the
portion of the test structure where a structural layer is inten-
safety concerns, if any, associated with its use. It is the
tionally attached to its underlying layer.
responsibility of the user of this standard to establish appro-
3.1.5 anchor lip, n—in a surface-micromachining process,
priate safety and health practices and determine the applica-
the freestanding extension of the structural layer of interest
bility of regulatory limitations prior to use.
around the edges of the anchor to its underlying layer.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
1
This test method is under the jurisdiction ofASTM Committee E08 on Fatigue contact ASTM Customer Service at [e-mail]. For Annual Book of ASTM
and Fracture and is the direct responsibility of Subcommittee E08.05 on Cyclic Standards volume information, refer to the standard’s Document Summary page on
Deformation and Fatigue Crack Formation. the ASTM website.
3
Current edition approved Nov. 1, 2011. Published December 2011. Originally For referenced Semiconductor Equipment and Materials International (SEMI)
approved in 2002. Last previous edition approved in 2005 as E2244–05. standards, visit the SEMI website, www.semi.org.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1

---------------------- Page: 1 ----------------------
E2244−11
3.1.5.1 Discussion—In some processes, the width of the σ =the standard deviation in a ruler measurement in the
ycal
anchor lip may be zero. interferometric microscope’s y-direction for the given combi-
nation of lenses
3.1.6 bulk micromachining, adj—a MEMS fabrication pro-
cal =the x-calibration factor of the interferometric micro-
cess where the substrate is removed at specified locations.
x
scope for the given combination of lenses
3.1.7 cantilever, n—a test structure that consists
...

This document is not anASTM standard and is intended only to provide the user of anASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation:E2244–05 Designation: E2244 – 11
Standard Test Method for
In-Plane Length Measurements of Thin, Reflecting Films
1
Using an Optical Interferometer
This standard is issued under the fixed designation E2244; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope
1.1 Thistestmethodcoversaprocedureformeasuringin-planelengths(includingdeflections)ofpatternedthinfilms.Itapplies
only to films, such as found in microelectromechanical systems (MEMS) materials, which can be imaged using an optical
interferometer, also called an interferometric microscope.
1.2 There are other ways to determine in-plane lengths. Using the design dimensions typically provides more precise in-plane
length values than using measurements taken with an optical interferometeric microscope. (Interferometric measurements are
typically more precise than measurements taken with an optical microscope.) This test method is intended for use when
interferometric measurements are preferred over using the design dimensions (for example, when measuring in-plane deflections
and when measuring lengths in an unproven fabrication process).
1.3 This test method uses a non-contact optical interferometeric microscope with the capability of obtaining topographical 3-D
data sets. It is performed in the laboratory.
1.4 The maximum in-plane length measured is determined by the maximum field of view of the interferometeric microscope
at the lowest magnification. The minimum deflection measured is determined by the interferometeric microscope’s pixel-to-pixel
spacing at the highest magnification.
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility
of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory
limitations prior to use.
2. Referenced Documents
2
2.1 ASTM Standards:
E2245 Test Method for Residual Strain Measurements of Thin, Reflecting Films Using an Optical Interferometer
E2246 Test Method for Strain Gradient Measurements of Thin, Reflecting Films Using an Optical Interferometer Test Method
for Strain Gradient Measurements of Thin, Reflecting Films Using an Optical Interferometer
E2444 Terminology Relating to Measurements Taken on Thin, Reflecting Films
E2530 Practice for Calibrating the Z-Magnification of an Atomic Force Microscope at Subnanometer Displacement Levels
Using Si(111) Monatomic Steps
3
2.2 SEMI Standard:
MS2 Test Method for Step Height Measurements of Thin Films
3. Terminology
3.1 Definitions:
3.1.1
3.1.1 The following terms can be found in Terminology E2444.
3.1.2 2-D data trace, n—a two-dimensional group of points that is extracted from a topographical 3-D data set and that is
parallel to the xz-or yz-plane of the interferometer.
3.1.2-plane of the interferometric microscope.
1
This test method is under the jurisdiction of ASTM Committee E08 on Fatigue and Fracture and is the direct responsibility of Subcommittee E08.05 on Cyclic
Deformation and Fatigue Crack Formation.
Current edition approved Nov. 1, 2005.2011. Published December 2005.2011. Originally approved in 2002. Last previous edition approved in 20022005 as E2244–02.
DOI: 10.1520/E2244-05.E2244–05.
2
ForreferencedASTMstandards,visittheASTMwebsite,www.astm.org,[e-mail] Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
3
The same apparatus is used as in Test Method E2245 and Test Method E2246.
3
For referenced Semiconductor Equipment and Materials International (SEMI) standards, visit the SEMI website, www.semi.org.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
1

---------------------- Page: 1 ----------------------
E2244 – 11
3.1.3 3-D data set, n—athree-dimensionalgroupofpointswithatopographical z-valueforeach(x, y)pixellocationwithinthe
interferometer’s field of view.
3.1.3x, y) pixel location within the interferometric microscope’s field of view.
3.1.4 anchor, n—in a surface-micromachining process, the portion of the test structure where a structural layer is intentionally
attached to its underlying layer.
3.1.4
3.1.5 anchor lip, n—in a surface-micromachining process, the free
...