ASTM F692-97(2002)

Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates (Withdrawn 2008)

SIGNIFICANCE AND USE
Failure of hybrid microcircuits is often due to failure of a solder bond. The limiting strength that can be obtained for a solder bond is often the adhesion of the soldered film to the substrate.
This test method can be used for material selection, process development, research in support of improved yield or reliability, and specification for material procurement.
It is not recommended that this test method be used in deciding questions between buyers and sellers until the precision of the method has been determined by interlaboratory comparison.
SCOPE
1.1 This test method covers the determination of the adhesion strength of films to substrates by pulling wires soldered to the films.  
1.2 This test method is intended to measure the adhesion of metallization to substrates, and not the strength of the solder.  
1.3 This test method applies to all films that can be soldered.  
1.4 The maximum melting point of solder used with this test method is determined by the characteristics of the solder flux.  
1.5 This test method is destructive.  
1.6  This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
WITHDRAWN RATIONALE
Formerly under the jurisdiction of Committee F01 on Electronics, this practice was withdrawn in June 2008 in accordance with section 10.5.3.1 of the Regulations Governing ASTM Technical Committees, which requires that standards shall be updated by the end of the eighth year since the last approval date.

General Information

• Status: Withdrawn
• Publication Date: 09-Dec-2002
• Withdrawal Date: 29-Jul-2008
• ICS: 25.160.50 - Brazing and soldering
• Technical Committee: F01 - Electronics
• Drafting Committee: F01.03 - Metallic Materials, Wire Bonding, and Flip Chip

Relations

• Replaces: ASTM F692-97 - Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates
• Effective Date: 10-Dec-2002

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation:F 692–97 (Reapproved 2002)
Standard Test Method for Measuring
Adhesion Strength of Solderable Films to Substrates
This standard is issued under the fixed designation F 692; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope force applied in order to cause separation is recorded. The
mode of failure is observed and recorded.
1.1 This test method covers the determination of the adhe-
3.2 Thesolderalloyusedisnotspecifiedbythetestmethod,
sion strength of films to substrates by pulling wires soldered to
and shall be agreed upon by the parties to the test.
the films.
3.3 The flux used is not specified by the test method, and
1.2 This test method is intended to measure the adhesion of
shall be agreed upon by the parties to the test.
metallization to substrates, and not the strength of the solder.
1.3 Thistestmethodappliestoallfilmsthatcanbesoldered.
4. Significance and Use
1.4 Themaximummeltingpointofsolderusedwiththistest
4.1 Failure of hybrid microcircuits is often due to failure of
method is determined by the characteristics of the solder flux.
a solder bond. The limiting strength that can be obtained for a
1.5 This test method is destructive.
solder bond is often the adhesion of the soldered film to the
1.6 This standard does not purport to address the safety
substrate.
concerns, if any, associated with its use. It is the responsibility
4.2 This test method can be used for material selection,
of whoever uses this standard to consult and establish appro-
process development, research in support of improved yield or
priate safety and health practices and determine the applica-
reliability, and specification for material procurement.
bility of regulatory limitations prior to use.
4.3 It is not recommended that this test method be used in
2. Terminology deciding questions between buyers and sellers until the preci-
sion of the method has been determined by interlaboratory
2.1 Definitions of Terms Specific to This Standard:
comparison.
2.1.1 solder failure—in microelectronics, a failure mode in
which the wire tears through the solder.
5. Interferences
2.1.2 solder interface failure—in microelectronics, a failure
5.1 Iftheanglebetweenthedirectionoftheliftingforceand
mode in which most of the solder is removed from the film and
the top surface of the substrate differs from a right angle by
no detectable amount of film is removed from the substrate.
more than 5°, the force measured may differ significantly from
3. Summary of Test Method that required to achieve operation with a perpendicular con-
figuration.
3.1 Test specimens, each consisting of a substrate upon
5.2 Visible irregularities in the motion of the lifting mecha-
which a pattern of square test films, are prepared using
nism may introduce extraneous forces and thus invalidate the
equipment, materials, and procedures typical of the process to
test.
be evaluated. Specimens are pre-tinned; wires are centered
5.3 The presence of vibration or mechanical shock may
over test pads and held in place with a fixture of low thermal
causetheapplicationofanextraneousforceandthusinvalidate
mass. Specimens and wires are then soldered using controlled
the test.
amounts of solder and flux and controlled heating followed by
5.4 Each specimen presents a thermal mass to the heating
a 24-h period for stress relaxation.Asoldered wire is bent at a
apparatus. Changes in substrate thickness will require a rede-
right angle from each substrate.The substrate is then restrained
termination of the time temperature profile.
andsupportedinanappropriatefixture,andthewireisattached
5.5 Changes in melting points when using different solder
to a lifting mechanism by a grip. The grip and substrate holder
alloys also require a redetermination of the time temperature
are moved apart until the wire is pulled off the substrate. The
profile.
6. Apparatus
This test method is under the jurisdiction of ASTM Committee F01 on
Electronics and is the direct responsibility of Subcommittee F01.03 on Metallic
6.1 Bond-Pulling Machine—Apparatus for measuring the
Materials.
adhesion pull strength, incorporating the following compo-
Current edition approved Dec. 10, 2002. Published May 2003. Originally
approved in 1980. Last previous edition approved in 1997 as F 692–97. nents:
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
F 692–97 (2002)
6.1.1 Gripping Means to attach the wire to the lifting 6.7 Calibration Masses—At least five masses (weights)
mechanism. with mass values known to within 0.5 %, sized to cover the
6.1.2 Lifting and Gaging Mechanism for applying a mea- anticipated range of adhesion pull forces, and suitably config-
sured vertical force to the gripping means with respect to the ured so that they may be supported by the lifting and gaging
substrate holder. The mechanism shall incorporate a means for mechanism for calibration.
recordingthemaximumforceappliedwithin0.5Nandshallbe 6.8 Substrate Processing Equipment, representative of the
capable of moving at a rate of at least 13 mm/min.
process to be evaluated.
6.1.3 Stereoscopic Microscope with Light Source having a
6.9 Timer, capable of indicating a time interval of 150 s to
magnification of approximately 203 with the eyepiece mag-
the nearest 0.2 s.
nification not to exceed 103, for viewing the device under test.
6.10 Thermocouple Pyrometer, with 6 2 % accuracy over
6.1.4 Substrate Holder Mechanism for restraining and sup-
the temperature range of the test.
porting the substrate under test in a horizontal position perpen-
6.11 Volumetric Pipet, capable of delivering a controlled
dicular to the axis along which the pull force is to be applied
volume of flux of 7 µL to within 0.5 µL.
(see Fig. 1).
6.2 Wire Bending Jig—Apparatus to produce uniform bend
7. Materials
geometries and to prevent lifting forces (see Fig. 2).
7.1 Wire—Annealed oxygen-free high conductivity copper,
6.3 Temperature-Controlled Solder Pot, capable of main-
0.8-mm diameter (No. 20 AWG).
taining a temperature of 30 6 2°C above the melting point of
7.2 Solder Preforms—Wires 0.8 mm in diameter by 6 mm
the solder used.
long bent to a U-shape in quantity, composition, and purity,
6.4 Low-Thermal-Mass Fixture—Apparatus to hold wires
appropriate to the process to be evaluated.
and test specimens in place during soldering. This fixture
7.3 Flux, representative to the system under test.
should be made as shown in Fig. 3.
7.4 Substrate Blanks, representative of the process to be
6.5 Adhesion Test Specimen Assembly Holder—Apparatus
evaluated.
to position low thermal mass fixture over heat source (see Fig.
7.5 Substrate Processing Materials, representative of the
4) during soldering.
process to be evaluated.
6.6 Temperature-Controlled Air Heater, capable of provid-
7.6 Flux Solvent, appropriate to the flux used.
ingheatedairupto400°Cabovethemeltingpointofthesolder
used, and controlling within 630°C as measured in air at 7.7 Gold-Tin Solder, as required for calibration of solder
center of diffusion screen (see Fig. 5). cycle.
NOTE 1—Left-hand hold down is shown; right-hand hold down is mirror image.
NOTE 2—Low-grip-specimen hold down in millimetres.
FIG. 1 Substrate Assembly Positioned in Holder Prior to Pulling
F 692–97 (2002)
FIG. 2 Wire-Bending Fixture
FIG. 3 Low-Thermal-Mass Fixture
8. Sampling 10.2 Calibrate the bond-pulling machine at the beginning of
eachseriesoftests,ordailyifaseriesspansmorethanoneday.
8.1 The number of specimens shall be agreed upon between
the parties to the test. If sampling by
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