EN 60749-21:2005

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 21: Brasabilité

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.

Polprevodniški elementi – Mehanske in klimatske preskusne metode – 21. del: Spajkljivost (IEC 60749-21:2004)

General Information

• Status: Withdrawn
• Publication Date: 14-Feb-2005
• Withdrawal Date: 31-Dec-2007
• ICS: 31.080 - Semiconductor devices
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 12-May-2014
• Completion Date: 12-May-2014
• Ref Project: SIST EN 60749-21:2005 - Semiconductor devices - Mechanical and climatic test methods -- Part 21: Solderability

Relations

• Replaced By: EN 60749-21:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 60749-21:2005

STANDARD
december 2005
Polprevodniški elementi – Mehanske in klimatske preskusne metode – 21.
del: Spajkljivost (IEC 60749-21:2004)
Semiconductor devices – Mechanical and climatic test methods – Part 21:
Solderability (IEC 60749-21:2004)
ICS 31.080.01 Referenčna številka
SIST EN 60749-21:2005(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60749-21
NORME EUROPÉENNE
EUROPÄISCHE NORM February 2005

ICS 31.080


English version


Semiconductor devices –
Mechanical and climatic test methods
Part 21: Solderability
(IEC 60749-21:2004)


Dispositifs à semiconducteurs – Halbleiterbauelemente –
Méthodes d'essais mécaniques et Mechanische und klimatische
climatiques Prüfverfahren
Partie 21: Brasabilité Teil 21: Lötbarkeit
(CEI 60749-21:2004) (IEC 60749-21:2004)





This European Standard was approved by CENELEC on 2004-12-07. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60749-21:2005 E

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EN 60749-21:2005 - 2 -
Foreword
The text of document 47/1741/FDIS, future edition 1 of IEC 60749-21, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-21 on 2004-12-07.
This mechanical and climatic test method, as it relates to solderability, is a complete rewrite of the test
contained in Subclause 2.1, Chapter 2 of EN 60749:1999.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-09-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-01-01
__________
Endorsement notice
The text of the International Standard IEC 60749-21:2004 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068 NOTE  Harmonized in the EN 60068 series (not modified).
IEC 60749 NOTE  Harmonized in the EN 60749 series (not modified).
IEC 60749-15 NOTE  Harmonized as EN 60749-15:2003 (not modified).
IEC 60749-20 NOTE  Harmonized as EN 60749-20:2003 (not modified).
__________

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NORME CEI
INTERNATIONALE
IEC



60749-21
INTERNATIONAL


Première édition
STANDARD

First edition

2004-03


Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques
et climatiques –
Partie 21:
Brasabilité

Semiconductor devices –
Mechanical and climatic test methods –
Part 21:
Solderability
 IEC 2005 Droits de reproduction réservés  Copyright - all rights reserved
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électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
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