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ASTM E1161-95

(Test Method)

Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components

Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components

SCOPE
1.1 This test method provides a standard procedure for nondestructive radiographic examination of semiconductor devices, electronic components, and the materials used for construction of these items. This test method covers the radiographic testing of these items for possible defective conditions such as extraneous material within the sealed case, improper internal connections, voids in materials used for element mounting, or the sealing glass, or physical damage.  
1.2 The quality level and acceptance criteria for the specimens being tested shall be specified in the detail drawing, purchase order or contract.  
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

Status
Historical
Publication Date
31-Dec-1994
ICS
31.080.01 - Semiconductor devices in general
Technical Committee
E07 - Nondestructive Testing
Drafting Committee
E07.01 - Radiology (X and Gamma) Method
Current Stage
Ref Project

Relations

Replaced By
ASTM E1161-03 - Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components
Effective Date
10-Jun-2003
Referred By
ASTM E2033-17 - Standard Practice for Radiographic Examination Using Computed Radiography (Photostimulable Luminescence Method)
Effective Date
01-Jan-1995
Referred By
ASTM E431-96(2022) - Standard Guide to Interpretation of Radiographs of Semiconductors and Related Devices
Effective Date
01-Jan-1995

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ASTM E1161-95 - Standard Test Method for Radiologic Examination of Semiconductors and Electronic ComponentsASTM E1161-95 - Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components
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ASTM E1161-95 - Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components
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NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
Designation: E 1161 – 95
Standard Test Method for
Radiologic Examination of Semiconductors and Electronic
Components
This standard is issued under the fixed designation E 1161; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope 3. Terminology
1.1 This test method provides a standard procedure for 3.1 Definitions—For definitions of terms used in this test
nondestructive radiographic examination of semiconductor method, see Terminology E 1316.
devices, electronic components, and the materials used for
4. Significance and Use
construction of these items. This test method covers the
4.1 This test method is useful for determination of voiding
radiographic testing of these items for possible defective
conditions such as extraneous material within the sealed case, in semiconductor element to header mounting material, glass
seal, and lid seal areas. It is also useful for examination of the
improper internal connections, voids in materials used for
element mounting, or the sealing glass, or physical damage. internal cavities of devices for extraneous material, wire dress,
and bond placement for unattached elements.
1.2 The quality level and acceptance criteria for the speci-
mens being tested shall be specified in the detail drawing,
5. Apparatus
purchase order or contract.
5.1 Radiation Source—Only x-radiation generating equip-
1.3 This standard does not purport to address all of the
ment shall be used. It shall provide the proper quality level and
safety concerns, if any, associated with its use. It is the
film density when used in accordance with this test method.
responsibility of the user of this standard to establish appro-
5.1.1 Focal Spot—The focal spot size shall be such that the
priate safety and health practices and determine the applica-
resolution specified in 8.4 can be achieved.
bility of regulatory limitations prior to use.
5.2 Radiographic Viewer, capable of resolving a flaw of
2. Referenced Documents
0.025 mm at a density of 1.0 to 2.0.
2.1 ASTM Standards: 5.3 Holding Fixtures, capable of holding specimens in the
required positions without interfering with the accuracy or ease
E 94 Guide for Radiographic Testing
E 431 Guide to Interpretation of Radiographs of Semicon- of interpretation.
5.4 Lead-Topped Tables—Perform all semiconductor and
ductors and Related Devices
E 801 Practice for Controlling Quality of Radiographic electronic component radiographic testing on a lead-topped
table. The lead shall be at least 1.5 mm thick.
Examination of Electronic Devices
5.5 Film Holders—Film holders and cassettes shall be light
E 1255 Practice for Radioscopy
E 1316 Terminology for Nondestructive Examinations tight. They may be flexible vinyl, plastic, or other durable
material.
2.2 ASNT Standard:
SNT-TC-1A Personnel Qualification and Certification 5.6 IQI’s, shall be in accordance with Practice E 801.
5.7 Density Measurement Apparatus—Use a densitometer
2.3 Federal Standard:
FED-STD-595 Color (Requirements for Individual Color capable of repeatable measurements within 0.02 density units
and step wedge comparison films.
Chits)
6. Materials
This test method is under the jurisdiction of ASTM Committee E-7 on 6.1 Films—Films used for radiographic testing of semicon-
Nondestructive Testing and is the direct responsibility of Subcommittee E07.01 on
ductors and electronic components must be very fine grain. The
Radiographic Practice and Penetrameters.
grain must be fine enough to permit resolution of discontinui-
Current edition approved Dec. 10, 1995. Published February 1996. Originally
ties that are 0.025 mm.
published as E 1161 – 87. Last previous edition E 1161 – 92.
Annual Book of ASTM Standards, Vol 03.03.
6.2 Non-Film Techniques, When Specified—The use of
Available from the American Society for Nondestructive Testing, 1711 Arlin-
non-film techniques is permitted if agreed upon between
gate Plaza, P.O. Box 28518, Columbus, OH 43228.
4 purchaser and supplier and the equipment is capable of
Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS. producing results of equal quality when compared with film
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
E1161–95
techniques, and all requirements of this test method are with, and shall meet the requirements of, Practice E 801. For
complied with, except those pertaining to the actual film. Types radioscopic images (where allowed) the additional require-
of permanent records using non-film techniques if required are, ments of Practice E 1255 shall be met.
for example, digital magnetic tape or disc, video tape, and
8.4 Film and Marking—Place the radiographic film in a film
photograph of video image.
holder on the lead-topped table. Identify the film using tech-
niques that print the following information, photographically,
7. Calibration
on the radiograph:
7.1 The step wedge comparison films used for densitometer
8.4.1 Marking:
calibration shall be currently calibrated with traceability to the
8.4.1.1 Device manufacturer’s name or code identification
National Institute of Standards and Technology.
number.
8.4.1.2 Device type or part number.
8. Procedure
8.4.1.3 Production lot number or date code or inspection lot
8.1 Select or adjust the X-ray exposure factors, voltage,
number.
milliampere setting, and time settings as necessary to obtain
8.4.1.4 Radiographic film view number and date.
satisfactory exposures and image detail within the sensitivity
requirements for the device or defect features the radiographic
8.4.1.5 Device serial or cross-refer
...

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4.1 This practice establishes the basic minimum parameters and controls for the application of radiographic examination of electronic devices. Factors such as device handling, equipment, ESDS, materials, personnel qualification, procedure and quality requirements, reporting, records and radiation sensitivity are addressed. This practice is written so it can be specified on the engineering drawing, specification, or contract. It is not a detailed how-to procedure and must be supplemented by a detailed examination technique/procedure (see 10.1).  
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5.1 This practice is important in characterizing the radiation hardness of electronic devices irradiated by neutrons. This characterization makes it feasible to predict some changes in operational properties of irradiated semiconductor devices or electronic systems. To facilitate uniformity of the interpretation and evaluation of results of irradiations by sources of different fluence spectra, it is convenient to reduce the incident neutron fluence from a source to a single parameter—an equivalent monoenergetic neutron fluence—applicable to a particular semiconductor material.  
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5.1 Semiconductor devices can be permanently damaged by neutrons (1, 2)6. The effect of such damage on the performance of an electronic component can be determined by measuring the component’s electrical characteristics before and after exposure to fast neutrons in the neutron fluence range of interest. The resulting data can be utilized in the design of electronic circuits that are tolerant of the degradation exhibited by that component.  
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5.1 Electronic circuits used in space, military, and nuclear power systems may be exposed to various levels of ionizing radiation. It is essential for the design and fabrication of such circuits that test methods be available that can determine the vulnerability or hardness (measure of nonvulnerability) of components to be used in such systems.  
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Note 3: The quality of the results produced by this standard are dependent on the competence of the personnel performing the procedure and the capability, calibration, and maintenance of the equipment used. Agencies that meet the criteria of Specification D3666 are generally considered capable of competent and objective testing, sampling, inspection, etc. Users of this standard are cautioned that compliance with Specification D3666 alone does not completely ensure reliable results. Reliable results depend on many factors; following the suggestions of Specification D3666 or some similar acceptable guideline provides a means of evaluating and controlling some of those factors.
SCOPE
1.1 This test method covers procedures for the determination of kinematic viscosity of liquid asphalts, road oils, and distillation residues of liquid asphalts all at 60 °C [140 °F] and of liquid asphalt binders at 135 °C [275 °F] (see table notes, 11.1) in the range from 6 to 100 000 mm2/s [cSt].  
1.2 Results of this test method can be used to calculate viscosity when the density of the test material at the test temperature is known or can be determined. See Annex A1 for the method of calculation.  
Note 1: This test method is suitable for use at other temperatures and at lower kinematic viscosities, but the precision is based on determinations on liquid asphalts and road oils at 60 °C [140 °F] and on asphalt binders at 135 °C [275 °F] only in the viscosity range from 30 to 6000 mm2/s [cSt].
Note 2: Modified asphalt binders or asphalt binders that have been conditioned or recovered are typically non-Newtonian under the conditions of this test. The viscosity determined from this method is under the assumption that asphalt binders behave as Newtonian fluids under the conditions of this test. When the flow is non-Newtonian in a capillary tube, the shear rate determined by this method may be invalid. The presence of non-Newtonian behavior for the test conditions can be verified by measuring the viscosity with viscometers having different-sized capillary tubes. The defined precision limits in 11.1 may not be applicable to non-Newtonian asphalt binders.  
1.3 Warning—Mercury has been designated by the United States Environmental Protection Agency (EPA) and many state agencies as a hazardous material that can cause central nervous system, kidney, and liver damage. Mercury, or its vapor, may be hazardous to health and corrosive to materials. Caution should be taken when handling mercury and mercury-containing products. See the applicable product Material Safety Data Sheet (MSDS) or Safety Data Sheet (SDS) for details and the EPA’s website—http://www.epa.gov/mercury/faq.htm—for additional information. Users should be aware that selling mercury, mercury-containing products, or both, in your state may be prohibited by state law.  
1.4 The values stated in either SI units or inch-pound units are to be regarded separately as standard. The values stated in each system may not be exact equivalents; therefore, each system shall be used independently of the other. Combining values from the two systems may result in nonconformance with the standard.  
1.5 The text of this standard references notes and footnotes that provide explanatory material. These notes and footnotes (excluding those in tables and figures) shall not be considered as requirements of the standard.  
1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior ...

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