31.080 - Semiconductor devices
ICS 31.080 Details
Semiconductor devices
Halbleiterbauelemente
Dispositifs a semi-conducteurs
Polprevodniški elementi
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IEC 60317-68:2017 specifies the requirements of enamelled rectangular aluminium winding wire of class 120 with a sole coating based on polyvinyl acetal resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The range of nominal conductor dimensions covered by this standard is
- width: min. 2,0 mm - max. 16,0 mm;
- thickness: min. 0,80 mm - max. 5,60 mm.
Wires of grade 1 and grade 2 are included in this part of IEC 60317 and apply to the complete range of conductors. The specified combinations of width and thickness as well as the specific ratio width/thickness are given in IEC 60317-0-9:2015.
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IEC 62047-48:2024 specifies the requirements and testing method to determine the solution concentration by optical absorption using MEMS fluidic device.
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IEC 63203-402-2:2024 specifies test methods for measuring and evaluating the performance, reliability, and accuracy of the step counting feature in any wearable device that can count steps (e.g. activity and fitness trackers, smart bands, smart shoes, and smart insoles).
These standard test methods exclude the evaluation of data associated with travel distance or calorie consumption.
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IEC 62047-43:2024 specifies the test method of electrical characteristics after cyclic bending deformation for flexible electromechanical devices. These devices include passive micro components and active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 μm to 1 mm, but these are not limiting values. The test method is so designed as to understand and further visualize the entire performance deterioration behaviour after cyclic bending deformation in a concept of 3D (P-S-N: Performance - Severity of bending - Number of cycles) plot over the loading space of severity of bending and number of repeated cycles. This document is essential to estimate safety margin over the operation period under a certain level of cyclic bending deformation and indispensable for reliable design of the product employing these devices.
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IEC 63203-402-3:2024 specifies terms, a measurement protocol, and a test to evaluate the accuracy of wearables that measure heart rate with a photoplethysmography (PPG) sensor. While this document can be used to measure a variety of different devices claiming to report heart rate, care will be taken when testing in countries that differentiate between heart rate and pulse rate. This measurement protocol is not intended to evaluate medical devices associated with the IEC 60601 series or ISO 80601 series.
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IEC 62047-44:2024 describes terminology, definitions and test methods that are used to evaluate and determine the dynamic performance of MEMS (Micro-Electromechanical Systems) resonant electric‑field‑sensitive devices. It also specifies sample requirements and test equipment for dynamic performances of MEMS resonant electric‑field‑sensitive devices. The statements made in this document are also applicable to MEMS resonant electric‑field‑sensitive devices with various driving mechanisms such as electrostatic, electrothermal, electromagnetic, piezoelectric, etc.
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This part of IEC 60749 provides a steady-state temperature and humidity bias life test to
evaluate the reliability of non-hermetic packaged semiconductor devices in humid
environments.
This test method is considered destructive.
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IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.
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IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition:
a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
c) replacement of references to “virtual junction” with “die”.
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This part of IEC 63287 gives guidelines for the development of reliability qualification plans
using the concept of mission profile, based on the environmental conditioning and proposed
usage of the product. This document is not intended for military- and space-related applications.
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This part of IEC 63287 gives guidelines for the development of reliability qualification plans using the concept of mission profile, based on the environmental conditioning and proposed usage of the product. This document is not intended for military- and space-related applications.
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IEC 63287-2:2023 gives guidelines for the development of reliability qualification plans using the concept of mission profile, based on the environmental conditioning and proposed usage of the product. This document is not intended for military- and space-related applications.
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IEC 60747-5-16:2023 specifies the measuring method of flat-band voltage of single GaN-based light emitting diode (LED) die or package without phosphor, based on the photocurrent (PC) spectroscopy. White LEDs for lighting applications are out of the scope of this part of IEC 60747.
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IEC 60747-18-4:2023(E) specifies the evaluation method for noise characteristics of lens-free CMOS photonic array sensors. This document includes the measurement setup, test procedure, test items, evaluation method, and test report for noise characteristics of lens-free CMOS photonic array sensors.
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IEC 60747-18-5:2023(E) specifies the evaluation method for light responsivity characteristics of lens-free CMOS photonic array sensor package modules by incident angle of light. This document includes the test setup, test procedure, test item, and test report for lens-free CMOS photonic array sensor package modules.
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This part of IEC 60700 specifies the service conditions, the definitions of essential ratings and characteristics of thyristor valves utilized in line commutated converters with three-phase bridge connections to realize the conversion from AC to DC and vice versa for high voltage direct current (HVDC) power transmission applications. It is applicable for air insulated, liquid cooled and indoor thyristor valves.
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This part of IEC 63364-1 provides terms, test method, and report of sound variation detection system based on IoT. It provides the evaluation method for each part of the sound variation detection system based on IoT in the block diagram, the characterization parameters, symbols, test setups and the conditions. In addition, this document defines the configuration items and criteria of standard space and firing situation for the quality evaluation measurement of sound field variation detection system with IoT.
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This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit attenuators.
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This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit limiters.
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This part of IEC 63364-1 provides terms, test method, and report of sound variation detection system based on IoT. It provides the evaluation method for each part of the sound variation detection system based on IoT in the block diagram, the characterization parameters, symbols, test setups and the conditions. In addition, this document defines the configuration items and criteria of standard space and firing situation for the quality evaluation measurement of sound field variation detection system with IoT.
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IEC 62951-8:2023 (E) defines terms and specifies the test method for evaluating the stretchability, flexibility, and stability of flexible resistive memory. The test method descriptions include experimental procedures and the equipment to be used. It also includes general requirements for test conditions such as the temperature and relative humidity of the testing environment. The test method described in this document focuses on stability evaluation rather than reliability.
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This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit limiters.
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This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit attenuators.
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This part of IEC 63203-801 specifies low complexity Medium Access Control (MAC) for SmartBAN.
As the use of wearables and connected body sensor devices grows rapidly in the Internet of Things (IoT), Wireless Body Area Networks (BAN) facilitate the sharing of data in smart environments such as smart homes, smart life etc. In specific areas of digital healthcare, wireless connectivity between the edge computing device or hub coordinator and the sensing nodes requires a standardized communication interface and protocols.
The present document describes the MAC specifications:
- Channel Structure,
- MAC Frame Formats,
- MAC functions.
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IEC 63203-402-1:2022 specifies test methods for wearable glove-type motion sensors to measure finger movements. The measurement methods include goniometric parameters related to the finger postures and flexion dynamics. Glove-type motion sensors are the type of gloves considered within the scope of this document for testing and measurement. This document describes direct and indirect measurement methods. In the direct measurement method, the angles of the joints of each finger are directly measured by a goniometer. The indirect method uses a measurement device such as a servomotor-based angle-measuring device. This document is applicable to angle measurement of all gloves with glove-type motion sensors without limitation of the device technology or size.
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This part of IEC 63203-801 specifies the ultra-low power physical layer (PHY) Smart BAN.
As the use of wearables and connected body sensor devices grows rapidly in the Internet of Things (IoT), Wireless Body Area Networks (BAN) facilitate the sharing of data in smart environments such as smart homes, smart life etc. In specific areas of digital healthcare, wireless connectivity between the edge computing device or hub coordinator and the sensing nodes requires a standardized communication interface and protocols.
The present document describes the Physical Layer (PHY) specifications:
- packet formats;
- modulation;
- forward error correction
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NEW!IEC 62031:2018 is available as IEC 62031:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62031:2018 specifies general and safety requirements for light-emitting diode (LED) modules: - non-integrated LED modules (LEDni modules) and semi-integrated LED modules (LEDsi modules) for operation under constant voltage, constant current or constant power; - Integrated LED modules (LEDi modules) for use on DC supplies up to 250 V or AC supplies up to 1 000 V at 50 Hz or 60 Hz. This second edition cancels and replaces the first edition published in 2008, Amendment 1:2012 and Amendment 2:2014. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a. the scope was clarified as well as the wording in several other clauses; b. the normative references were updated; c. the definitions for "replaceable LED module", "non-replaceable LED module" and "non-user replaceable LED module" were introduced while other definitions covered by IEC 62504 have been removed; d. the marking clause was restructured and a table added to provide an informative overview; e. the marking requirements for built-in LED modules were changed; f. the entry for the marking with the working voltage was revised; g. the provisions for terminals and heat management were revised; h. Annex B was deleted; i. information for luminaire design with regard to working voltage and water contact was introduced; j. an abnormal temperature test was introduced.
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IEC 62951-9:2022(E) specifies the test methods for evaluating the performance of unipolar-type one transistor one resistor (1T1R) resistive memory cells. The performance test methods in this document include read, forming, SET, RESET, endurance and retention. This document is applicable to flexible devices as well as rigid resistive memory devices without any limitations prone to device technology and size.
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IEC 63364-1:2022 specifies terms, the test method, and the report of sound variation detection system based on IoT. It provides the evaluation method for each part of the sound variation detection system based on IoT in the block diagram, the characterization parameters, symbols, test setups and the conditions. In addition, this document defines the configuration items and criteria of standard space and firing situation for the quality evaluation measurement of sound field variation detection system with IoT.
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This part of IEC 60749 provides a test method that is intended to evaluate and compare drop
performance of surface mount electronic components for handheld electronic product
applications in an accelerated test environment, where excessive flexure of a circuit board
causes product failure. The purpose is to standardize the test board and test methodology to
provide a reproducible assessment of the drop test performance of surface-mounted
components while producing the same failure modes normally observed during product level
test.
This document aims at prescribing a standardized test method and reporting procedure. This is
not a component qualification test and is not meant to replace any system level drop test that
is sometimes used to qualify a specific handheld electronic product. The standard is not meant
to cover the drop test required to simulate shipping and handling-related shock of electronic
components or PCB assemblies. These requirements are already addressed in test methods
such as IEC 60749-10. The method is applicable to both area array and perimeter-leaded
surface mounted packages.
This test method uses an accelerometer to measure the mechanical shock duration and
magnitude applied which is proportional to the stress on a given component mounted on a
standard board. The test method described in IEC 60749-40 uses strain gauge to measure the
strain and strain rate of a board in the vicinity of a component. The customer specification states
which test method is to be used.
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IEC 60747-16-7:2022 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit attenuators.
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IEC 60747-16-8:2022 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit limiters.
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IEC 60749-37:2022 is available as IEC 60749-37:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition: - correction of a previous technical error concerning test conditions; - updates to reflect improvements in technology.
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IEC 61975:2010 applies to system tests for high-voltage direct current (HVDC) installations which consist of a sending terminal and a receiving terminal, each connected to an a.c. system. The tests specified in this standard are based on bidirectional and bipolar high-voltage direct current (HVDC) installations which consist of a sending terminal and a receiving terminal, each connected to an a.c. system. The test requirements and acceptance criteria should be agreed for back-to-back installations, while multi-terminal systems and voltage sourced converters are not included in this standard. For monopolar HVDC installations, the standard applies except for bipolar tests. This standard only serves as a guideline to system tests for high-voltage direct current (HVDC) installations. The standard gives potential users guidance, regarding how to plan commissioning activities. The tests described in the guide may not be applicable to all projects, but represent a range of possible tests which should be considered. This edition cancels and replaces IEC/PAS 61975 published jointly in 2004 by IEC and CIGRÉ. It constitutes a technical revision incorporating engineering experience.
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IEC 60749-37:2022 is available as IEC 60749-37:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.
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IEC TR 63357:2022(E) describes standardization roadmap of fault test methods for integrated circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh environment such as very low or high temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment. There are several fault test methods and related issues to be standardized.
Semiconductor devices used in automotive vehicles are exposed in harsh environment of very high or very low temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment Evaluation results following this fault test methods will provide robustness of the semiconductor device.
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IEC 62007-1:2015 is a specification template for essential ratings and characteristics of the following categories of semiconductor optoelectronic devices to be used in the field of fibre optic systems and subsystems:
- semiconductor photoemitters;
- semiconductor photoelectric detectors;
- monolithic or hybrid integrated optoelectronic devices and their modules. This part of IEC 62007 provides a frame for the preparation of detail specifications for the essential ratings and characteristics. In using this part of IEC 62007, detail specification writers add but do not delete specification parameters and/or groups of specification parameters for particular applications. This third edition cancels and replaces the second edition published in 2008. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition. The definitions of some symbols and terms are revised in order to harmonize them with those in other SC 86C documents; A clause on APD-TIA has been added. Keywords: semiconductor optoelectronic devices, semiconductor photoemitters, semiconductor photoelectric detectors, monolithic or hybrid integrated optoelectronic devices
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IEC 62047-42:2022 specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film on microcantilever, which is typical structure of actual micro sensors and micro actuators. In order to obtain actual and precise piezoelectric coefficient of the piezoelectric thin films with microdevice structures, and this document reports the schema to determine the characteristic parameters for consumer, industry or any other applications of piezoelectric devices. This document applies to piezoelectric thin films on microcantilever fabricated by MEMS process.
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IEC 6074716-6:2019 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.
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IEC 63068-4:2022(E) provides a procedure for identifying and evaluating defects in as-grown 4H-SiC (Silicon Carbide) homoepitaxial wafer by systematically combining two test methods of optical inspection and photoluminescence (PL). Additionally, this document exemplifies optical inspection and PL images to enable the detection and categorization of defects in SiC homoepitaxial wafers.
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This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed
wiring boards for use in electrical equipment. The method is intended to determine the
compatibility of devices and subassemblies to withstand moderately severe shocks. The use of
subassemblies is a means to test devices in usage conditions as assembled to printed wiring
boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced
by handling, transportation or field operation can disturb operating characteristics, particularly
if the shock pulses are repetitive. This is a destructive test intended for device qualification
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IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:
covers both unattached components and components attached to printed wiring boards;
tolerance limits modified for peak acceleration and pulse duration;
mathematical formulae added for velocity change and equivalent drop height.
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IEC 60749-18:2019 is available as IEC 60749-18:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-18:2019 provides a test procedure for defining requirements for testing packaged semiconductor integrated circuits and discrete semiconductor devices for ionizing radiation (total dose) effects from a cobalt-60 (60Co) gamma ray source. Other suitable radiation sources can be used. This document addresses only steady-state irradiations, and is not applicable to pulse type irradiations. It is intended for military- and aerospace-related applications. It is a destructive test. This edition includes the following significant technical changes with respect to the previous edition: - updates to subclauses to better align the test method with MIL-STD 883J, method 1019, including the use of enhanced low dose rate sensitivity (ELDRS) testing; - addition of a Bibliography, which includes ASTM standards relevant to this test method.
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