SIST EN IEC 61189-2-807:2021

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA

This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td)
of base laminate materials using thermogravimetric analysis (TGA).

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-807: Prüfverfahren für Materialien für Verbindungsstrukturen – Zersetzungstemperatur (Td) unter der Nutzung von TGA

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-807: Méthodes d’essai des matériaux pour structures d’interconnexion - Température de décomposition (Td) par analyse thermogravimétrique

L'IEC 61189-2-807:2021 spécifie une méthode d'essai pour déterminer la température de décomposition (T_d) des matériaux stratifiés de base par analyse thermogravimétrique (TGA, thermogravimetric analysis).

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-807. del: Preskusne metode za materiale, namenjene uporabi v povezovalnih strukturah - Temperatura razgradnje s termogravimetrično analizo

General Information

• Status: Published
• Publication Date: 15-Nov-2021
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 04-Nov-2021
• Due Date: 09-Jan-2022
• Completion Date: 16-Nov-2021
• Ref Project: EN IEC 61189-2-807:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T_d) using TGA

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 61189-2-807:2021
01-december-2021
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-807. del: Preskusne metode za materiale, namenjene
uporabi v povezovalnih strukturah - Temperatura razgradnje s termogravimetrično
analizo
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-807: Test methods for materials for interconnection structures -
Decomposition Temperature (Td) using TGA
Ta slovenski standard je istoveten z: EN IEC 61189-2-807:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61189-2-807:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61189-2-807:2021

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SIST EN IEC 61189-2-807:2021


EUROPEAN STANDARD EN IEC 61189-2-807

NORME EUROPÉENNE

EUROPÄISCHE NORM
October 2021
ICS 31.180

English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-807: Test
methods for materials for interconnection structures -
Decomposition temperature (Td) using TGA
(IEC 61189-2-807:2021)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-807: Méthodes d'essai des matériaux 807: Prüfverfahren für Materialien für
pour structures d'interconnexion - Température de Verbindungsstrukturen - Zersetzungstemperatur (T ) unter
d
décomposition (T ) par analyse thermogravimétrique der Nutzung von TGA
d
(IEC 61189-2-807:2021) (IEC 61189-2-807:2021)
This European Standard was approved by CENELEC on 2021-10-08. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61189-2-807:2021 E

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SIST EN IEC 61189-2-807:2021
EN IEC 61189-2-807:2021 (E)
European foreword
The text of document 91/1697/CDV, future edition 1 of IEC 61189-2-807, prepared by IEC/TC 91
“Electronics assembly technology” was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-807:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022–07–08
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024–10–08
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-807:2021 was approved by CENELEC as a
European Standard without any modification.
2

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SIST EN IEC 61189-2-807:2021
EN IEC 61189-2-807:2021 (E)
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
ISO 11358-1 - Plastics - Thermogravimetry (TG) of EN ISO 11358-1 -
polymers - Part 1: General principles


3

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SIST EN IEC 61189-2-807:2021



IEC 61189-2-807

®


Edition 1.0 2021-09




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE











Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 2-807: Test methods for materials for interconnection structures –

Decomposition temperature (T ) using TGA
d



Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres


structures d'interconnexion et ensembles –

Partie 2-807: Méthodes d’essai des matériaux pour structures

d’interconnexion – Température de décomposition (T ) par analyse

d

thermogravimétrique









INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.180 ISBN 978-2-8322-1019-8




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN IEC 61189-2-807:2021
– 2 – IEC 61189-2-807:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test specimens . 5
5 Test apparatus . 6
6 Test procedure . 6
7 Report . 7
Bibliography . 8

Figure 1 – Mass-temperature curve. 7

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SIST EN IEC 61189-2-807:2021
IEC 61189-2-807:2021 © IEC 2021 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-807: Test methods for materials for interconnection structures –
Decomposition temperature (T ) using TGA
d

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an
...