Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-807: Prüfverfahren für Materialien für Verbindungsstrukturen – Zersetzungstemperatur (Td) unter der Nutzung von TGA

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-807: Méthodes d’essai des matériaux pour structures d’interconnexion - Température de décomposition (Td) par analyse thermogravimétrique

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-807. del: Preskusne metode za materiale, namenjene uporabi v povezovalnih strukturah - Temperatura razgradnje s termogravimetrično analizo

General Information

Status
Published
Publication Date
15-Nov-2021
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
04-Nov-2021
Due Date
09-Jan-2022
Completion Date
16-Nov-2021

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SIST EN IEC 61189-2-807:2021
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SLOVENSKI STANDARD
SIST EN IEC 61189-2-807:2021
01-december-2021
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-807. del: Preskusne metode za materiale, namenjene
uporabi v povezovalnih strukturah - Temperatura razgradnje s termogravimetrično
analizo

Test methods for electrical materials, printed board and other interconnection structures

and assemblies - Part 2-807: Test methods for materials for interconnection structures -

Decomposition Temperature (Td) using TGA
Ta slovenski standard je istoveten z: EN IEC 61189-2-807:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61189-2-807:2021 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61189-2-807:2021
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SIST EN IEC 61189-2-807:2021
EUROPEAN STANDARD EN IEC 61189-2-807
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2021
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-807: Test
methods for materials for interconnection structures -
Decomposition temperature (Td) using TGA
(IEC 61189-2-807:2021)

Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und

imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-

ensembles - Partie 2-807: Méthodes d'essai des matériaux 807: Prüfverfahren für Materialien für

pour structures d'interconnexion - Température de Verbindungsstrukturen - Zersetzungstemperatur (T ) unter

décomposition (T ) par analyse thermogravimétrique der Nutzung von TGA
(IEC 61189-2-807:2021) (IEC 61189-2-807:2021)

This European Standard was approved by CENELEC on 2021-10-08. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 61189-2-807:2021 E
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SIST EN IEC 61189-2-807:2021
EN IEC 61189-2-807:2021 (E)
European foreword

The text of document 91/1697/CDV, future edition 1 of IEC 61189-2-807, prepared by IEC/TC 91

“Electronics assembly technology” was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN IEC 61189-2-807:2021.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2022–07–08

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2024–10–08

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Any feedback and questions on this document should be directed to the users’ national committee. A

complete listing of these bodies can be found on the CENELEC website.
Endorsement notice

The text of the International Standard IEC 61189-2-807:2021 was approved by CENELEC as a

European Standard without any modification.
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SIST EN IEC 61189-2-807:2021
EN IEC 61189-2-807:2021 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the

relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available

here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
ISO 11358-1 - Plastics - Thermogravimetry (TG) of EN ISO 11358-1 -
polymers - Part 1: General principles
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SIST EN IEC 61189-2-807:2021
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SIST EN IEC 61189-2-807:2021
IEC 61189-2-807
Edition 1.0 2021-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-807: Test methods for materials for interconnection structures –
Decomposition temperature (T ) using TGA
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-807: Méthodes d’essai des matériaux pour structures
d’interconnexion – Température de décomposition (T ) par analyse
thermogravimétrique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-1019-8

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN IEC 61189-2-807:2021
– 2 – IEC 61189-2-807:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope .............................................................................................................................. 5

2 Normative references ...................................................................................................... 5

3 Terms and definitions ...................................................................................................... 5

4 Test specimens ............................................................................................................... 5

5 Test apparatus ................................................................................................................ 6

6 Test procedure ................................................................................................................ 6

7 Report ............................................................................................................................. 7

Bibliography ............................................................................................................................ 8

Figure 1 – Mass-temperature curve......................................................................................... 7

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SIST EN IEC 61189-2-807:2021
IEC 61189-2-807:2021 © IEC 2021 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-807: Test methods for materials for interconnection structures –
Decomposition temperature (T ) using TGA
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an

...

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