Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-807: Prüfverfahren für Materialien für Verbindungsstrukturen – Zersetzungstemperatur (Td) unter der Nutzung von TGA

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-807: Méthodes d’essai des matériaux pour structures d’interconnexion - Température de décomposition (Td) par analyse thermogravimétrique

L'IEC 61189-2-807:2021 spécifie une méthode d'essai pour déterminer la température de décomposition (Td) des matériaux stratifiés de base par analyse thermogravimétrique (TGA, thermogravimetric analysis).

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-807. del: Preskusne metode za materiale, namenjene uporabi v povezovalnih strukturah - Temperatura razgradnje s termogravimetrično analizo

General Information

Status
Published
Publication Date
14-Oct-2021
Current Stage
6060 - Document made available - Publishing
Start Date
15-Oct-2021
Completion Date
15-Oct-2021

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SLOVENSKI STANDARD
SIST EN IEC 61189-2-807:2021
01-december-2021
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-807. del: Preskusne metode za materiale, namenjene
uporabi v povezovalnih strukturah - Temperatura razgradnje s termogravimetrično
analizo
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-807: Test methods for materials for interconnection structures -
Decomposition Temperature (Td) using TGA
Ta slovenski standard je istoveten z: EN IEC 61189-2-807:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61189-2-807:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61189-2-807:2021

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SIST EN IEC 61189-2-807:2021


EUROPEAN STANDARD EN IEC 61189-2-807

NORME EUROPÉENNE

EUROPÄISCHE NORM
October 2021
ICS 31.180

English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-807: Test
methods for materials for interconnection structures -
Decomposition temperature (Td) using TGA
(IEC 61189-2-807:2021)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-807: Méthodes d'essai des matériaux 807: Prüfverfahren für Materialien für
pour structures d'interconnexion - Température de Verbindungsstrukturen - Zersetzungstemperatur (T ) unter
d
décomposition (T ) par analyse thermogravimétrique der Nutzung von TGA
d
(IEC 61189-2-807:2021) (IEC 61189-2-807:2021)
This European Standard was approved by CENELEC on 2021-10-08. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61189-2-807:2021 E

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SIST EN IEC 61189-2-807:2021
EN IEC 61189-2-807:2021 (E)
European foreword
The text of document 91/1697/CDV, future edition 1 of IEC 61189-2-807, prepared by IEC/TC 91
“Electronics assembly technology” was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-807:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022–07–08
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024–10–08
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-807:2021 was approved by CENELEC as a
European Standard without any modification.
2

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SIST EN IEC 61189-2-807:2021
EN IEC 61189-2-807:2021 (E)
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
...

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